Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: Provided is an anti-HER3 humanized monoclonal antibody. The antibody is bound with HER3 antigen, has high affinity and biological activity and low immunogenicity, and is stable in structure. The antibody can be used for preparing drugs for preventing or treating HER3-related diseases.

Abstract: A piston pressure device includes a gas concentration-regulating piston pressure device and a high temperature autoclave. In the gas concentration-regulating piston pressure device, the proportion and concentration of corrosive gases can be accurately adjusted, intermediate gases can be stored and filled into the high temperature autoclave according to experimental needs, and an actual corrosion process in oilfield is accurately simulated. Meanwhile, the corrosive gases can be supplemented in real time during the experiment, and dynamic gas distribution in a high-temperature high-pressure corrosion experiment process is realized.

Abstract: A wireless local area network (WLAN) configuration method and a central access point (AP), where the method includes obtaining, by the central AP, identifiers of a plurality of radio frequency (RF) circuits in a plurality of APs, recording a mapping from the identifiers to the plurality of APs, sending the identifiers to a WLAN controller, receiving respective configurations of the plurality of RF circuits from the WLAN controller, wherein each configuration in the respective configurations of the plurality of RF circuits comprises an identifier of a corresponding RF circuit, and separately sending each configuration in the respective configurations of the plurality of RF circuits to the plurality of APs according to the mapping from the identifiers to the plurality of APs.

Abstract: Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm2 and 5 billion cm2.

Abstract: A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.

Abstract: A method for determining power dissipation within a computer system is disclosed. A circuit block may receive a regulated voltage level on a power supply signal generated by a voltage regulator circuit. A power control circuit may measure a current drawn by the circuit block, and determine a real-time voltage level for the power supply signal using the current and based on a slope value and a zero-load voltage level. Additionally, power control circuit may determine a power dissipation for the circuit block using the current and the real-time voltage level, and adjust an operation parameter of the circuit block based on the power dissipation.

Abstract: A composition for producing a glass fiber, including the following components with corresponding percentage amounts by weight: 54.2-64% SiO2, 11-18% Al2O3, 20-25.5% CaO, 0.3-3.9% MgO, 0.1-2% of Na2O+K2O, 0.1-1.5% TiO2, and 0.1-1% total iron oxides including ferrous oxide (calculated as FeO). The weight percentage ratio C1=FeO/(iron oxides?FeO) is greater than or equal to 0.53. The total content of the above components in the composition is greater than 97%. The invention also provides a glass fiber produced using the composition and a composite material including the glass fiber.

Abstract: A sealing integrity evaluation device for high-temperature and high-pressure casing-cement ring-formation and a method thereof are provided. the device includes: a high-temperature autoclave, a temperature and pressure control system, and a casing-cement-formation combination; wherein the autoclave realizes alternating temperature and pressure during the experiment; the control system monitors, controls and records the temperature and pressure data; the combination simulates a full size or a compact size casing-cement-formation of a well.

Abstract: Methods and apparatus for detecting ultraviolet light are provided herein. For example, an ultraviolet (UV) process chamber includes a vacuum window or a transparent showerhead; a UV light source disposed above one of the vacuum window or the transparent showerhead and configured to generate and transmit UV light into a process volume of the UV process chamber; and a first UV sensor configured to measure at least one of emissivity from the UV light source or irradiance of the UV light transmitted into the process volume and to transmit a signal corresponding to a measured at least one of emissivity from the UV light source or irradiance of the UV light to a controller coupled to the UV process chamber during operation.

Abstract: The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor.

Abstract: Disclosed are a display device and a display method thereof. The display device includes a data acquisition portion and a display portion. The data acquisition portion is configured to acquire light field information, and the data acquisition portion includes a plurality of first optical structures and a plurality of photosensitive unit groups, the first optical structures are at a light incident side of the photosensitive unit groups, and the first optical structures are in one-to-one correspondence with the photosensitive unit groups. The display portion is configured to display the light field information acquired by the data acquisition portion, the display portion includes a plurality of second optical structures and a plurality of sub-pixel groups, the second optical structures are at a light exit side of the sub-pixel groups, and the sub-pixel groups are in one-to-one correspondence with the second optical structures.

Abstract: The present disclosure provides a driving circuit and driving method for a liquid crystal display panel, and a display device. The driving circuit includes: a signal collector, configured to collect a backlight control signal; and a timing control chip, configured to determine whether a BLU is in the bright state time period or in the dark state time period, and retrieve a first gate control signal from a memory chip and output the first gate control signal to a gate driving circuit, when determining that the BLU is in the bright state time period, or retrieve a second gate control signal from the memory chip and output the second gate control signal to the gate driving circuit, when determining that the BLU is in the dark state time period.

