Abstract: This disclosure describes substrate(s) having a three-dimensional (3D) feature formed thereon and methods of forming the features. One method involves applying a first layer of UV-curable material on a surface of the glass container around a circumference of the container and curing the first layer of UV-curable material to produce a first cured material layer that forms at least a portion of a first 3D feature. The method further comprises applying a second layer of UV-curable material on the surface of the glass container, spaced apart from the first 3D feature, around the circumference of the container, and curing the second layer of UV-curable material to produce a second cured material layer that forms at least a portion of a second 3D feature. The portion of the glass container between the first and second 3D features has a circumference less than that of the first or second 3D features.

Abstract: This disclosure describes substrate(s) formed with a three-dimensional (3D) feature thereon, and method(s) of printing the same. One method includes identifying a plurality of locations on a substrate surface where the three-dimensional feature will be formed, determining a height value of the three-dimensional feature at each location, assigning a grayscale value to each location based on the height value, and applying ink to the substrate surface at each location according to the assigned grayscale value.

Abstract: This disclosure describes substrate(s) formed with a three-dimensional (3D) feature thereon, and method(s) of printing the same. One method includes identifying a plurality of locations on a substrate surface where the three-dimensional feature will be formed, determining a height value of the three-dimensional feature at each location, assigning a grayscale value to each location based on the height value, and applying ink to the substrate surface at each location according to the assigned grayscale value.

Abstract: This disclosure describes substrate(s) formed with a three-dimensional (3D) feature thereon, and method(s) of printing the same. One method includes identifying a plurality of locations on a substrate surface where the three-dimensional feature will be formed, determining a height value of the three-dimensional feature at each location, assigning a grayscale value to each location based on the height value, and applying ink to the substrate surface at each location according to the assigned grayscale value.

Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.

Abstract: A process for fabricating a carbon-carbon composite article including the steps of: (a) providing a liquid carbon precursor composition; wherein the liquid precursor composition has a neat viscosity of less than about 10,000 mPa-s at 25° C.

Abstract: A curable divinylarene dioxide resin composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) optionally, at least one pigment material; a process for making the curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom. The cured product made from the above curable divinylarene dioxide resin composition offers improved properties and are useful for various applications including ink formulations.

Abstract: A process for preparing a conductive carbonized layered article including the steps of: (I) providing a liquid carbon precursor formulation comprising (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent, (b) (ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa-s at 25° C.

Abstract: A process for preparing a carbon-carbon composite including the steps of: (a) providing a curable low viscosity aromatic epoxy resin liquid formulation, wherein the formulation has a neat viscosity of less than 10,000 mPa-s at 25° C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the formulation being cured has a carbon yield of at least 35 wt % disregarding the weight of the carbon matrix and any optional components present in the composition; (b) contacting a carbon matrix with the formulation of step (a); (c) curing the contacted carbon matrix of step (b); and (d) carbonizing the cured carbon matrix of step (c) to form a carbon-carbon composite; and a carbon-carbon composite made by the process.

Abstract: A process for preparing a vitreous carbon including the steps of: (I) providing a curable low viscosity liquid carbon precursor formulation comprising (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent, (b) (ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa·s at 25° C.

Abstract: A photocationically-curable composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) at least one cyclic ester compound; a process for making the curable composition; and a cured product made therefrom. The cured product made from the above curable composition offers improved properties and are useful for various applications including ink formulations.

Abstract: A curable liquid carbon precursor formulation for preparing a porous carbon composition including (a) at least one aromatic epoxy resin; (b)(i) at least one aromatic co-reactive curing agent, or (b)(ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; and (c) at least one porogen; wherein the liquid composition has a neat viscosity of less than 10,000 mPa-s, at 25° C. prior to adding porogen, prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the liquid composition being cured has a carbon yield of at least 35 weight percent disregarding the weight of the porogen and any optional components present in the composition; a process for preparing the porous carbon composition from the above formulation including the steps of curing the formulation, and carbonizing the cured product resulting from curing the formulation such that a porous carbon composition is produced; and a porous carbon composition made by the above process.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed.

Abstract: A toughener composition comprising a) 45 to 97 weight percent of a divinylarene dioxide; and b) 3 to 55 weight percent of a core shell rubber comprising a rubber particle core and a shell layer wherein said core shell rubber has a particle size of from 0.01 ?m to 0.50 ?m is disclosed. The toughener can be used in epoxy resin compositions for advanced composite, electronic, coating and structural adhesive applications.

Abstract: A curable composition comprising a blend of: a) an epoxy resin; and b) a hardener comprising a polyfunctional amine is disclosed. The curable composition can be used in a variety of applications including, but not limited to coatings, civil engineering, flooring, composites, adhesives, and electrical laminates.

Abstract: A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

Abstract: A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Abstract: A process for preparing a carbon-carbon composite including the steps of: (a) providing a curable low viscosity aromatic epoxy resin liquid formulation, wherein the formulation has a neat viscosity of less than 10,000 mPa-s at 25° C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the formulation being cured has a carbon yield of at least 35 wt % disregarding the weight of the carbon matrix and any optional components present in the composition; (b) contacting a carbon matrix with the formulation of step (a); (c) curing the contacted carbon matrix of step (b); and (d) carbonizing the cured carbon matrix of step (c) to form a carbon-carbon composite; and a carbon-carbon composite made by the process.

Abstract: A process for preparing a conductive carbonized layered article including the steps of: (I) providing a liquid carbon precursor formulation comprising (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent, (b) (ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa-s at 25° C.