Patents by Inventor Lu LIN

Lu LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963173
    Abstract: The embodiment of the present disclosure relates to a data transmission method and a terminal device. The method includes if a terminal device determines, according to first configuration information, to perform a first type of transmission on a target transmission resource, and determines, according to second configuration information, to perform a second type of transmission on the target transmission resource, the terminal device determines whether the first type of transmission or the second type of transmission is a target type of transmission according to a first preset rule, wherein the first type of transmission is sidelink transmission between the terminal device and another terminal device, and the second type of transmission is uplink transmission or downlink transmission between the terminal device and a network device; and performing data transmission on the target transmission resource by using the target type of transmission.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: April 16, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Zhenshan Zhao, Huei-Ming Lin, Qianxi Lu
  • Patent number: 11950234
    Abstract: A method for determining a sidelink type, a terminal device, and a network device are provided. The method comprises: receiving downlink control information (DCI) sent by a network device; determining, on the basis of the DCI, a first type of sidelink or a second type of sidelink as a target sidelink according to a preset rule, the first type of sidelink being different from the second type of sidelink in configuration parameters; and using the target sidelink to perform data transmission of the sidelink.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: April 2, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Qianxi Lu, Huei-Ming Lin
  • Publication number: 20240105849
    Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.
    Type: Application
    Filed: February 10, 2023
    Publication date: March 28, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Da-Zhi ZHANG, Chun-An LU, Chung-Yu CHIANG, Po-Nien CHEN, Hsiao-Han LIU, Jhon-Jhy LIAW, Chih-Yung LIN
  • Patent number: 11938508
    Abstract: A glue dispenser dispensing switch includes a switching device main body, a needle holding base, a wear-resistant plate, and a rotating device. The switching device main body is equipped with a double liquid inlet, the needle holding base is equipped with a mixed glue outlet, the wear-resistant plate is installed between the switching device main body and the needle holding base, and the wear-resistant plate is equipped with a wear-resistant plate opening. The rotating device is utilized to rotate the needle holding base or the wear-resistant plate. A mixed double-liquid glue passes through the double liquid inlet, the wear-resistant plate opening and the glue outlet to dispense a mixed glue while the double liquid inlet, the wear-resistant plate opening and the glue outlet are overlapped. In addition, a double liquid dispensing equipment is also disclosed herein.
    Type: Grant
    Filed: August 8, 2021
    Date of Patent: March 26, 2024
    Assignee: Kulicke and Soffa Hi-Tech Co., Ltd.
    Inventors: Lu-Min Chen, Mu-Huang Liu, Tsung-Lin Tsai
  • Patent number: 11943097
    Abstract: Disclosed is a parameter configuration method, comprising: a second terminal device sending a first parameter combination to a first terminal device, or the first terminal device sending a second parameter combination to the second terminal device, wherein the first parameter combination and the second parameter combination are both used for indicating a sidelink data sending parameter of the second terminal device and/or a sidelink data receiving parameter of the second terminal device. Further disclosed are a terminal device and a storage medium.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: March 26, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Qianxi Lu, Zhenshan Zhao, Huei-Ming Lin
  • Patent number: 11938509
    Abstract: A glue dispensing device comprises a base, a pressure control unit, a quantitative glue supply unit and a glue dispensing needle. The base comprises a pressure control chamber and a glue tube body, the pressure control chamber is located inside the base, the glue tube body extends from one end of the base to the other end, and the glue tube body penetrates the pressure control chamber. The pressure control unit is coupled to the pressure control chamber. The quantitative glue supply unit is disposed at one end of the base body and is coupled to the glue tube body. The glue dispensing needle is disposed at the other end of the base and is coupled to the glue tube body. The glue dispensing device uses the pressure change of the pressure control chamber to deform the glue tube body, thereby achieving quantitative glue dispensing effect with accuracy and stability. In addition, a glue dispensing method is also disclosed.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: March 26, 2024
    Assignee: Kulicke and Soffa Hi-Tech Co Ltd.
    Inventors: Lu-Min Chen, Tsung-Lin Tsai
  • Patent number: 11943064
    Abstract: Methods and devices for transmission of feedback information and methods and devices for data retransmission are provided. A method for transmission of feedback information includes the following. A second terminal device send first data to a first terminal device through device to device (D2D) communication. The second terminal device obtains a retransmission resource. The second terminal device retransmit the first data to the first terminal device on the retransmission resource through D2D communication, according to feedback information of the first terminal device responsive to the first data.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 26, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Qianxi Lu, Zhenshan Zhao, Huei-Ming Lin
  • Publication number: 20240096961
    Abstract: A contact stack of a semiconductor device includes a source/drain feature, a silicide layer wrapping around the source/drain feature, a seed metal layer in direct contact with the silicide layer, and a conductor in contact with the seed metal layer. The contact stack excludes a metal nitride layer in direct contact with the silicide layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Shih-Chuan CHIU, Tien-Lu LIN, Yu-Ming LIN, Chia-Hao CHANG, Chih-Hao WANG, Jia-Chuan YOU
  • Publication number: 20240098749
    Abstract: Embodiments of the present application provide a control information transmission method and apparatus, a resource configuration method and apparatus, and a communication device. The method comprises: transmitting first control information between a first terminal and a second terminal, the first control information being borne on a first control channel and used for scheduling transmission of a first data channel, and the first data channel being used for transmitting data between the first terminal and the second terminal, wherein the first control channel and the first data channel perform time division transmission.
