Patents by Inventor Lin Tsai

Lin Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11664431
    Abstract: The present disclosure relates to a transistor device. The transistor device includes a plurality of first source/drain contacts disposed over a substrate. A plurality of gate structures are disposed over the substrate between the plurality of first source/drain contacts. The plurality of gate structures wrap around the plurality of first source/drain contacts in a plurality of closed loops. A second source/drain contact is disposed over the substrate between the plurality of gate structures. The second source/drain contact continuously wraps around the plurality of gate structures as a continuous structure.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: May 30, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Aurelien Gauthier Brun, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Yun-Hsiang Wang
  • Patent number: 11654603
    Abstract: An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: May 23, 2023
    Assignee: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Tzu-Hsiang Wei, Pi-Lin Tsai
  • Patent number: 11651611
    Abstract: A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 16, 2023
    Assignee: InvenSense, Inc.
    Inventor: Julius Ming-Lin Tsai
  • Publication number: 20230145434
    Abstract: The fuel economizer is series-connected between a fuel tank and a fuel vaporization device of an internal combustion engine, and includes a first piping element and an oil cup. A first end of the first piping element is connected to the fuel vaporization device, and a second end of the first piping element is connected to the fuel tank through the oil cup for filtering the fuel tank's fuel. A spirally threaded shaft is tightly housed inside the first piping element and the spirally threaded shaft's outer circumference is configured with spiral threads to speed, rotate, and disturb the fuel as the fuel flows through to disrupt the surface tension and density of the fuel.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 11, 2023
    Inventor: Kun-Lin TSAI
  • Publication number: 20230143739
    Abstract: An antenna array calibration device and method thereof are provided. The method includes measuring the power total of the antenna array, controlling active components to adjust the antennas to having a maximum amplitude, controlling phase shifters to adjust the antennas to having a random phase, calculating the phase difference between an initial phase and a random phase, calculating the amplitude difference between an initial amplitude and the maximum amplitude, introducing the phase difference, the amplitude difference and the power total of the antenna array into a simultaneous equation of amplitudes and phases to obtain the initial amplitude and the initial phase of the antennas, and adjusting the phase of the antenna array if there is a real number solution of the equation, or otherwise adjusting the phase of the antenna array to another random phase to obtain a real number solution of the equation.
    Type: Application
    Filed: December 16, 2021
    Publication date: May 11, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ruey-Bing HWANG, Yueh-Lin TSAI
  • Publication number: 20230131187
    Abstract: An implant shredder includes a base and a cutting member. The base includes a first chamber and a second chamber intercommunicating with the first chamber. The first chamber includes an inlet. The second chamber includes an outlet. The cutting member is received in the second chamber. The cutting member is driven by a driving member to rotate. The cutting member includes a plurality of cutting edges located on a circumference of a same radius. The plurality of cutting edges is rotatably disposed adjacent to a location intercommunicating with the first chamber. An implant forming method includes creating data of an outline of an implant; producing a shaping mold based on the data; and cutting a to-be-processed object with the implant shredder, mixing the cut to-be-proceed object with a biological tissue glue to obtain a raw material, and filling the raw material into the shaping mold to form the implant.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 27, 2023
    Inventors: Yue-Jun Wang, Chun-Chieh Tseng, Tung-Lin Tsai
  • Publication number: 20230122049
    Abstract: Provided is a method for treating a SARS-CoV2 3CLpro-related disease in a subject in need thereof by blocking dimerization of 3C-like main protease (3CLpro) of the SARS-CoV2, including administering to the subject a first agent which binds to a first binding site of a SARS-CoV2 3CLpro complex and a second agent which binds to a second binding site of the SARS-CoV2 3CLpro complex, wherein the first binding site and the second binding site are functionally different sites in the three-dimensional structure of the SARS-CoV2 3CLpro complex. Also provided is a pharmaceutical combination including the first agent and the second agent for suppressing SARS-CoV2, thereby alleviating COVID-19.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 20, 2023
    Inventors: Lee-Wei YANG, Kun-Lin TSAI, Bang-Chieh HUANG, Yi-Yun CHENG, Sui-Yuan CHANG
  • Publication number: 20230120292
    Abstract: The present disclosure relates an integrated chip. The integrated chip includes an isolation region disposed within a substrate and surrounding an active area. A gate structure is disposed over the substrate and has a base region and a gate extension finger protruding outward from a sidewall of the base region along a first direction to past opposing sides of the active area. A source contact is disposed within the active area and a drain contact is disposed within the active area and is separated from the source contact by the gate extension finger. A first plurality of conductive contacts are arranged on the gate structure and separated along the first direction. The first plurality of conductive contacts are separated by distances overlying the gate extension finger.
