Patents by Inventor Lu Yi

Lu Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160233194
    Abstract: A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric layer; an electronic element disposed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; a plurality of conductive posts formed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; and an encapsulant formed on the first surface of the dielectric layer and encapsulating the electronic element and the conductive posts. Upper surfaces of the conductive posts are exposed from the encapsulant so as to allow another electronic element to be disposed on the conductive posts and electrically connected to the circuit sub-layer through the conductive posts, thereby overcoming the conventional drawback that another electronic element can only be disposed on a lower side of a package structure and improving the functionality of the package structure.
    Type: Application
    Filed: December 31, 2015
    Publication date: August 11, 2016
    Inventors: Lu-Yi Chen, Chang-Lun Lu, Shih-Ching Chen, Guang-Hwa Ma, Cheng-Hsu Hsiao
  • Publication number: 20160066406
    Abstract: An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.
    Type: Application
    Filed: October 16, 2014
    Publication date: March 3, 2016
    Inventors: Lu-Yi Chen, Chang-Lun Lu, Shih-Ching Chen
  • Patent number: 9269602
    Abstract: A fabrication method of a wafer level semiconductor package includes: forming on a carrier a first dielectric layer having first openings exposing portions of the carrier; forming a circuit layer on the first dielectric layer, a portion of the circuit layer being formed in the first openings; forming on the first dielectric layer and the circuit layer a second dielectric layer having second openings exposing portions of the circuit layer; forming conductive bumps in the second openings; mounting a semiconductor component on the conductive bumps; forming an encapsulant for encapsulating the semiconductor component; and removing the carrier to expose the circuit layer. By detecting the yield rate of the circuit layer before mounting the semiconductor component, the invention avoids discarding good semiconductor components together with packages as occurs in the prior art, thereby saving the fabrication cost and improving the product yield.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: February 23, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventor: Lu-Yi Chen
  • Publication number: 20150325970
    Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.
    Type: Application
    Filed: March 19, 2015
    Publication date: November 12, 2015
    Applicants: TYCO ELECTRONICS (SHANGHAI) CO. LTD., TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS (DONGGUAN) LTD.
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Lu Yi, George J. Dubniczki, Kok Wai Wong
  • Publication number: 20150153629
    Abstract: The present invention is directed to a camera lens filter assembly including a camera lens filter and an included optical component. The optical component is installed on an optic mounting part; and a clamp is mounted on a clamp mounting part, so the clamp can press to tighten against the optical component for the purpose of assembly. The present invention efficiently prevents air, dust and other environmental pollutants from reaching the front surface of the camera lens and will also seal to secure the camera lens filter to the camera lens barrel in a way that it will not dismount itself due to vibration, use or other operating conditions.
    Type: Application
    Filed: November 26, 2014
    Publication date: June 4, 2015
    Inventors: Liu Hao, Lu Yi, Robert Michael Rose
  • Publication number: 20150035164
    Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced.
    Type: Application
    Filed: August 28, 2013
    Publication date: February 5, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Guang-Hwa Ma, Shih-Kuang Chiu, Shih-Ching Chen, Chun-Chi Ke, Chang-Lun Lu, Chun-Hung Lu, Hsien-Wen Chen, Chun-Tang Lin, Yi-Che Lai, Chi-Hsin Chiu, Wen-Tsung Tseng, Tsung-Te Yuan, Lu-Yi Chen, Mao-Hua Yeh
  • Publication number: 20150035163
    Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced.
    Type: Application
    Filed: August 28, 2013
    Publication date: February 5, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Guang-Hwa Ma, Shih-Kuang Chiu, Shih-Ching Chen, Chun-Chi Ke, Chang-Lun Lu, Chun-Hung Lu, Hsien-Wen Chen, Chun-Tang Lin, Yi-Che Lai, Chi-Hsin Chiu, Wen-Tsung Tseng, Tsung-Te Yuan, Lu-Yi Chen, Mao-Hua Yeh
  • Publication number: 20130299961
    Abstract: A semiconductor package includes a build-up structure; a semiconductor disposed on the build-up structure in a flip-chip manner and having a plurality of bumps penetrating therethrough; an electronic element disposed on the semiconductor chip; and an encapsulant formed on the build-up structure and encapsulating the semiconductor chip and the electronic element, thereby improving the product yield and the overall heat dissipating efficiency.
    Type: Application
    Filed: September 27, 2012
    Publication date: November 14, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventor: Lu-Yi Chen
  • Publication number: 20130249589
    Abstract: An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.
    Type: Application
    Filed: September 14, 2012
    Publication date: September 26, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Lu-Yi Chen, Chi-Hsin Chiu, Shih-Kuang Chiu
  • Publication number: 20130252383
    Abstract: A fabrication method of a wafer level semiconductor package includes: forming on a carrier a first dielectric layer having first openings exposing portions of the carrier; forming a circuit layer on the first dielectric layer, a portion of the circuit layer being formed in the first openings; forming on the first dielectric layer and the circuit layer a second dielectric layer having second openings exposing portions of the circuit layer; forming conductive bumps in the second openings; mounting a semiconductor component on the conductive bumps; forming an encapsulant for encapsulating the semiconductor component; and removing the carrier to expose the circuit layer. By detecting the yield rate of the circuit layer before mounting the semiconductor component, the invention avoids discarding good semiconductor components together with packages as occurs in the prior art, thereby saving the fabrication cost and improving the product yield.