    Type: Application
    Filed: October 23, 2023
    Publication date: March 21, 2024
    Inventors: Qianxi LU, Huei-Ming LIN
  • Patent number: 11937154
    Abstract: A user equipment (UE), a base station (BS), and a method of vehicle-to-everything (V2X) communication of same are provided. The method of V2X communication of the UE includes receiving at least one network V2X configuration information relating at least one V2X operation from the BS, generating at least one V2X data, and triggering to send, to the BS, at least one UE assistance information (UEAI) using the at least one network V2X configuration information as a scheduling request indication (SRI) when the UE has the at least one V2X data to be transmitted.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: March 19, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Huei-Ming Lin, Zhenshan Zhao, Qianxi Lu
  • Patent number: 11937239
    Abstract: Disclosed in embodiments of the present disclosure are a sidelink communication method and a terminal device. The method includes a first terminal device receives sidelink control information (SCI) transmitted from a second terminal device; and the first terminal device obtains information of a sidelink reference signal according to the SCI.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: March 19, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Zhenshan Zhao, Qianxi Lu, Huei-Ming Lin
  • Patent number: 11935601
    Abstract: Memories, memory controllers, and computing systems and their methods of operation are disclosed. In some embodiments, a method of accessing a memory includes accessing a first bit line corresponding to a sense amplifier and accessing a second bit line corresponding to the sense amplifier. In some embodiments, a memory controller includes a second memory configured to store data of a second data type. In some embodiments, a method includes operating a memory in a second mode in response to receiving an input to change the operation of the memory from a first mode to the second mode.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: March 19, 2024
    Assignee: SuperMem, Inc.
    Inventors: Yu Lu, Chieh-yu Lin
  • Publication number: 20240086625
    Abstract: An information processing method and apparatus, a terminal, and a storage medium. The information processing method comprises: determining first content in response to a first operation event of a first control in a first document (S11); and adding the first content to the first document on the basis of content information and type information of the first content (S12). The type information comprises first type information and/or second type information, the second type information having an association with the first type information. In the described method, first content can be added to a first document according to content information and type information of the first content, so as to distinguish different ways of adding the first content.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Lu ZHANG, Wenzong MA, Xinlei GUO, Xiaolin FANG, Hao HUANG, Liang CHEN, Lanjin ZHOU, Linghui ZHOU, Yingtao LIU, Dirun HUANG, Xuebing ZENG, Zejian LIN, Yingjie YOU, Yunzhao TONG, Yuxiang CHEN, Jiawei CHEN
  • Publication number: 20240085005
    Abstract: Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Inventors: Sean Tham, Peter Vancorenland, Michael Sabolcik, Voravit Puvanakijjakorn, Jonathan Ian Hoffman, Dimauro Andrade Edwards, Dunping Hu, Jianqiu Hu, Lu Zhongliang, Zou Sikang, Li Renyun, Du Lin, Zhou Wenjie, Wu Chong, Wu Limei, Gong Xingping, Li Jinqiang
  • Patent number: 11930504
    Abstract: A data transmission method and a terminal device are disclosed, which may solve the data transmission problems of a sidelink when the size of a time unit of a downlink and the size of a time unit of the sidelink are not the same. The method includes that a terminal device receives first control information sent by a network device, and determines a sending time for sidelink data according to the first control information.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 12, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Qianxi Lu, Huei-Ming Lin
  • Patent number: 11924965
    Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu, Jun He
  • Publication number: 20240071790
    Abstract: A multi-function device includes a machine base, a plurality of horizontal bars, at least one gantry, a plurality of processing units and at least one first conveying uni. The horizontal bars are disposed at the top of the machine base. The gantry is disposed on the machine base and disposed over the horizontal bars. The processing unit is disposed on the horizontal bars and the gantry. The first conveying unit is disposed on the machine base. Each processing unit is a processing device capable of being replaced according to actual requirements, such as a soldering flux device, a soldering device, a sucking device, a glue dipping device, a glue dispensing device, a detecting device, a cleaning device or other processing devices. The present invention can integrate different types of manufacturing devices into one device, and the quantities of the horizontal bars and the modules thereof are not limited.
    Type: Application
    Filed: September 26, 2022
    Publication date: February 29, 2024
    Inventors: Lu-Min Chen, Tsung-Lin Tsai
  • Publication number: 20240068648
    Abstract: Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 29, 2024
    Inventors: Sean Tham, Peter Vancorenland, Michael Sabolcik, Voravit Puvanakijjakorn, Jonathan Ian Hoffman, Dimauro Andrade Edwards, Dunping Hu, Jianqiu Hu, Lu Zhongliang, Zou Sikang, Li Renyun, Du Lin, Zhou Wenjie, Wu Chong, Wu Limei, Gong Xingping, Li Jinqiang
  • Patent number: 11908744
    Abstract: Semiconductor device structures are provided. The semiconductor device structure includes a substrate and a first fin structure protruding from the substrate. The semiconductor device structure further includes an isolation layer formed around the first fin structure and covering a sidewall of the first fin structure and a gate stack formed over the first fin structure and the isolation layer. The semiconductor device structure further includes a first source/drain structure formed over the first fin structure and spaced apart from the gate stack and a contact structure formed over the first source/drain structure. The semiconductor device structure includes a dielectric structure formed through the contact structure. In addition, the contact structure and the dielectric structure has a first slope interface that slopes downwardly from a top surface of the contact structure to a top surface of the isolation layer.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Lin-Yu Huang, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20240055351
    Abstract: An interconnect structure including a dielectric structure, plugs, and conductive lines is provided. The dielectric structure is disposed on a substrate. The plugs are disposed in the dielectric structure. The conductive lines are disposed in the dielectric structure and are electrically connected to the plugs. The sidewall of at least one of the conductive lines is in direct contact with the dielectric structure.
    Type: Application
    Filed: September 13, 2022
    Publication date: February 15, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shou-Zen Chang, Mei Ling Ho, Tien-Lu Lin, Ming-Han Liao, Chia-Ming Wu, Jui-Neng Tu