    Type: Application
    Filed: February 15, 2022
    Publication date: April 20, 2023
    Inventors: Shih-Pang Chang, Haw-Yun Wu, Yao-Chung Chang, Chun-Lin Tsai
  • Publication number: 20230123907
    Abstract: A semiconductor structure includes: a channel layer; an active layer over the channel layer, wherein the active layer is configured to form a two-dimensional electron gas (2DEG) to be formed in the channel layer along an interface between the channel layer and the active layer; a gate electrode over a top surface of the active layer; and a source/drain electrode over the top surface of the active layer; wherein the active layer includes a first layer and a second layer sequentially disposed therein from the top surface to a bottom surface of the active layer, and the first layer possesses a higher aluminum (Al) atom concentration compared to the second layer. An HEMT structure and an associated method are also disclosed.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 20, 2023
    Inventors: YAO-CHUNG CHANG, PO-CHIH CHEN, JIUN-LEI JERRY YU, CHUN LIN TSAI
  • Publication number: 20230122470
    Abstract: A cavity-backed slot antenna system provided in this disclosure is installed in a housing of an electronic device and includes a metal cavity, a supporting element, an antenna device, a conductive post, and a coupling metal part. The metal cavity is in the housing and includes an opening and a closed surface opposite to each other. A slot is on the closed surface. The supporting element is in the metal cavity. The antenna device is in the metal cavity and on the supporting element, to expose one side surface of the antenna device. The antenna device includes a feed source. The conductive post penetrates the antenna device and connects to the metal cavity. The coupling metal part is in the housing and close to the opening of the metal cavity, so that the coupling metal part is close to and corresponds to the feed source of the antenna device.
    Type: Application
    Filed: September 21, 2022
    Publication date: April 20, 2023
    Inventors: Shih-Hsun Chang, Wei-Lin Tsai, Zhi-Zeng Cheng, You-Fu Cheng, Tsung-Hsun Hsieh
  • Patent number: 11631741
    Abstract: A semiconductor device includes a transistor, a semiconductor layer, an active region and a conductive layer. The active region is in the semiconductor layer. The conductive layer is configured to maintain a channel in the active region when the transistor is triggered to be conducted.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Syuan Lin, Jiun-Lei Yu, Ming-Cheng Lin, Chun Lin Tsai
  • Patent number: 11628005
    Abstract: A tool for a bone implant includes a rod and an adaptor. The rod includes a coupling portion having a through-hole. The rod further includes a measuring arm connected to the coupling portion and a force applying arm connected to the coupling portion. The measuring arm includes a first extension section having a first indicator portion, and the force applying arm includes a second extension section having a second indicator portion. The force applying arm is elastically deformable away from the measuring arm to displace the second extension section relative to the first extension section. The adaptor is coupled in the through-hole and includes an outer ring and an inner ring. The outer ring is rotatable relative to the inner ring in a single direction.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: April 18, 2023
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Tung-Lin Tsai, Chun-Chieh Tseng, Chun-Ming Chen, Yue-Jun Wang, Hsin-Fei Wang, Pei-Hua Wang
  • Patent number: 11616133
    Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: March 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Lun Chang, Shiao-Shin Cheng, Ji-Yin Tsai, Yu-Lin Tsai, Hsin-Chieh Huang, Ming-Yuan Wu, Jiun-Ming Kuo, Ming-Jie Huang, Yu-Wen Wang, Che-Yuan Hsu
  • Publication number: 20230066456
    Abstract: A substrate structure is provided with a first electrical contact pad formed on an insulating layer of a substrate body, where the first electrical contact pad includes a first pad portion disposed on the insulating layer and at least one first protruding portion embedded in the insulating layer, so that the first pad portion is electrically connected to a circuit layer in the insulating layer by a conductive blind via, and the first protruding portion is free from being electrically connected to the circuit layer, such that, through a design of the first protruding portion, all surfaces of a metal layer formed on the insulating layer can meet the requirement of coplanarity.
