Abstract: The present disclosure relates to a display panel. The display panel may include a first substrate, a second substrate opposite the first substrate, and a frame supporting structure between the first substrate and the second substrate in a frame area of the display panel. The frame area of the display panel may surround a display area of the display panel. The frame supporting structure may include a first frame supporting portion on at least one part of a circumference of the display area, the first frame supporting portion comprises an elastic material, and an elastic recovery rate of the elastic material is above about 80%.

Abstract: A robot vision-based automatic rivet placement system and method. The automatic rivet placement system includes: an industrial robot installed on a frame, a multi-functional end effector, a rivet blowing mechanism, a detection disk, and a rivet holding tray. The multi-functional end effector consists of a flange disk, a support frame, an industrial CCD camera, a laser displacement sensor, a spring, a mixing rod, and a vacuum nozzle. The multi-functional end effector is connected to a terminal end of the industrial robot via the flange disk. The industrial CCD camera is installed directly in front of the support frame, and is used to acquire a rivet image and measure a rivet parameter. The laser displacement sensor is installed at a side surface of the support frame, and is used to measure a rivet depth.

Abstract: Disclosed is a variable-parameter stiffness identification and modeling method for an industrial robot. An effective working space of a robot is divided into a plurality of cubic regions. For an operating task in a certain machining region, different loads are applied to an end effector at multiple positions and multiple postures in the region, and robot joint stiffness in this section is identified and acquired according to the relationship between the loads and an end deformation, thereby realizing accurate stiffness control of the robot in different operating sections during a machining process.

Abstract: An optical waveguide structure has a waveguide core including an inner and an outer layer with different refractive indices, and a refractive index ratio of the different refractive indices is greater than or equal to 1.15. A dispersion controlling method using the optical waveguide structure includes: first, obtaining a dispersion curve having up to 5 zero-dispersion wavelengths by calculating based on a set of preset structural size parameters of the optical waveguide; and then, adjusting one or more of the width (W) of a contact surface between the inner layer and the substrate, the thickness (H) of a higher refractive index material, and the thickness (C) of a lower refractive index material, so as to implement dispersion control.

Abstract: Provided are a high-strength and high-conductivity Cu—Ag—Sc alloy and a preparation method thereof. The preparation method includes the following steps: (1) placing metal Ag and metal Sc in an electric-arc furnace and performing smelting under a vacuum condition, performing cooling to normal temperature in the furnace to obtain an Ag—Sc intermediate alloy; (2) placing the Ag—Sc intermediate alloy, an electrolytic copper and the metal Ag in an induction furnace and performing heating to 1200-1300° C. under a vacuum condition, keeping at the temperature for 10-60 min for smelting, then performing casting and cooling to normal temperature in the furnace to obtain ingots; (3) heating the ingots to 700-850° C. under an inert atmosphere, then performing water quenching to normal temperature to obtain heat-treated ingots; and (4) heating the heat-treated ingots to 400-500° C. under an inert atmosphere, then performing air cooling to normal temperature to obtain the high-strength and high-conductivity Cu—Ag—Sc.

Abstract: Provided are antibodies that recognize the B-Cell Maturation Antigen (BCMA) and methods of use thereof.

Abstract: A display panel having a display area and a peripheral area is provided. The display panel includes a first display substrate; a second display substrate facing the first display substrate; a sealant layer in the peripheral area and between the first display substrate and the second display substrate, configured to seal the first display substrate and the second display substrate together to form a cell; and an elastic support layer in the peripheral area and between the first display substrate and the second display substrate. The elastic support layer encircled by the sealant layer and spaced apart from the sealant layer. The elastic support layer substantially surrounds the display area. The elastic support layer is configured to be in direct contact with the first display substrate and in direct contact with the second display substrate.

Abstract: A transaction method and apparatus based on blind signature are provided. The method includes: a payment client performs blinding processing according to a transaction service parameter and signature data to obtain a blinding result, and sends a first signature request to a currency providing node. The currency providing node receives the first signature request, and signs the blinding result to obtain a first signature result. The currency providing node sends the first signature result to the payment client. The payment client receives the first signature result. The payment client de-blinds the first signature result to obtain a second signature result, and sends the second signature result and the signature data to the payee client. The payee client sends the second signature result and the signature data to the currency providing node. The currency providing node completes a transaction after the signature data and the second signature result are verified successfully.

Abstract: Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned between the lid plate and the substrate support. The gasbox may be characterized by a first surface and a second surface opposite the first surface. The gasbox may define a central aperture. The gasbox may define an annular channel in the first surface of the gasbox extending about the central aperture through the gasbox. The gasbox may include an annular cover extending across the annular channel defined in the first surface of the gasbox. The chamber may include a blocker plate positioned between the gasbox and the substrate support. The chamber may include a ferrite block positioned between the lid plate and the blocker plate.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: Provided is an anti-HER3 humanized monoclonal antibody. The antibody is bound with HER3 antigen, has high affinity and biological activity and low immunogenicity, and is stable in structure. The antibody can be used for preparing drugs for preventing or treating HER3-related diseases.

Abstract: A piston pressure device includes a gas concentration-regulating piston pressure device and a high temperature autoclave. In the gas concentration-regulating piston pressure device, the proportion and concentration of corrosive gases can be accurately adjusted, intermediate gases can be stored and filled into the high temperature autoclave according to experimental needs, and an actual corrosion process in oilfield is accurately simulated. Meanwhile, the corrosive gases can be supplemented in real time during the experiment, and dynamic gas distribution in a high-temperature high-pressure corrosion experiment process is realized.

Abstract: Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm2 and 5 billion cm2.

Abstract: A wireless local area network (WLAN) configuration method and a central access point (AP), where the method includes obtaining, by the central AP, identifiers of a plurality of radio frequency (RF) circuits in a plurality of APs, recording a mapping from the identifiers to the plurality of APs, sending the identifiers to a WLAN controller, receiving respective configurations of the plurality of RF circuits from the WLAN controller, wherein each configuration in the respective configurations of the plurality of RF circuits comprises an identifier of a corresponding RF circuit, and separately sending each configuration in the respective configurations of the plurality of RF circuits to the plurality of APs according to the mapping from the identifiers to the plurality of APs.

Abstract: A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.

Abstract: A method for determining power dissipation within a computer system is disclosed. A circuit block may receive a regulated voltage level on a power supply signal generated by a voltage regulator circuit. A power control circuit may measure a current drawn by the circuit block, and determine a real-time voltage level for the power supply signal using the current and based on a slope value and a zero-load voltage level. Additionally, power control circuit may determine a power dissipation for the circuit block using the current and the real-time voltage level, and adjust an operation parameter of the circuit block based on the power dissipation.

Abstract: A composition for producing a glass fiber, including the following components with corresponding percentage amounts by weight: 54.2-64% SiO2, 11-18% Al2O3, 20-25.5% CaO, 0.3-3.9% MgO, 0.1-2% of Na2O+K2O, 0.1-1.5% TiO2, and 0.1-1% total iron oxides including ferrous oxide (calculated as FeO). The weight percentage ratio C1=FeO/(iron oxides?FeO) is greater than or equal to 0.53. The total content of the above components in the composition is greater than 97%. The invention also provides a glass fiber produced using the composition and a composite material including the glass fiber.

Abstract: A sealing integrity evaluation device for high-temperature and high-pressure casing-cement ring-formation and a method thereof are provided. the device includes: a high-temperature autoclave, a temperature and pressure control system, and a casing-cement-formation combination; wherein the autoclave realizes alternating temperature and pressure during the experiment; the control system monitors, controls and records the temperature and pressure data; the combination simulates a full size or a compact size casing-cement-formation of a well.

Abstract: Methods and apparatus for detecting ultraviolet light are provided herein. For example, an ultraviolet (UV) process chamber includes a vacuum window or a transparent showerhead; a UV light source disposed above one of the vacuum window or the transparent showerhead and configured to generate and transmit UV light into a process volume of the UV process chamber; and a first UV sensor configured to measure at least one of emissivity from the UV light source or irradiance of the UV light transmitted into the process volume and to transmit a signal corresponding to a measured at least one of emissivity from the UV light source or irradiance of the UV light to a controller coupled to the UV process chamber during operation.

Abstract: The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor.