Patents by Inventor Lu LIN

Lu LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12266566
    Abstract: A method includes forming a first conductive feature on a substrate, forming a via that contacts the first conductive feature, the via comprising a conductive material, performing a Chemical Mechanical Polishing (CMP) process to a top surface of the via, depositing an Interlayer Dielectric (ILD) layer on the via, forming a trench within the ILD layer to expose the via, and filling the trench with a second conductive feature that contacts the via, the second conductive feature comprising a same material as the conductive material.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: April 1, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Yuan Chen, Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin
  • Patent number: 12265468
    Abstract: A method for performing access management of a memory device in a predetermined communications architecture with aid of automatic parameter setting and associated apparatus are provided. The method includes: utilizing the memory controller to set at least one write booster static parameter of a write booster function of the memory device; utilizing the memory controller to perform device initialization corresponding to at least one initialization phase of the memory device; and after completing the device initialization corresponding to the at least one initialization phase, performing at least one adaptive flag-setting operation, for setting at least one write booster flag among a plurality of write booster flags of the write booster function, wherein the at least one write booster flag includes a first write booster flag acting as a write booster switch. The adaptive flag-setting operation includes setting the first write booster flag to enable the write booster function by default.
    Type: Grant
    Filed: September 4, 2023
    Date of Patent: April 1, 2025
    Assignee: Silicon Motion, Inc.
    Inventors: Lu-Ting Wu, Shen-Ting Chiu, Te-Kai Wang, Po-Lin Wu
  • Publication number: 20250103780
    Abstract: This application provides a method for evaluating a running state of a bridge using a finite element pilot-based deep learning proxy model, belonging to the field of online simulation technologies of bridge structures. The method includes: S1:establishing a finite element simulation model; S2: obtaining vehicle load information according to vehicle positions, number plate information, and axle load-number plate information, obtaining environment load information according to temperature, humidity, and wind speed and direction information of the bridge, and obtaining vehicle-environment load information based on the vehicle load information and the environment load information; S3: adaptively training a finite element pilot-based deep learning neural network proxy model; and S4: inputting the vehicle-environment load information into a finite element pilot-based deep learning neural network proxy model, and outputting a real-time structural state of running of the bridge.
    Type: Application
    Filed: November 18, 2024
    Publication date: March 27, 2025
    Inventors: XIAOCHUN ZHANG, TAO LIN, XING LIU, ANXIN MENG, ZIYI ZHOU, ZHENWU CHEN, LEI JIA, LU GUO
  • Patent number: 12262405
    Abstract: A data transmission method, a data transmission device, non-transitory computer readable medium, and a chip for sidelink communication.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: March 25, 2025
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Huei-Ming Lin, Zhenshan Zhao, Qianxi Lu
  • Patent number: 12262407
    Abstract: The present application discloses a channel quality feedback method and apparatus. The method includes: a first terminal receives indication information sent by a second terminal, where the indication information is used to instruct the first terminal to send a channel quality indicator and/or a rank indicator to the second terminal. The first terminal generates a media access control layer control element (MAC CE), where the MAC CE includes the channel quality indicator and/or the rank indicator. The first terminal sends the MAC CE to the second terminal. The first terminal sends the MAC CE including the channel quality indicator and/or the rank indicator to the second terminal, so that the channel quality feedback of the first terminal to the second terminal is completed through the channel quality indicator and/or the rank indicator, thereby realizing the channel quality feedback between terminals.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: March 25, 2025
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Qianxi Lu, Zhenshan Zhao, Huei-Ming Lin
  • Publication number: 20250096460
    Abstract: An adjustable antenna array and an electronic apparatus are provided. The adjustable antenna array includes: a first substrate and a second substrate opposite to each other, and antenna sub-arrays in an array. Each of at least some antenna sub-arrays includes a phase shifter, a power division feeding network, and a plurality of radiating units. The phase shifter and the power division feeding network are between the first substrate and the second substrate. At least some radiating units are connected to the phase shifter through the power division feeding network. Antenna patterns corresponding to the plurality of radiating units at least include patterns on a side of the second substrate away from the first substrate. An area of an orthographic projection of the power division feeding network on the first substrate is smaller than an area of an orthographic projection of the phase shifter on the first substrate.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 20, 2025
    Inventors: Lu CHEN, Xiaoqiang YANG, Yiming WANG, Zixiang LIN, Wei ZHAO, Cuiwei TANG, Zhifeng ZHANG
  • Publication number: 20250090644
    Abstract: Provided is an E. coli expressed recombinant human microplasmin (E-?Plm), a production method thereof, a pharmaceutical composition and a kit comprising thereof, an application of the pharmaceutical composition and the kit in treating thromboembolism related diseases and a method of treating thromboembolism related diseases by using the pharmaceutical composition and the kit. The zymogen version of the E-?Plm or E-?Plg is unstable and can undergo autoactivation. Moreover, the in vivo half-life of the E-?Plm is significantly shorter than yeast expressed microplasmin (Y-?Plm), which allows the E-?Plm, the pharmaceutical composition and the kit effective in treating thromboembolism diseases but with reduced bleeding side effects.
    Type: Application
    Filed: September 27, 2024
    Publication date: March 20, 2025
    Inventors: Xinli Henry LIN, Yundong WU, Zhengchang LU
  • Publication number: 20250085952
    Abstract: The present disclosure provides a method for facilitating provisioning of software solutions. Further, the method includes obtaining input data. Further, the input data includes natural language input data. Further, the method includes analyzing the input data using each of a prompt model and a large language model. Further, the prompt model is coupled with the large language model. Further, the large language model is trained on a training data. Further, the prompt model interprets input data for generating requirements of the users. Further, the large language model processes the requirements for designing the software solutions. Further, the method includes generating software solution information for the provisioning of software solutions based on the analyzing of the input data. Further, the method includes transmitting the software solution information to devices. Further, the method includes storing the software solution information and each of the prompt model and the large language model.
    Type: Application
    Filed: September 9, 2024
    Publication date: March 13, 2025
    Inventors: David Dong Lin, Yangdi Lu, Yunfan Ma
  • Publication number: 20250089053
    Abstract: The present disclosure provides an information reporting method and apparatus, and a terminal and a readable storage medium. The method includes: a sending end obtains a period of transmission resources configured and authorized by a network; transmit a transmission block to a receiving end based on the transmission resources, the transmission resources being used for transmitting a same transmission block or a plurality of different transmission blocks; report a preset information quantity of report information to the network according to a transmission status and/or a feedback status of the receiving end.
    Type: Application
    Filed: November 26, 2024
    Publication date: March 13, 2025
    Inventors: Zhenshan ZHAO, Qianxi LU, Huei-Ming LIN
  • Publication number: 20250081170
    Abstract: Implementations of the present application provide a wireless communication method and a terminal device, which can avoid a communication conflict between a side link and an uplink and a downlink, thereby improving the communication performance on the side link and the uplink and the downlink. The wireless communication method includes: a first terminal device receiving first information sent by a second terminal device, wherein the first information is used to indicate first resources and/or second resources, the first resources are resources used by the second terminal device to perform cellular communication, and the second resources are resources used by the second terminal device to perform sidelink communication with a third terminal device; and the first terminal device performing, on resources other than the resources indicated by the first information, sidelink communication with the second terminal device.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 6, 2025
    Inventors: Qianxi LU, Zhenshan ZHAO, Huei-Ming LIN
  • Publication number: 20250081186
    Abstract: Disclosed are an information transmission method, a terminal device, and a non-transitory computer readable storage medium. The method includes: when a sidelink (SL) Buffer Status Report (BSR) is triggered by an event, and when a first condition is met, a scheduling request (SR) is triggered.
    Type: Application
    Filed: November 15, 2024
    Publication date: March 6, 2025
    Inventors: Qianxi LU, Zhenshan ZHAO, Huei-Ming LIN
  • Publication number: 20250081593
    Abstract: Methods of manufacturing electronic devices, such as transistors (negative metal-oxide-semiconductor (NMOS) transistors (e.g., an N-metal stack) and positive metal-oxide-semiconductor (PMOS) transistors (e.g., a P-metal stack)) are described. Embodiments of the disclosure are directed to methods of improving PMOS transistor performance by inhibiting N-metal layer growth. The present disclosure provides two types of processes to reduce or inhibit N-metal layer growth. The disclosure provides methods which include forming a self-assembled monolayer (SAM) on the metal surface (e.g., titanium nitride (TiN)) of the PMOS, and methods which include forming a silicon-containing layer such as silicon oxide (SiOx) on the TiN surface. These two types of processes significantly reduce or inhibit the subsequent growth of an N-metal layer, such as titanium aluminum carbide (TiAlC), on the TiN surface of the PMOS.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 6, 2025
    Applicant: Applied Materials ,Inc
    Inventors: Yongjing Lin, Zhihui Liu, Sourav Garg, Lu Li, Haoming Yan, Haoyan Sha, Bhaskar Jyoti Bhuyan, Shih Chung Chen, Janardhan Devrajan, Srinivas Gandikota
  • Patent number: 12243805
    Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jian-Hong Lin, Hsin-Chun Chang, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu
  • Publication number: 20250066485
    Abstract: The present invention provides methods and compositions for treating a lung or heart disease and/or a disease associated with increased expression or activity of integrin ?5?1, comprising administering an integrin ?5?1, inhibitor to a subject. Methods of treating or preventing pulmonary hypertension, pulmonary arterial hypertension (PAH), right ventricle failure, heart failure and fibrosis are also provided herein.
