Abstract: A method of performing code review and a code review system are provided. The code review system includes a code repository, a static scanning tool, an analytical neural network and a generative neural network. The code repository is configured to store an original source code and a new code created by a developer in response to a code change request to merge the new code with the original source code. The static scanning tool is configured to collect data associated with each commit in the new code. The analytical neural network is implemented with an analytical AI and configured to assess a risk level of each commit in the new code. The generative neural network is implemented with a generative AI and configured to provide a code summarization and an initial code review comment of each commit in the new code.

Abstract: The present disclosure provides a memory device including a substrate including a first and a second surfaces opposite to each other, a first interconnection structure disposed on the first surface of the substrate, a first and second elements disposed in the substrate and/or the first interconnection structure, a second interconnection structure disposed on the first interconnection structure, and a third interconnection structure disposed on the second surface of the substrate. The first interconnection structure includes first wiring layers configured to be closest to the first and second elements. The third interconnection structure includes second wiring layers configured to be closest to the first and second elements. Each of the first and second elements includes a first electrical connection path through the first wiring layer and a second electrical connection path through the second wiring layer.

Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes an upper surface; a plurality of exposed regions, formed in the semiconductor stack and exposing the upper surface; a lower protective layer, covering the exposed regions and the second semiconductor layer; a first reflective structure, formed on the second semiconductor layer and including a plurality of first openings on the second semiconductor layer; a second reflective structure, formed on the first reflective structure and electrically connected to the second semiconductor layer through the plurality of first openings; and an upper protective layer, formed on the second reflective structure; wherein the upper protective layer contacts and overlaps the lower protective layer on the exposed regions; wherein the first reflective structure and the

Abstract: A semiconductor structure including device structures arranged in a stack is provided. The device structures include substrates and through-substrate vias (TSVs). The TSVs are located in the substrates. The TSVs includes first TSVs. Each of the device structures includes the corresponding substrate and the corresponding first TSV. Each of the first TSVs passes through the corresponding substrate. The number of the TSVs in the endmost device structure is less than the number of the TSVs in another of the device structures. The first TSV in the endmost device structure and the first TSV in another of the device structures are aligned with each other and electrically connected to each other.

Abstract: A through-substrate via (TSV) test structure including a substrate, a first TSV, and a test device is provided. The substrate includes a test region. The first TSV is located in the substrate of the test region. The test device is located on the substrate of the test region. The test device and the first TSV are separated from each other. The shortest distance between the test device and the first TSV is less than 10 ?m.

Abstract: A stitching method for an exposure process includes following steps. A wafer is provided. The wafer includes interposer regions, each of which includes a logic chip region, a first memory chip region, and a second memory chip region. The logic chip region is located between the first and second memory chip regions. A photoresist layer is formed on the wafer. First exposure processes are performed on the photoresist layer by applying a first photomask to form first shot regions in the photoresist layer. Second exposure processes are performed on the photoresist layer by applying a second photomask to form second shot regions in the photoresist layer. The first shot regions and the second shot regions are arranged alternately in a first direction. The first shot regions and the second shot regions are overlapped to form stitching regions, each of which is not located in the logic chip region.

Abstract: Techniques and apparatus for configurable radio frequency (RF) exposure compliance based on region. An example method of wireless communication by a user equipment (UE) generally includes identifying a region in which the UE is located, selecting at least one of a mode or one or more parameters for RF exposure compliance based on the identified region, and transmitting a signal at a transmission power level based at least in part on the at least one of the selected mode or the selected one or more parameters.

Abstract: An antibiotic pharmaceutical composition for intradermal or subcutaneous administration is provided, which includes an antibiotic and hyaluronidase (HAase). In the antibiotic pharmaceutical composition, a content of the antibiotic is 10 mg/mL-5 g/Ml, and a content of the HAase is 45 units/ml-4500000 units/ml. A kit is provided, which includes the pharmaceutical composition. A method for preparing the kit, and use of the pharmaceutical composition are further provided.

