Abstract: Within a method for estimating a microelectronic fabrication product yield and a system for estimating the microelectronic fabrication product yield there is employed a specific mathematic algorithm for estimating yield of a new microelectronic fabrication product within at least one microelectronic fabrication facility. The specific algorithm is solved incident to parametric data correlation with existing production data within the at least one microelectronic fabrication facility.

Abstract: Installing computer software components on a client device for enabling connectivity to a host system by at least one of several different hardware devices typically includes receiving a connectivity component for enabling connectivity to a host system by at least one of several different hardware devices and detecting whether installation of the connectivity component is needed to enable connectivity between the client device and the host system. The connectivity component is typically installed on the client device when installation of the connectivity component is needed.

Abstract: A chemical vapor deposition (CVD) method for forming with enhanced sheet resistance uniformity tungsten silicide layers upon substrates. There is formed upon a first substrate within a chemical vapor deposition (CVD) reactor chamber a first tungsten silicide layer through a chemical vapor deposition (CVD) method. The first substrate is then removed from the chemical vapor deposition (CVD) reactor chamber. The chemical vapor deposition (CVD) reactor chamber is then cleaned with a fluorine containing plasma and subsequently purged with a mixture of silane and an inert gas. There may then be formed with enhanced sheet resistance uniformity upon a second substrate within the chemical vapor deposition (CVD) reactor chamber a second tungsten silicide layer through the chemical vapor deposition (CVD) method.

Abstract: An integrated circuit device interconnect with controlled inductance. An integrated circuit device includes an insulating layer formed on a substrate and a an interconnect disposed on the insulating layer extending along a first path. A dedicated current return path having one end configured to be coupled to ground is disposed on the first insulating layer parallel to the interconnect, such that the signal received by the interconnect is returned to ground via the dedicated current return path when the dedicated current return path is coupled to ground. Inductance of the interconnect is thus controlled by reducing the area of the circuit loop formed by the interconnect and the parallel dedicated current return path. In one embodiment, the dedicated current return path is formed in an embedded ground plane just above or below the first interconnect.

Abstract: The present application features methods and apparatus for making liposomes containing hydrophobic drugs, with critical, supercritical or near critical fluids. The methods and apparatus combine a phospholipid, a drug, and an aqueous phase, or multilamellar vesicles, with a critical, supercritical or near critical fluid. Upon a reduction in pressure, liposomes are formed.

Abstract: This invention provides for a fiber optic moisture sensor. The sensor is comprised of a housing and a support positioned within the housing. The support is coated with a film. A first and second light guides are positioned within the housing and communicate illumination to and from the film. A reflective surface is positioned within the housing facing the film. The film comprises an optically transparent polymer and a salt complex of a metal ion and an organic compound. The salt complex is capable of absorbing moisture and emits a fluorescence signal when excited by light at the appropriate wavelength. The fluorescence signal can be quenched when the salt complex absorbs moisture. An apparatus incorporating the sensor and a method of making the sensor are also provided.

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates.

Abstract: This invention provides for a fiber optic moisture sensor. The sensor is comprised of a housing and a support positioned within the housing. The support is coated with a film. A first and second light guides are positioned within the housing and communicate illumination to and from the film. A reflective surface is positioned within the housing facing the film. The film comprises an optically transparent polymer and a salt complex of a metal ion and an organic compound. The salt complex is capable of absorbing moisture and emits a fluorescence signal when excited by light at the appropriate wavelength. The fluorescence signal can be quenched when the salt complex absorbs moisture. An apparatus incorporating the sensor and a method of making the sensor are also provided.

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction.

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates.