Abstract: A device diagnosis system includes an image forming apparatus, a portable terminal device, and an abnormal noise decision device. The portable terminal device collects an operating sound of the image forming apparatus, at a sound collecting position selected from a plurality of predetermined sound collecting positions relative to the image forming apparatus. The abnormal noise decision device (a) identifies a decision criterion corresponding to the sound collecting position, and (b) decides whether the operating sound contains an abnormal noise, on a basis of acoustic data of the operating sound collected, in accordance with the decision criterion identified.

Abstract: Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.

Abstract: A wafer stacking method includes the following steps. A first wafer is provided. A second wafer is bonded to the first wafer to form a first wafer stack structure. A first edge defect inspection is performed on the first wafer stack structure to find a first edge defect and measure a first distance in a radial direction between an edge of the first wafer stack structure and an end of the first edge defect away from the edge of the first wafer stack structure. A first trimming process with a range of a first width is performed from the edge of the first wafer stack structure to remove the first edge defect. Herein, the first width is greater than or equal to the first distance.

Abstract: A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

Abstract: Provided are a mutant of an immunoglobulin degrading enzyme IdeE, a protein comprising the mutant, and a use of a composition and a kit in preparation of a drug for reducing the level of IgG in a subject. The mutant has amino acid substitution, N-terminal truncated and/or C-terminal truncated on one or more of positions 8, 10, 24, 59, 97, and 280 of the amino acid sequence shown in SEQ ID NO: 2, and the mutant has the function of the immunoglobulin degrading enzyme IdeE, and has higher activity and thermal stability than wild-type IdeE.

Abstract: A semiconductor structure including a device wafer, a carrier structure, and a redistribution layer (RDL) structure is provided. The device wafer includes a first substrate, a first dielectric layer, first bonding pads, and a power via structure. The carrier structure includes the following components. A second substrate has a third surface and a fourth surface opposite to each other. A second dielectric layer is located on the third surface. Second bonding pads are located in the second dielectric layer. The second bonding pads are bonded to the first bonding pad, and the second dielectric layer is bonded to the first dielectric layer. A heat dissipation plate is located on the fourth surface. Through-substrates via (TSVs) pass through the second substrate. The TSV is electrically connected to the heat dissipation plate and the second bonding pad. The RDL structure is electrically connected to the power via structure.

Abstract: Purchase Media Metrics (PMM) Platform empowers advertisers to plan their cohort-targeting campaigns in a privacy-safe manner using unique viewer-purchaser graph that connects media views with brand and category purchases. At the same time, the PMM Platform helps publishers/networks identify the best advertisers for their inventories and package and prioritize their media offerings. By further enriching the viewer-purchaser graph with campaign exposure data, the PMM Platform enhances advertisers' campaign measurement and optimization capabilities.

Abstract: A hardware accelerator is provided. The hardware accelerator includes a first memory; a source address generation unit coupled to the first memory; a data collection unit coupled to the first memory; a first data queue coupled to the data collection unit; a data dispersion unit coupled to the first data queue; a destination address generation unit coupled to the data dispersion unit; an address queue coupled to the destination address generation unit; a second data queue coupled to the data dispersion unit; and a second memory coupled to the second data queue. The hardware accelerator can perform anyone or any combination of tensor stride, tensor reshape and tensor transpose to achieve tensorflow depth-to-space permutation or tensorflow space-to-depth permutation.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for radio frequency (RF) exposure compliance for coherent transmissions. An example method of wireless communication includes obtaining a first transmit power limit associated with a coherent transmission mode, wherein the first transmit power limit is adjusted by a scaling factor associated with the coherent transmission mode. The method also includes transmitting first signals via a plurality of antennas in the coherent transmission mode at a first transmit power determined based at least in part on the first transmit power limit.

Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the second semiconductor layer includes a first edge; a reflective structure located on the second semiconductor layer and including an outer edge; a first electrode pad located on the reflective structure, wherein the first electrode pad including an outer side wall adjacent to the outer edge, wherein the outer edge extends beyond the outer side wall and does not exceed the first edge in a cross-sectional view of the light-emitting device.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for exceptions to region-specific radio frequency parameters. An example method of wireless communication includes identifying a region in which the wireless device is located. The method further includes identifying an indication, associated with the identified region, of whether to apply one or more exception values or one or more default values, associated with one or more parameters for radio frequency (RF) exposure compliance. The method also includes selecting the one or more exception values based on the indication and transmitting a signal at a transmit power based at least in part on the selected one or more exception values.

Abstract: Under dynamic shard mapping, applications may dynamically define, evolve, and redefine how a sharded table is sharded across shards according to sharding keys. Dynamic shard mapping is referred to as being dynamic because changes to a sharding directory that defines a sharding distribution scheme are effected without having to change synchronized f metadata. A sharding directory maps sharding key values to shard servers. The changes are effected directly by invoking an API or indirectly by submitting a DML command that includes, for example, a sharding key value that is unmapped by the sharding directory. The sharding directory is distributed among the shards and client computers of a sharded DBMS to facilitate and optimize the routing of database commands across the shards of a DBMS.

Abstract: According to certain aspects a wireless device includes transmitters, and a processor coupled to the transmitters. The processor is configured to determine a radio frequency (RF) exposure value at a peak location based on transmission power levels for the transmitters, determine a contribution of each one of the transmitters to the RF exposure value at the peak location, and reduce the transmission power level for each one of one or more of the transmitters based on the contributions of the transmitters to the RF exposure value at the peak location.

Abstract: A cooler having an optimized coating structure for an electric vehicle power module is provided. The cooler includes a metal cooling substrate and a coating structure. The coating structure has at least a barrier layer and a function layer. The barrier layer is formed on the metal cooling substrate. The barrier layer is a nickel coating layer or a nickel alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m. The function layer is a silver/silver alloy coating layer, or a copper/copper alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m.

Abstract: Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: A multi-use monitoring system is disclosed, which comprises an electronic device, multiple sensor devices, multiple cameras, at least one wireless interface, and a remote electronic device. According to the present invention, the sensor devices are adopted for detecting multiple environmental parameters such as gas level, humidity and temperature, and the multiple cameras are controlled to acquire images from the poultry bred in a breeding environment. Therefore, after receiving the images and the environmental parameters from the electronic device, the remote electronic device can extract at least one poultry characteristic from the images, and then correlate the environmental parameters to the poultry characteristic(s). As a result, the remote electronic device can subsequently calculate an evaluation score according to the growth and/or health state of the poultry, such that the breeder can plan how to distribute the breeding resources for the poultry.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Abstract: A BLUETOOTH earphone includes an antenna, the antenna comprises an antenna radiator, a first connecting portion, a second connecting portion, and a third connecting portion. The antenna radiator is located on a first portion of a flexible printed circuit (FPC) which is disposed in the earphone handle portion. The first connecting portion is a main ground of the BLUETOOTH earphone. The second connecting portion, is located on the earphone handle portion, and comprises a ground point. The third connecting portion is located on the earphone handle portion, and is connected to a first position on the second connecting portion other than the ground point, the third connecting portion and the antenna radiator are spaced apart with a first gap, and the third connecting portion is coupled to the antenna radiator through the first gap.