Abstract: Certain aspects of the present disclosure provide techniques for operating a wireless communication device pursuant to radio frequency (RF) exposure with antenna grouping. An example method of wireless communication by a user equipment generally includes accessing a stored backoff factor associated with an antenna group among a plurality of antenna groups. The method also includes transmitting, from at least one transmit antenna in the antenna group, a signal at a transmission power level based on the backoff factor in compliance with an RF exposure requirement.

Abstract: Techniques and apparatus for service-based transmit energy allocation are described. An example method that may be performed by a wireless communication device includes obtaining reserve information associated with services allocated to a set of antenna groups. Each antenna group is associated with at least one radio corresponding to at least one radio access technology (RAT). A reserve is determined for each radio, based at least in part on the reserve information, a set of services mapped to the radio, and a respective state associated with each of the set of services. A signal(s) is transmitted for at least one service using at least one radio associated with the at least one service and a transmit power determined based at least in part on a radio frequency (RF) exposure limit associated with the at least one radio and the reserve for the at least one radio.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for filter-based time-averaging radio frequency (RF) exposure evaluation. An example method of wireless communication includes determining an effective time-averaged transmit power associated with one or more past transmissions using a filter. The method further includes transmitting a signal in a time interval at a transmit power determined based at least in part on the effective time-averaged transmit power in compliance with an RF exposure limit.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for multi-radio frequency exposure limit compliance. An example method of wireless communication includes obtaining scaling information indicative of a relationship between a first radio frequency (RF) exposure limit and a second RF exposure limit. The method further includes transmitting a signal at a transmit power determined based at least in part on a maximum allowed transmit power for a time interval and the scaling information.

Abstract: Embodiments of the present disclosure provide a solar cell string, a solar cell module, a manufacturing apparatus and a manufacturing method thereof. The solar cell string includes at least two solar cells including first and second solar cells adjacent to each other; front and back surfaces of each of the at least two solar cells are respectively provided with a grid line, and the grid line on the front surface is connected with the grid line on the back surface by a solder strip, the first and second solar cells have an overlapping region, and the overlapping region is provided with a buffer pad covering at least one side surface of the solder strip located in the overlapping region, and the buffer pad is formed by a pad which is pre-arranged in the overlapping region and melted at high temperature.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an apparatus may determine a time-averaged power limit of a set of antennas. The apparatus may modify an antenna switching configuration based at least in part on the time-averaged power limit. The apparatus may transmit a signal using an antenna, from the set of antennas, associated with the modified antenna switching configuration, wherein the antenna is associated with a higher power limit than one or more other antennas. Numerous other aspects are described.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for determining a transmit power based on a pattern and/or future conditions for a transmission while maintaining radio frequency (RF) exposure compliance. An example method generally includes obtaining a pattern associated with one or more first transmissions, determining a transmit power for one or more second transmissions based at least in part on the pattern and an RF exposure limit, and transmitting the one or more second transmissions at the determined transmit power.

Abstract: A method includes detecting, based on sensor data from a sensor on a mobile device, an environmental brightness measurement, where the mobile device comprises a display screen configured to adjust display brightness based on environmental brightness. The method further includes determining, based on image data from a camera on the mobile device, an extent to which the detected environmental brightness measurement is caused by reflected light from the display screen. The method additionally includes setting a rate of exposure change for the camera based on the determined extent to which the detected environmental brightness measurement is caused by reflected light from the display screen.

Abstract: A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate,

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.

Abstract: Certain aspects of the present disclosure provide techniques for exception-robust time-averaged radio frequency (RF) exposure compliance continuity. A method that may be performed by a user equipment (UE) generally includes transmitting a first signal at a first transmission power based on time-averaged RF exposure measurements over a time window and storing RF exposure information associated with the time window. The method may also include detecting that an exception event associated with the UE occurred and transmitting a second signal at a second transmission power based at least in part on the stored RF exposure information in response to the detection of the event.