Abstract: An ultrasound imaging and therapy system is provided that includes an ultrasound probe and a diagnostic module to control the probe to obtain diagnostic ultrasound signals from a region of interest (ROI) of the patient. The ROI includes adipose tissue and the diagnostic module generates a diagnostic image of the ROI based on the ultrasound signals obtained. The system also includes a display to display the image of the ROI and a user interface to accept user inputs to designate a treatment space within the ROI that corresponds to the adipose tissue. The display displays the treatment space on the image. The system also includes a therapy module to control the probe to deliver, during a therapy session, a therapy to a treatment location based on a therapy parameter. The treatment location is within the treatment space defined by the user inputs.

Abstract: An ultrasound probe includes a transducer comprising an array of transducer elements removably disposed in a head portion. At least one or more stages of electronic circuit units is removably coupled to the transducer and configured to excite the transducer. A handle portion is detachably coupled to the head portion. The head portion and the handle portion are disposed enclosing the at least one or more stages of electronic circuit units. The ultrasound probe is used for one dimensional applications, two dimensional applications, and volumetric applications.

Abstract: A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

Abstract: The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue.

Abstract: A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

Abstract: A capacitive micromachined ultrasound transducer (cMUT) cell is presented. The cMUT cell includes a lower electrode. Furthermore, the cMUT cell includes a diaphragm disposed adjacent to the lower electrode such that a gap having a first gap width is formed between the diaphragm and the lower electrode, wherein the diaphragm comprises one of a first epitaxial layer or a first polysilicon layer. In addition, a stress reducing material is disposed in the first epitaxial layer.

Abstract: A transfer system for a carrier that features a flow supply tube in fluid communication with a flow supply generator and in fluid communication with a carrier transport tube network dimensioned for transfer reception of the carrier. The carrier transport tube network has a first carrier reception chamber provided with a first carrier stop point and a second carrier reception chamber with second carrier stop point. The flow supply tube has a single point contact with the carrier transport tube network to provide a single tube based flow connection with the carrier transport. Also, with the single point connection there can be positioned a brake valve in line with a first section of the carrier transport tube network and in line with a first section of said flow supply tube just a few feet above the stop point of one or both of the reception chambers to provide for rapid travel to the brake valve and efficient braking within just a few feet of the stop point.

Abstract: The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.

Abstract: An access chamber assembly for use in a pneumatic transport system with a sealing arrangement that provides an intended bearing clearance relative to an access door device which is rotated between an open, access state and a closed state. The bearing clearance allows for radial adjustment of the door while being rotated between states of being fully closed and fully open to avoid binding and seal friction noise.

Abstract: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface.

Abstract: A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.

Abstract: A micromachined ultrasonic transducer array comprising a multiplicity of cMUT cells built on a substrate. Each cMUT cell comprises a compliant support structure built on the substrate, a membrane supported over a cavity by the compliant support structure, a first electrode supported by the membrane, and a second electrode that forms a capacitor with the first electrode, the cavity being disposed between the first and second electrodes. The compliant support structure uncouples the non-membrane outer surface of each cMUT cell from the supporting substrate.

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract: The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.

Abstract: A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses.

Abstract: A curved sensor device, such as an ultrasonic transducer array, is fabricated from a flat micromachined sensor (such as cMUT or pMUT) array constructed using micromachined electro-mechanical systems (MEMS) techniques. The device comprises: a support structure comprising a spine having a profile that is generally curved and a multiplicity of teeth extending from one side of the curved spine; and a multiplicity of sensors built on the support structure. The spine can be bent forward or backward and attached to a curved front face of a support member, thereby causing the sensors to adopt a curved array.

Abstract: A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers.

Abstract: Self-tapping screw for small-bone surgery, includes a threaded proximal head (2), a threaded distal shank with greater pitch and an internal cannula (4), characterized in that the distal shank (3) is threaded over its entire length in that the end of the shank has, apart from milled portions forming self-tapping faces on the first distal threads, at least two milled faces and which with the cannula, determine at least two notches (11), and at least two self-boring edges at the distal end of the screw, and in that the thread of the head has, aside from milled portions forming self-tapping faces on the first threads of the proximal screw thread, chamfered faces (16–19), determining boring edges (12b–15b) preceded by a short groove.

Abstract: A capacitive micromachined ultrasound transducer (cMUT) cell is presented. The cMUT cell includes a lower electrode. Furthermore, the cMUT cell includes a diaphragm disposed adjacent to the lower electrode such that a gap having a first gap width is formed between the diaphragm and the lower electrode, wherein the diaphragm comprises one of a first epitaxial layer or a first polysilicon layer. In addition, a stress reducing material is disposed in the first epitaxial layer.

Abstract: A micromachined ultrasonic transducer array comprising a multiplicity of cMUT cells built on a substrate. Each cMUT cell comprises a compliant support structure built on the substrate, a membrane supported over a cavity by the compliant support structure, a first electrode supported by the membrane, and a second electrode that forms a capacitor with the first electrode, the cavity being disposed between the first and second electrodes. The compliant support structure uncouples the non-membrane outer surface of each cMUT cell from the supporting substrate.