Abstract: A heating apparatus including a rotating stage, a plurality of wafer carriers, a plurality of first heaters, and at least one second heater is provided. The plurality of wafer carriers is disposed on the rotating stage. The rotating stage drives the wafer carriers to rotate around a rotating axis of the rotating stage. The plurality of first heaters is disposed under a first heating region, each have a first width Wa. There is a first spacing Sa between any two adjacent first heaters. The at least one second heater is disposed under a second heating region, and has a second width Wb. There is a smallest spacing Sab between the at least one second heater and the first heating region, and Wa, Wb, Sa and Sab satisfy the equation: Wa/(Wa+Sa) ? Wb/(Wb+Sab). Each wafer carrier overlaps the first heating region in the axial direction of the rotating axis.

Abstract: A chip package includes a first die, a second die, a molding material, and a redistribution layer. The first die includes a first conductive pad. The second die is disposed on the first die and includes a second conductive pad. The molding material covers the first die and the second die. The molding material includes a top portion, a bottom portion, and an inclined portion adjoins the top portion and the bottom portion. The top portion is located on the second die, and the bottom portion is located on the first die. The redistribution layer is disposed along the top portion, the inclined portion, and the bottom portion. The redistribution layer is electrically connected to the first conductive pad and the second conductive pad.

Abstract: A method includes fabricating a first transistor and a second transistor on a substrate and fabricating a first conducting line and a second conducting line in a first metal layer. The method also includes connecting a gate of the first transistor to the first conducting line and connecting a gate of the second transistor to the second conducting line. The first conducting line and the second conducting line are parallel and adjacent to each other in the first metal layer above the first transistor and the second transistor. The method still includes connecting a source and a drain of the first transistor to a third conducting line.

Abstract: Aspects of the disclosure provide methods and apparatuses. The method can include receiving, at a user equipment (UE), system information broadcast from one or more base stations which may be shared by one or more PLMNs and/or one or more SNPNs, the system information including an indication of whether accessing an SNPN using home service provider (HSP) subscription of a HSP network is supported. The UE can be configured with subscription information of the HSP network. The subscription information can include the HSP subscription and a selection list that includes one or more candidate networks each represented by an SNPN identifier. The method can further include responsive to the system information, selecting a network from the selection list according to a priority order of the candidate networks, and accessing the network selected from the selection list using the HSP subscription.

Abstract: A method of manufacturing a gas permeable metal is provided. First a plurality of metal powder particles is spread out tightly to form a first deposited layer and a second deposited layer is formed over the first deposited layer. Then scan the first and the second deposited layers along a plurality of parallel and spaced linear paths. A gap is formed by a difference between a width of melt pool and a linear distance between the two adjacent linear paths. The linear paths of the first and the second deposited layers are arranged with an angle therebetween. The gaps of the first and the second deposited layers are crossed over to form pores distributed like a grid graph. A plurality of the first and the second deposited layers are stacked and the pores are aligned to form continuous pore channels. Thereby the metal with good venting is produced conveniently.

Abstract: A data storage system and a global deduplication method thereof are provided. The data storage system includes multiple storage devices and one dispatch device. The dispatch device divides an original data corresponding to a data writing request into at least one data chunk. The dispatch device performs a summary calculation on one data chunk, so as to generate a representative value. The dispatch device performs a first distribution calculation on the representative value, so as to determine a destination location corresponding to the representative value. The dispatch device transmits the data chunk and the representative value to at least one destination storage device among the storage devices through a communication network according to the destination location. The at least one destination storage device checks the representative value, so as to determine whether to store the data chunk in a storage space of the at least one destination storage device.

Abstract: A method of handling UE Route Selection Policy (URSP) rules received from a non-subscribed Stand-alone Non-public Network (SNPN) registered using credentials from a credentials holder (CH) is provided. UE may be pre-configured with URSP rules by UE home network or UE may first registers to a home network and obtain signaled URSP rules from the home network. Later on, UE may register to a non-subscribed SNPN using credentials from a CH. Before establishing a PDU session, UE checks the corresponding URSP rules that can be used in the SNPN. If UE is signaled with URSP rules by the registered non-subscribed SNPN, then UE can use URSP rules in the following priority order: 1) URSP rules signaled from the non-subscribed SNPN, 2) URSP rules signaled from the home network, and 3) URSP rules pre-configured by the home network.

Abstract: A chip package includes a sensing element, a dam layer, and a light transmissive cover. A surface of the sensing element has a sensing area and a conductive pad. The conductive pad is adjacent to an edge of the surface of the sensing element. The dam layer is located on the surface of the sensing element and surrounds the sensing area. The dam layer has a main portion and plural mark portions. The mark portions are respectively located in plural corners of the main portion, located in a sidewall of the main portion, respectively located on plural corners of the sensing element, respectively located on plural inner edges of the main portion, or respectively located on plural outer edges of the main portion. The light transmissive cover is located on the dam layer.

Abstract: A method of provisioning UE Route Selection Policy (URSP) rules received from a non-subscribed Stand-alone Non-public Network (SNPN) registered using credentials from a credentials holder (CH) is provided. After a UE register to the non-subscribed SNPN using credentials from the CH, the UE may establish a PDU session for accessing services n the SNPN. Prior to establishing the PDU session, the UE checks the corresponding URSP rules that can be used in the SNPN. If the UE is signaled with URSP rules by the registered non-subscribed. SNPN, UE should store the URSP rules and then apply those URSP rules for PDU session establishment when the UE access the services in the non-subscribed SNPN.

Abstract: A method for handling a PDU session release command for releasing an MA PDU session with a PDN connection established as user-plane resource on 3GPP access is proposed. For an MA PDU session with both EPS/4G 3GPP leg and 5GS non-3GPP leg, if UE/NW wants to release the MA PDU session, UE/NW needs to initiate two procedures. First/Second, to release the EPS 3GPP leg, UE/NW should initiate a PDN disconnect procedure/deactivate EPS bearer context procedure or a detach procedure. Second/First, to release the 5GS non-3GPP leg, UE/NW should initiate a PDU session release procedure. The UE/NW can also initiate two procedures simultaneously. It is also possible that the UE initiates one procedure and the NW initiates the other procedure.

Abstract: Aspects of the disclosure provide methods and apparatuses. The method can include receiving, at a user equipment (UE), system information broadcast from a base station which may be shared by one or more PLMNs and SNPNs, the system information including an indication of whether accessing an SNPN using home service provider (HSP) subscription of a HSP network is supported. The UE can be configured with subscription information of the HSP network. The subscription information can include the HSP subscription and a home SP selection list that includes one or more candidate networks each represented by an SNPN identifier. The method can further include responsive to the system information, selecting a network from the home SP selection list according to a priority order of the candidate networks, and accessing the network selected from the home SP selection list using the HSP subscription.

Abstract: An integrated circuit includes a first metal-insulator-semiconductor capacitor, a second metal-insulator-semiconductor capacitor, and a metal-insulator-metal capacitor. A first terminal of the first metal-insulator-semiconductor capacitor is configured to receive a first reference voltage for a higher voltage domain, while a first terminal of the second metal-insulator-semiconductor capacitor is configured to receive a second reference voltage for the higher voltage domain. A second terminal of the first metal-insulator-semiconductor capacitor is conductively connected to a first terminal of the metal-insulator-metal capacitor, while a second terminal of the second metal-insulator-semiconductor capacitor is conductively connected to a second terminal of the metal-insulator-metal capacitor.

Abstract: A light-emitting semiconductor substrate, which is applied to a light-emitting semiconductor structure, includes a base and a plurality of particle groups. The base includes an upper surface. The particle groups are on the upper surface or inside the base dispersedly, and each of the particle groups includes Sn, Sn compounds or combinations thereof.

Abstract: A method and system of multimedia streaming services using DASH (Dynamic Adaptive Streaming over HTTP) are disclosed. According to this method, one or more Push Directives are sent from a client to a server to indicate information related to media data requested. Each Push Directive comprises a Push type including Push-rate and Push-rate Directive includes information associated with a push data rate related to the media data requested. If the Push-rate Directive is received by the server, one or more groups of data for the media data requested are pushed from the server to the client according to the push data rate. According to another method, fragmented MPDS are used, where at least one fragmented MPD omits a MPD header, MPD payload, Period header or Period payload. In yet another method, a status message group includes SharedResourceAllocation message that comprises parameters including bandwidth and pacingRate.

Abstract: A positive electrode material, a positive electrode, and a battery employing the same are provided. The positive electrode material includes an active particle and a modified layer covering the surface of the active particle. The modified layer is a reaction product of a composition. The composition includes an ionic conductive ceramic compound, an organic conductive compound, and a coupling agent. In the disclosure, the ionic conductive ceramic compound is 50-84 parts by weight, the organic conductive compound is 16-50 parts by weight, and the total weight of the ionic conductive ceramic compound and the organic conductive compound is 100 parts by weight. In the disclosure, the weight percentage of the coupling agent is from 0.05 wt % to 10 wt %, based on the total weight of the ionic conductive ceramic compound and the organic conductive compound.

Abstract: An IC device includes first and second resistors. The first resistor includes first and second metal segments extending in a first direction in a first metal layer, and a third metal segment extending in a second direction in a second metal layer, and electrically connecting the first and second metal segments. The second resistor includes fourth and fifth metal segments extending in the first direction in the first metal layer, and a sixth metal segment extending in the second direction in a third metal layer, and electrically connecting the fourth and fifth metal segments. The fourth and fifth metal segment have a width greater than a width of the first and second metal segments, the fourth metal segment is between the first and second metal segments and separated from the first metal segment by a distance, and a fourth and fifth metal segment separation is greater than the distance.

Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

Abstract: A power bank with automatic detection for charging capability includes a battery unit, a control unit connected to the battery unit, an input unit, at least one output unit, a starting unit and a detecting unit. The input unit is connected to the control unit. The input unit is used for being connected with an external power source. The at least one output unit is connected to the control unit. The starting unit is connected to the control unit and the at least one output unit. The starting unit is in a grounded state to form a current loop. The detecting unit is connected to the control unit and the at least one output unit. The detecting unit is used for sensing whether a signal is transmitted from the at least one output unit.

Abstract: Herein disclosed are a wafer, a wafer testing system, and a method thereof. Said wafer testing method comprises the following steps. First, an incident light is provided toward a wafer. And, a wafer surface image corresponded to the wafer is generated. Then, determining whether the wafer surface image has a plurality of first strips and a plurality of second strips, and the plurality of first strips and the plurality of second strips are symmetrical. When the wafer surface image has the plurality of first strips and the plurality of second strips, and the plurality of first strips and the plurality of second strips are symmetrical, a qualified signal corresponded to the wafer is provided.

Abstract: A heating apparatus including a rotating stage, a plurality of wafer carriers, a first heater, and a second heater is provided. The rotating stage includes a rotating axis. The plurality of wafer carriers is disposed on the rotating stage. The rotating stage drives the wafer carriers to rotate on the rotating axis. The first heater is disposed under the rotating stage. The first heater includes a first width in a radial direction of the rotating stage. The second heater is disposed under the rotating stage. The second heater and the first heater are separated from each other. The second heater includes a second width in the radial direction of the rotating stage, and the first width is not equal to the second width. A chemical vapor deposition (CVD) system using the heating apparatus is also provided.