    Type: Application
    Filed: September 27, 2012
    Publication date: September 26, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventor: Lu-Yi Chen
  • Publication number: 20110032271
    Abstract: An image display and storage device, method, and medium to process an original image and generate a main image so that the original image does not overlap a sub image, and store the original image instead of the main image when the main image and the sub image are displayed. The device includes an image processor to receive an image, and to generate a display image and a storage image using the received image, a display unit to receive the display image from the image processor, and to display the display image, and an image storing unit to receive the storage image from the image processor and to store the image.
    Type: Application
    Filed: October 14, 2010
    Publication date: February 10, 2011
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byung in YOO, Sung-guy Choi, Seong-woon Kim, Nam-woo Kim, Kwon lu Yi, Yill-myung Yim, Yeun-bae Kim
  • Patent number: 7756399
    Abstract: An apparatus comprising an encoder, a packet generator, a disc loader, and a rebuild circuit. The encoder may be configured to generate a format data stream in response to an input signal. The packet generator may be configured to generate special packets from extracts of the format data stream. The disc loader may be configured to write the special packets on a disc. The rebuild circuit may be configured to (i) rebuild one or more navigation files and a file system with the special packets and (ii) write the one or more navigation files and the file system to the disc.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: July 13, 2010
    Assignee: LSI Corporation
    Inventor: Lu Yi Sun
  • Publication number: 20080042565
    Abstract: A structure of plasma display panel includes a first panel and a second panel wherein the auxiliary electrode of the first panel is formed of multiple conductors that are arranged in pair on each pair of transparent electrodes and electrically connected with the transparent electrodes. In addition., the spacing of blue subpixel area corresponding to the auxiliary electrode is larger than that of the red or green subpixel area corresponding to the auxiliary electrode. Via enlarging the spacing of blue subpixel area corresponding to the auxiliary electrode, the aperture ratio and the light-emitting area of blue subpixel is increased, and thus, the object of raising the color temperature of the plasma display panel is achieved.
    Type: Application
    Filed: August 18, 2006
    Publication date: February 21, 2008
    Applicant: Chunghwa Picture Tubes, Ltd.
    Inventor: Lu-Yi Yang
  • Publication number: 20070096652
    Abstract: A method for fabricating a step-formed patterned layer is provided. First, a first patterned photo-resist dry film is formed on a first material layer. Next, a second material layer is formed on the first material layer and covers the first patterned photo-resist dry film. A second patterned photo-resist dry film is then formed on a second material layer, and the patterns of the first patterned photo-resist dry film and the second patterned photo-resist dry film are different and the second patterned photo-resist dry film further exposes the second material layer over the first patterned photo-resist dry film. Subsequently, the first material layer and the second material layer are partially removed by using the first patterned photo-resist dry film and the second patterned photo-resist dry film as a mask. The first patterned photo-resist dry film and the second patterned photo-resist dry film are then removed.
    Type: Application
    Filed: October 28, 2005
    Publication date: May 3, 2007
    Inventors: Chao-Jen Chang, Wen-Yu Liu, Chien-Hsiu Hsu, Lu-Yi Yang
  • Publication number: 20060276132
    Abstract: The present invention discloses an antenna diversity switch, used for receiving and transmitting RF signals for dual-mode co-existence wireless communication system. The antenna diversity switch comprises a first transmitting port; a second transmitting port; a receiving port; a first control unit, electrically connected between the first transmitting port and a first antenna; a second control unit, electrically connected between the first transmitting port and a second antenna; a third control unit, electrically connected between the second transmitting port and the first antenna; a forth control unit, electrically connected between the second transmitting port and the second antenna; a fifth control unit, electrically connected between the receiving port and the first antenna; a sixth control unit, electrically connected between the receiving port and the second antenna. The antenna diversity switch according to the present invention meets the requirement of IEEE 802.
    Type: Application
    Filed: June 7, 2005
    Publication date: December 7, 2006
    Inventors: Chang Sheng-Fuh, Chen Wen-Lin, Lu Yi-Yu, Chen Hung-Cheng, Tang Shu-Fen, Chen Albert
  • Publication number: 20050084805
    Abstract: A method for forming a patterned ITO structure by using a photosensitive ITO solution is provided. By mixing both the ITO and photosensitive material to form a photosensitive ITO solution on a substrate, a patterned ITO structure is available by directly exposing and developing the photosensitive ITO layer. Significantly, no photo-resist layer is required.
    Type: Application
    Filed: October 20, 2003
    Publication date: April 21, 2005
    Inventors: Lu-Yi Yang, Ching-Chung Cheng, Yen-Ting Shen, Yuan-Chi Lin
  • Patent number: D683660
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: June 4, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Masayuki Sugiura, Satoshi Kimura, Hiroshi Okamoto, Lu Yi