Abstract: A large-scale multifunctional rice noodle making machine, along the direction of materials delivery comprises sequentially a rice lifting machine inlet, a rice lifting machine, a fermenter, a rice feeder, a rice-flour outlet, an auxiliary ingredients machine, a continuously mixing and conveying machine, an outlet, a self-ripening and shaping machine, a hot water circulation tank, a rice-flour feeder, an extruding machine, a conveyor of aging machine, a fan, an aging machine, a first noodle loosen machine, a noodle steamer, an out-feed channel, a second noodle loosen machine, a conveyor, an inlet, an inner packaging machine, a conveyor I, a weighing scale, a metal detector, a conveyor II, a sterilizer, and a rice noodle collector. The present invention relates to a large-scale multifunction rice noodle machine, which can automatically and efficiently produce a variety of rice noodles, such as fermented and non-fermented rice noodles.

Abstract: A composition for producing a glass fiber, including the following components with corresponding percentage amounts by weight: SiO2: 57.4-60.9%; Al2O3: greater than 17% and less than or equal to 19.8%; MgO: greater than 9% and less than or equal to 12.8%; CaO: 6.4-11.8%; SrO: 0-1.6%; Na2O+K2O: 0.1-1.1%; Fe2O3: 0.05-1%; TiO2: lower than 0.8%; and SiO2+Al2O3: lower than or equal to 79.4%. The total weight percentage of the above components in the composition is greater than 99%. The weight percentage ratio of Al2O3+MgO to SiO2 is between 0.43 and 0.56, and the weight percentage ratio of CaO+MgO to SiO2+Al2O3 is greater than 0.205. The composition can significantly increase the glass modulus, effectively reduce the glass crystallization rate, secure a desirable temperature range (?T) for fiber formation and enhance the refinement of molten glass, thus making it particularly suitable for high performance glass fiber production with refractory-lined furnaces.

Abstract: An imaging device includes a lens array and an image sensor. The lens array includes a plurality of lens units, and is configured to provide a first lens sub-array and a second lens sub-array, the first lens sub-array includes a first lens unit of the lens units, the first lens unit and the image sensor are configured to have a first range of depth of field, the second lens sub-array includes a second lens unit of the lens units, the second lens unit and the image sensor are configured to have a second range of depth of field, the first depth range and the second depth range partially overlap, and a combined range of the first second ranges of depth of field is greater than each of the first range of depth of field and the second range of depth of field.

Abstract: The present disclosure provides an optical fingerprint sensor and a display module. The optical fingerprint sensor includes a photodiode and a switching thin film transistor connected to the photodiode, in which the photodiode includes a first electrode made of a light-absorbing conductive nano-material; the first electrode is located in a same layer as a second electrode of the switching thin film transistor, and the first electrode includes a light-entering end surface facing a light-entering side and a side surface connected to the light-entering end surface, the side surface includes a curved portion, and the second electrode is at least connected to the curved portion.

Abstract: The present disclosure discloses a structure for collecting light field information, a display device, and a control method of the display device. The structure for collecting light field information includes a base substrate, a plurality of sensor chips located on the base substrate, where each of the plurality of sensor chips includes a plurality of sensing units arranged in an array, and a plurality of micro-imaging structures located above a side, facing away from the base substrate, of the plurality of sensor chips. Each of the plurality of micro-imaging structures corresponds to a respective one of the sensor chips. An orthographic projection of the respective one sensor chip on the base substrate has an overlapping region with an orthographic projection of the each micro-imaging structure on the base substrate. The respective one sensor chip is configured to receive light field information passing through the each micro-imaging structure.

Abstract: Compounds are provided having the structure of the following Formula I: where R, R1, R2, R3a and R3b are as defined herein. Pharmaceutical compositions comprising such compounds, as well as methods related to their manufacture and use, are also provided.

Abstract: Embodiments of the present disclosure provide a texture acquisition device, a method for manufacturing a texture acquisition device, and a texture acquisition method. The texture acquisition device includes: a display panel; a backlight layer including a plurality of light sources spaced apart from each other, the light sources being configured to emit light toward a light exit side of the display panel; and a plurality of photoelectric sensors, wherein the texture acquisition device is configured in such a way that the light emitted by the light source is irradiated to a region between adjacent light sources after being reflected by an object to be detected on the display panel, to form an optical path, and at least one photoelectric sensor is provided in the optical path so as to detect the light reflected by the object to be detected to recognize an texture image of the object to be detected.