    Type: Application
    Filed: November 12, 2024
    Publication date: February 27, 2025
    Inventors: Adrian S. Ray, Monica Montesinos, Hua Wang, Min Lu, Fu-Yang Lin
  • Publication number: 20250067149
    Abstract: A method may include receiving input for a multiwell structure and subsurface target locations, where the multiwell structure includes slots; generating, based at least in part on the input, a position for the multiwell structure, slot-well assignments for the slots, and well trajectories, where each of the well trajectories extends from an assigned one of the slots to one or more of the subsurface target locations; and outputting a set of specifications for the position for the multiwell structure, the well trajectories, and an order for drilling the well trajectories.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Qing Liu, Xin Qiu, Lu Jiang, Peng Jin, Zhenyu Chen, Hai Feng Li, Zhen Fan, Lei Zhu, Xue Lin, Wanqiang Li, Can Jin, Wei Li
  • Publication number: 20250072290
    Abstract: Embodiments herein are generally directed to a system and process for manufacturing temperature measurement devices for use in semiconductor and display manufacturing. A bifurcated thermocouple substrate is provided and includes a primary substrate with a substrate aperture, a secondary substrate disposed within the substrate aperture, and a thermocouple disposed within a thermocouple aperture of the secondary substrate.
    Type: Application
    Filed: August 20, 2024
    Publication date: February 27, 2025
    Inventors: Aaron LU, William CHANG, Jacky J. LIN, Hsiang AN
  • Patent number: 12238754
    Abstract: A method and terminal device for sidelink data transmission is provided. The method includes: when a terminal device determines, according to first configuration information, to receive a first sidelink transmission channel on a target transmission resource, and determines, according to second configuration information, to transmit a second sidelink transmission channel on the target transmission resource, receiving the first sidelink transmission channel or transmitting the second sidelink transmission channel on the target transmission resource, by the terminal device, according to a first rule. According to the method and terminal device for sidelink data transmission of the disclosure, whether to transmit or to receive data is determined according to priorities of data, or transmission modes, or allocation modes of the resource, or the like when the terminal device is configured to both transmit and receive data, so as to solve the problem of sidelink transmission conflicts of terminal device.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: February 25, 2025
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Zhenshan Zhao, Qianxi Lu, Huei-Ming Lin
  • Patent number: 12234395
    Abstract: The present invention provides a pressure-sensitive adhesive composition, including: an acrylic copolymer and a crosslinking agent. The acrylic copolymer is a reaction product of a mixture of the following monomers: a first alkyl (meth)acrylate, an alkyl group in the first alkyl (meth)acrylate having at least 6 carbon atoms; a second alkyl (meth)acrylate, an alkyl group in the second alkyl (meth)acrylate having 1 to 5 carbon atoms; and a vinyl carboxylic acid, the weight ratio of the vinyl carboxylic acid to the mixture being 4% to 5%. The crosslinking agent is an organometallic chelating agent. The weight ratio of the organometallic chelating agent to the mixture is 0.05% to 0.25%. The pressure-sensitive adhesive composition does not contain an effective amount of a tackifier. The present invention further provides a pressure-sensitive adhesive solution, a pressure-sensitive adhesive tape, and a method for preparing the same.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: February 25, 2025
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Weina Wang, Lu Shen, Yunshu Zhang, Yu Che, Panpan Lin, Heng Liu, Xiaohai Sheng, Shupeng Wu, Xiangming Yang
  • Patent number: 12227874
    Abstract: Methods for determining suitability of Czochralski growth conditions to produce silicon substrates for epitaxy. The methods involve evaluating substrates sliced from ingots grown under different growth conditions (e.g., impurity profiles) by imaging the wafer by infrared depolarization. An infrared depolarization parameter is generated for each epitaxial wafer. The parameters may be compared to determine which growth conditions are well-suited to produce substrates for epitaxial and/or post-epi heat treatments.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: February 18, 2025
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Zheng Lu, Shan-Hui Lin, Chun-Chin Tu, Chi-Yung Chen, Feng-Chien Tsai, Hong-Huei Huang
  • Publication number: 20250056862
    Abstract: A method includes forming a dummy gate over a substrate. A first gate spacer is formed on a sidewall of the dummy gate. The dummy gate is replaced with a gate structure. A top portion of the first spacer is removed. After the top portion of the first spacer is removed, a second spacer is over the first spacer. The second spacer has a stepped bottom surface with an upper step in contact with a top surface of the first spacer and a lower step lower than the top surface of the first spacer. A contact plug is formed contacting the gate structure and the second spacer.
    Type: Application
    Filed: October 30, 2024
    Publication date: February 13, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jia-Chuan YOU, Chia-Hao CHANG, Tien-Lu LIN, Yu-Ming LIN, Chih-Hao WANG