    Type: Application
    Filed: June 14, 2022
    Publication date: March 2, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Pei-Geng Weng, Fang-Lin Tsai, Wei-Son Tsai, Yih-Jenn Jiang
  • Publication number: 20230069127
    Abstract: The present disclosure provides a chemical supply system, including a chamber, a tubing extending into the chamber, an interlock apparatus, including a fixture for fastening the tubing, and means for determining whether the tubing is fastened by the fixture.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: FANG-PIN CHIANG, TSUNG-LIN TSAI, CHAOYEN HUANG, YI CHUAN CHEN
  • Patent number: 11592475
    Abstract: Abstract of Disclosure A method for testing radiation susceptibility includes transmitting radiation wave to a device under test, measuring the device under test to generate a first voltage according to the radiation wave, outputting a reference voltage to a coupling device so that the coupling device generates a second voltage according to the reference voltage, adjusting the reference voltage so that the second voltage approximates the first voltage, storing the adjusted reference voltage, outputting the second voltage to the device under test according to the adjusted reference voltage to simulate an impact of the radiation wave to the device under test, the device under test accordingly transmitting a control signal to the coupling device after receiving the second voltage, and determining a status of the device under test according to the control signal.
    Type: Grant
    Filed: December 12, 2021
    Date of Patent: February 28, 2023
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Yung-Sen Lee, I-Lin Tsai
  • Publication number: 20230060065
    Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The two-part lid comprises an annular lid base and a cover plate removably installed on the annular lid base.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 23, 2023
    Applicant: MEDIATEK INC.
    Inventors: Yi-Lin Tsai, Yi-Jou Lin, Tsai-Ming Lai, Wei-Chen Chang
  • Patent number: 11568429
    Abstract: A demand forecasting method and a demand forecasting apparatus are provided. A preliminary prediction amount corresponding to a part number is obtained based on historical demand data. A demand probability of the part number is calculated based on the preliminary prediction amount. A prediction demand amount corresponding to the part number is obtained based on the historical demand data, the preliminary prediction amount and the demand probability.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 31, 2023
    Assignee: Wistron Corporation
    Inventors: Chi Lin Tsai, Chi Hao Yu, Wen Hsuan Lan, Ling-Yu Kuo, Han-Yi Shih, Pei Yu Ho
  • Publication number: 20230012045
    Abstract: A method for Co-Reception (Co-Rx) operation of multiple transceiver radios sharing the same antenna and Low Noise Amplifier (LNA) is provided. A first receiver radio of a wireless communication device determines the first gain mode of an LNA based on the first signal indicator. A second receiver radio of the wireless communication device determines the second gain mode of the LNA based on the second signal indicator. The LNA is shared by the first receiver radio and the second receiver radio and is coupled to an antenna. A Packet Traffic Arbitration (PTA) circuitry of the wireless communication device configures the LNA to operate in the first gain mode or the second gain mode based on the priority levels of the first receiver radio and the second receiver radio.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 12, 2023
    Inventors: Li-Wei CHEN, Tsai-Yuan HSU, Chen-Feng LIU, Wen-Ying CHIEN, Chia-Hung HSU, Yu-Lin TSAI
  • Publication number: 20230005808
    Abstract: A semiconductor chip package includes a substrate having a top surface and a bottom surface, and a semiconductor device mounted on the top surface of the substrate. A gap is provided between the semiconductor device and the top surface of the substrate. A multi-layer laminate epoxy sheet is disposed on the top surface of the substrate and around a perimeter of the semiconductor device.
    Type: Application
    Filed: September 1, 2022
    Publication date: January 5, 2023
    Applicant: MEDIATEK INC.
    Inventors: Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng, Wen-Sung Hsu