Abstract: A matching layer for ultrasound transducers has a gradient in impedance value from one surface to the other surface of the matching layer. The matching layer is composed of a plurality of sublayers made of composite materials and securely attached together and is disposed on the surface of the transducer element. The first sublayer adjacent to the transducer element has an impedance value less than or equal to that of the transducer element. The last sublayer adjacent to the target has an impedance value greater than or equal to that of the target. The impedance values of the sublayers decrease monotonically from the first to the last sublayer.

Abstract: An ultrasound transducer array includes a multiplicity of subelements interconnected by a multiplicity of microelectronic switches, each subelement comprising a respective multiplicity of micromachined ultrasound transducer (MUT) cells. The MUT cells within a particular subelement are hard-wired together. The switches are used to configure the subelements to form multiple concentric annular elements. This design dramatically reduces complexity while enabling focusing in the elevation direction during ultrasonic image data acquisition.

Abstract: RD-28,709 22An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface.

Abstract: Device for securing bits of bone together, particularly small-sized bits of bone, for example bits of metatarsal head, in the form of a spindle comprising an elongate shank (1) followed, after a breakable region (2), by a fixator element (3) extending frustoconically to reduce in diameter in the direction of the anterior end (4), with a screw thread the pitch of which decreases progressively from the anterior end and of which the crests of the thread lie inside a coaxial geometric cylinder (D), the anterior end forming a self-drilling end.

Abstract: An ultrasound transducer element incorporates material of low dielectric constant to confine the electric field of a stack of piezoelectric ceramic layers. Edge segments made of material having a low dielectric constant and extending in the thickness direction are formed at opposing ends of the multilayer structure. These regions of low dielectric constant material confine the electric field to the piezoelectric ceramic material of high dielectric constant, where it remains directed vertically. In this way, when a voltage is applied between the electrodes, the piezoelectrically induced strains are almost entirely vertical. Spurious modes are therefore substantially reduced.

Abstract: Device for securing bits of bone together, particularly small-sized bats of bone, for example bits of metatarsal head, in the form of a spindle including an elongate shank (1) followed, after a breakable region (2), by a fixator element (3) extending frustoconically to reduce in diameter in the direction of the anterior end (4), with a screw thread the pitch of which decreases progressively from the anterior end and of which the crests of the thread lie inside a coaxial geometric cylinder (D), the anterior end forming a self-drilling end.

Abstract: A device comprising an array of sensors built on or in a substrate with a semiconducting surface and means for isolating each sensor element from its neighbors. In the case where the sensors are ultrasonic transducer elements, acoustic isolation is provided in the form of trenches between neighboring transducer elements to reduce acoustic crosstalk. The trenches may be filled with acoustically attenuative material. Electrical isolation in the form of semiconductive junctions is provided between neighboring transducer elements to reduce electrical crosstalk. In one example, back-to-back pn junction diodes are formed by ion implantation in zones located between neighboring transducer elements. These types of isolation can be employed alone or together.

Abstract: An ultrasound transducer array includes a multiplicity of subelements interconnected by a multiplicity of microelectronic switches, each subelement comprising a respective multiplicity of micromachined ultrasound transducer (MUT) cells. The MUT cells within a particular subelement are hard-wired together. The switches are used to configure the subelements to form multiple concentric annular elements. This design dramatically reduces complexity while enabling focusing in the elevation direction during ultrasonic image data acquisition.

Abstract: RD-28,709 22An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface.

Abstract: An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.

Abstract: A high-density cable of a type suitable for transmitting ultrasound signals from an ultrasonic probe to multiplexing circuitry during a medical ultrasound procedure is provided. The cable includes one or more flexible circuits arranged within a flexible sheath that surrounds and confines the flexible circuits. Each flexible circuit includes an elongate flexible substrate with oppositely-disposed surfaces and multiple conductors on at least one of these surfaces. The opposing longitudinal ends of the substrate define integral connectors for connecting with respective output connectors and/or electronic devices, such as an ultrasonic probe or multiplexing circuitry.

Abstract: Device for securing bits of bone together, particularly small-sized bits of bone, for example bits of metatarsal head, in the form of a spindle comprising an elongate shank (1) followed, after a breakable region (2), by a fixator element (3) extending frustoconically to reduce in diameter in the direction of the anterior end (4), with a screw thread the pitch of which decreases progressively from the anterior end and of which the crests of the thread lie inside a coaxial geometric cylinder (D), the anterior end forming a self-drilling end.

Abstract: An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.

Abstract: Self-tapping screw for small-bone surgery, comprising a threaded proximal head (2), a threaded distal shank with greater pitch and an internal cannula (4), characterized in that the distal shank (3) is threaded over its entire length in that the end of the shank has, apart from milled portions forming self-tapping faces on the first distal threads, at least two milled faces and which with the cannula, determine at least two notches (11) and at least two self-boring edges at the distal end of the screw, and in that the thread of the head has, aside from milled portions forming self-tapping faces on the first threads of the proximal screw thread, chamfered faces (16-19), determining boring edges (12b-15b) preceded by a short groove.

Abstract: An ultrasonic probe optically coupled to an electronic console comprises a multiplicity of transducer elements. Each transducer element is capable of transmitting and detecting ultrasound waves. Each transducer element constitutes a piezocomposite structure comprising mutually parallel rods of two types embedded in a passive polymer matrix: piezoelectric rods and micro-cavity laser rods. The piezoelectric rods are optically activated to generate an acoustic compression wave transmitted from the front face of the piezocomposite structure. The micro-cavity lasers produce a frequency-modulated optical signal having a frequency shift which is a function of a strain produced in the lasing medium by a returning acoustic wave impinging on the piezocomposite structure.

Abstract: A matching layer for ultrasound transducers has a gradient in impedance value from one surface to the other surface of the matching layer. The matching layer is composed of a plurality of sublayers made of composite materials and securely attached together and is disposed on the surface of the transducer element. The first sublayer adjacent to the transducer element has an impedance value less than or equal to that of the transducer element. The last sublayer adjacent to the target has an impedance value greater than or equal to that of the target. The impedance values of the sublayers decrease monotonically from the first to the last sublayer.

Abstract: An ultrasonic probe optically coupled to an electronic console comprises a multiplicity of transducer elements. Each transducer element is capable of transmitting and detecting ultrasound waves. Each transducer element constitutes a piezocomposite structure comprising mutually parallel rods of two types embedded in a passive polymer matrix: piezoelectric rods and micro-cavity laser rods. The piezoelectric rods are optically activated to generate an acoustic compression wave transmitted from the front face of the piezocomposite structure. The micro-cavity lasers produce a frequency-modulated optical signal having a frequency shift which is a function of a strain produced in the lasing medium by a returning acoustic wave impinging on the piezocomposite structure.

Abstract: The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers.

Abstract: The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers.

Abstract: Method for forming an ultrasonic phased array transducer with an ultralow impedance backing. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers.