Abstract: A liquid carbon precursor composition including (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent or (b)(ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid composition prior to adding optional components and curing, has a neat viscosity of less than 10,000 mPa-s, at 25° C.; and wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa-s at 25° C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the liquid precursor composition being cured has a carbon yield of at least 35 weight percent as measured in the absence of optional components; a cured liquid carbon precursor composition; a carbonized material made from the above liquid carbon precursor composition; and processes for producing the above compositions.

Abstract: A process for preparing a vitreous carbon including the steps of: (I) providing a curable low viscosity liquid carbon precursor formulation comprising (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent, (b) (ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa-s at 25° C.

Abstract: Thermosettable compositions are described having improved adhesion to metal substrates when cured comprising (a) at least one curable epoxy resin; (b) at least one hardener, each hardener having less than 1 primary amine group per molecule and not more than 1 secondary amine group per molecule, the hardener(s) comprising at least one polyhydroxy hydrocarbon, hydrocarbon capable of generating multiple hydroxy groups per molecule during curing of the thermosettable material, or poly(acid anhydride)hydrocarbon other than a blend of (1) a copolymer of an ethylenically unsaturated anhydride and a vinyl compound and (2) a copolymer of an ethylenically unsaturated anhydride and an elastomer, and (c) at least one triblock copolymer comprising at least one elastomeric block and at least one acrylic block.

Abstract: A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times larger than that of the first preformed coreshell toughening agent, and the use of the bimodal toughening agent in a thermosettable epoxy resin composition, is disclosed.

Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.

Abstract: Storage-stable reactive inorganic clusters and a process for preparing such storage-stable reactive inorganic clusters (e.g., silica structures) having, for example, reactive amino groups. The storage-stable reactive inorganic clusters may be used as a curing agent for thermosetting resin compositions such as epoxy resins.

Abstract: A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Abstract: A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

Abstract: A thermosettable composition including (a) at least an amphophilic block copolymer, (b) at least a polyol, (c) at least an epoxy resin containing an average at least 2 oxirane rings per molecule, (d) at least an anhydride hardener containing an average at least 1 anhydride ring per molecule, and (e) at least a catalyst; and a thermoset product prepared from said thermosettable composition.

Abstract: A half ester of an organic polyol made by reacting polyols with anhydrides; a thermosettable composition including (i) the half ester of an organic polyol, (ii) an anhydride, (iii) an epoxide, and (iv) a catalyst; and a thermoset product made from such thermosettable composition. The thermosettable compositions of the present invention are useful in various applications such as casting, potting, and encapsulation, such as electrical and electronics applications, and composites. The thermoset products made from the thermosettable compositions of the present invention have improved mechanical performances, especially toughness and mechanical strength, while maintaining high thermal resistance.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Abstract: Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions.

Abstract: A photocationically-curable composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) at least one cyclic ester compound; a process for making the curable composition; and a cured product made therefrom. The cured product made from the above curable composition offers improved properties and are useful for various applications including ink formulations.

Abstract: Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 1500 C. or greater, a tan ? peak of 0.2 or greater, and a tan ? peak width measured at half-height larger than about 400 C., each as measured by dynamic mechanical thermal analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.

Abstract: A device and method for assessing the machinability, particularly the drillability, of epoxy resin laminates by reproducible indentation and analysis of the delamination area of a laminate sample thus provoked.

Abstract: A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Abstract: A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.

Abstract: A half ester of an organic polyol made by reacting polyols with anhydrides; a thermosettable composition including (i) the half ester of an organic polyol, (ii) an anhydride, (iii) an epoxide, and (iv) a catalyst; and a thermoset product made from such thermosettable composition. The thermosettable compositions of the present invention are useful in various applications such as casting, potting, and encapsulation, such as electrical and electronics applications, and composites. The thermoset products made from the thermosettable compositions of the present invention have improved mechanical performances, especially toughness and mechanical strength, while maintaining high thermal resistance.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.