Abstract: Storage-stable reactive inorganic clusters and a process for preparing such storage-stable reactive inorganic clusters (e.g., silica structures) having, for example, reactive amino groups. The storage-stable reactive inorganic clusters may be used as a curing agent for thermosetting resin compositions such as epoxy resins.

Abstract: A thermosettable composition including (a) at least an amphophilic block copolymer, (b) at least a polyol, (c) at least an epoxy resin containing an average at least 2 oxirane rings per molecule, (d) at least an anhydride hardener containing an average at least 1 anhydride ring per molecule, and (e) at least a catalyst; and a thermoset product prepared from said thermosettable composition.

Abstract: A curable divinylarene dioxide resin composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) optionally, at least one pigment material; a process for making the curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom. The cured product made from the above curable divinylarene dioxide resin composition offers improved properties and are useful for various applications including ink formulations.

Abstract: A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: Disclosed are curable epoxy-based resins having a lower peak exotherm during cure, as well as thermoset resins and epoxy-based parts formed from the curable epoxy-based compositions. The epoxy-based compositions having a lower peak exotherm during cure may include: at least one epoxy resin, at least one hardener, and at least one endothermic transition additive. The thermoset resin may include the reaction product of the curable epoxy-based resins having a lower peak exotherm during cure, which may be useful when forming large epoxy-based parts, such as those including 200 grams or more of the thermoset resin. Also disclosed is a process for forming curable epoxy-based resins having a lower peak exotherm during cure, including: admixing at least one epoxy resin; at least one hardener; and at least one endothermic transition additive; to form a curable composition. The resulting curable composition may then be thermally cured at a temperature of at least 60° C. to form a thermoset resin.

Abstract: A curable epoxy resin composition comprising at least one oxazolidone-modified epoxy resin which is the reaction product of an epoxy resin and an isocyanate, at least one maleimide, at least one cyanate ester, and optionally at least one non-oxazolidone containing epoxy resin, wherein at least one component of the composition comprises halogen or phosphorous to provide flame retardancy to the cured composition, a method of making the composition and methods of making a prepreg and an electrical laminate using the composition.

Abstract: Thermosetting compositions comprising a) at least a first thermosetting resin, b) at least one silicone polyether, and c) at least one filler or fibrous reinforcement, methods of making such thermosetting compositions, and thermoset products made from the compositions.

Abstract: Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions.

Abstract: A device and method for assessing the machinability, particularly the drillability, of epoxy resin laminates by reproducible indentation and analysis of the delamination area of a laminate sample thus provoked.

Abstract: Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 1500 C or greater, a tan ? peak of 0.2 or greater, and a tan ? peak width measured at half-height larger than about 400 C, each as measured by dynamic mechanical thermal analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.

Abstract: Thermosettable compositions are described having improved adhesion to metal substrates when cured comprising (a) at least one curable epoxy resin; (b) at least one hardener, each hardener having less than 1 primary amine group per molecule and not more than 1 secondary amine group per molecule, the hardener(s) comprising at least one polyhydroxy hydrocarbon, hydrocarbon capable of generating multiple hydroxy groups per molecule during curing of the thermosettable material, or poly(acid anhydride)hydrocarbon other than a blend of (1) a copolymer of an ethylenically unsaturated anhydride and a vinyl compound and (2) a copolymer of an ethylenically unsaturated anhydride and an elastomer, and (c) at least one triblock copolymer comprising at least one elastomeric block and at least one acrylic block.

Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170° C.

Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; (c) a catalytic amount of a nitrogen-containing catalyst; (d) a non-nitrogen containing catalyst adjuvant compound capable of reducing the concentration of the nitrogen-containing catalyst; wherein at least one of the above components (a)-(d) is halogenated or wherein the resin composition includes (e) a halogenated flame retardant compound. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 1700C; and the resultant cured product formed by curing the curable epoxy resin composition contains well-balanced properties. The composition may be used to obtain a prepreg or a metal-coated foil, or a laminate by laminating the above prepreg and/or the above metal-coated foil.

Abstract: A hardener composition useful for curing epoxy resins including a blend of (a) a carboxylic anhydride which is a copolymer of an ethylenically unsaturated anhydride and a vinyl compound; (b) a copolymer of an ethylenically unsaturated anhydride and an elastomer; and optionally (c) a stabilizing agent such as a block copolymer to prevent phase separation of components (a) and (b). The hardener composition is particularly useful in electrical laminates applications.

Abstract: A hardener composition useful for curing epoxy resins including a blend of (a) a carboxylic anhydride which is a copolymer of an ethylenically unsaturated anhydride and a vinyl compound; (b) a copolymer of an ethylenically unsaturated anhydride and an elastomer; and optionally (c) a stabilizing agent such as a block copolymer to prevent phase separation of components (a) and (b). The hardener composition is particularly useful in electrical laminates applications.

Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.

Abstract: A hardener composition useful for curing epoxy resins including a blend of (a) a carboxylic anhydride which is a copolymer of an ethylenically unsaturated anhydride and a vinyl compound; (b) a copolymer of an ethylenically unsaturated anhydride and an elastomer; and optionally (c) a stabilizing agent such as a block copolymer to prevent phase separation of components (a) and (b). The hardener composition is particularly useful in electrical laminates applications.

Abstract: The invention relates to thermosetting compositions, in particular coating or molding compositions, comprising crosslinked polymer microparticles with a size ranging from 10 to 300 nm and carrying at least one reactive functional group which can react with at least one of the reactive components of the thermosetting composition. Preferably, these microparticles carry at least one second reactive functional group distinct from the first which can react with at least one other functional group of the same type carried by another microparticle and/or by a reactive component of the thermosetting composition. These microparticles are at least partially soluble, miscible and/or dispersible in the starting thermosetting composition. The preferred thermosetting compositions are based on resins of epoxy/amine type or on unsaturated polyester resins and/or on vinyl ester resins.

Abstract: The invention relates to cross-linked acrylic microparticles, a method for the production thereof by polymerization in a dispersion in a non aqueous medium and to the uses thereof in covering or moulding compositions involving a favourable compromise between hardness, flexibility and adhesion. The micropparticles are obtained from a composition comprising: 50-99% mols of a constitutent (A) consisting of Cardura E 10 (meth)acrylate and optionally alkyl (meth)acrylate in C2-C8; a compound (B) consisting of at least one monomer or oligomer having at least 2 ethylenic unsaturations; a compound (C) consisting of at least one monomer or oligomer having in addition to one ethylenic unsaturation at least one second function (F1) with the possibility of at least partial chemical modification of the initial functions f1 into final functions f2.