Patents by Inventor Lun Hsieh

Lun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161672
    Abstract: An electronic circuit including a plurality of common terminals, a first circuit, a second circuit, and a plurality of switch units is provided. The first circuit is configured to output display driving signals to data lines of a display panel via the common terminals. The second circuit is configured to receive fingerprint sensing signals from fingerprint sensing lines of the display panel via the common terminals. Each of the switch units includes a first terminal coupled to one of the common terminals and a plurality of second terminals coupled to the first circuit and the second circuit. The switch units are grouped into a plurality of groups, and each group corresponds to a fingerprint sensing channel of the second circuit.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Applicant: Novatek Microelectronics Corp.
    Inventors: Huan-Teng Cheng, Ting-Hsuan Hung, Tzu-Wen Hsieh, Wei-Lun Shih, Huang-Chin Tang
  • Publication number: 20240153842
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11978598
    Abstract: A keyswitch structure includes a base, a keycap, a lift mechanism and a light-emitting part. The lift mechanism includes a first support, a second support, and a spring structure. The first support and the second support are connected to and between the base and the keycap, so that the keycap can move relative to the base in a vertical direction. The spring structure is a single structural part and is connected to the first support and the second support and drives the first support and the second support to lift the keycap in the vertical direction. The lift mechanism as a whole defines a central space that extends through the whole lift mechanism in the vertical direction. The spring structure does not enter the central space. The light-emitting part is disposed on the base corresponding to the central zone, and emits light to illuminate the keycap.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: May 7, 2024
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chen Yang, Ling-Hsi Chao, Shao-Lun Hsiao, Yu-Chun Hsieh
  • Patent number: 11949001
    Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Ching Wang, Chung-I Yang, Jon-Hsu Ho, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Publication number: 20240105401
    Abstract: A keyswitch structure includes a casing, a first support, a second support, and a pressing stem. The casing forms an accommodating space and an opening communicating with the accommodating space. The first and second supports are disposed in the accommodating space and are directly and rotatably connected with the casing; the supports are also pivotally connected with each other. The pressing stem extends into the accommodating space to be rotatably connected with the first and second supports and protrudes from the casing through the opening. The pressing stem is movable parallel to a vertical direction relative to the casing through the first and second supports. A motion of the pressing stem in the vertical direction has a top dead center and a bottom dead center. When the pressing stem is at the top dead center and the bottom dead center, it does not touch the casing in the vertical direction.
    Type: Application
    Filed: July 18, 2023
    Publication date: March 28, 2024
    Applicant: DARFON ELECTRONICS CORP.
    Inventors: Yu-Chun Hsieh, Ling-Hsi Chao, Shao-Lun Hsiao, Chen Yang
  • Patent number: 11941157
    Abstract: A computer implemented method for managing the scope of permissions granted by users to application that includes collecting a set of permissions for an application from an application provider publication; and collecting a process flow for functional steps of the application from a review of the application that is published on a product review type publication. The computer implemented method further includes dividing the functional steps of the application into a plurality of journeys, each of said plurality of journeys having a function associated with a stage of a functional step from a perspective of a user; and matching permissions from the set of permissions for each journey of said plurality of journeys to provide matched permissible permissions to journeys stored in a customer journey store.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: March 26, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hao Chun Hung, Po-Cheng Chiu, Tsai-Hsuan Hsieh, Cheng-Lun Yang, Chiwen Chang, Shin Yu Wey
  • Patent number: 11935452
    Abstract: An electronic circuit for operating with a display panel including touch sensors and fingerprint sensors is provided. The electronic circuit includes a first circuit, a second circuit, a third circuit, a first switch circuit and a control circuit. The first circuit generates display driving signals for driving the display panel. The second circuit receives fingerprint sensing signals from the fingerprint sensors. The third circuit determines a touch information according to touch sensing signals from the touch sensors. The first switch circuit includes a plurality of first switch units, each of the first switch units includes a first switch element and a second switch element. The control circuit controls the first switch circuit to transmit the display driving signals in a first time interval, controls the first switch circuit to transmit the fingerprint sensing signals in a second time interval, and controls the third circuit to receive the fingerprint sensing signals in a third time interval.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: March 19, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Huan-Teng Cheng, Ting-Hsuan Hung, Tzu-Wen Hsieh, Wei-Lun Shih, Huang-Chin Tang
  • Patent number: 11923159
    Abstract: A keyswitch structure includes a keycap support mechanism and a keycap that is supported by the keycap support mechanism in a vertical direction. The keycap support mechanism includes a base and two supports. The base has two sliding slots. Each sliding slot has an opening in a horizontal direction and an obstruction block at the opening. The horizontal direction is perpendicular to the vertical direction. Each support has a sliding portion and a linkage portion. The sliding portions slide parallel to the horizontal direction in the sliding slots correspondingly. The obstruction block prevents the corresponding sliding portion from disengaging from the corresponding sliding slot. The two linkage portions push against each other in line contact, so that the two supports are mutually driven through the two linkage portions.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: March 5, 2024
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chen Yang, Ling-Hsi Chao, Shao-Lun Hsiao, Yu-Chun Hsieh
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11916110
    Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.
    Type: Grant
    Filed: July 4, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Ching Wang, Wei-Yang Lee, Ming-Chang Wen, Jo-Tzu Hung, Wen-Hsing Hsieh, Kuan-Lun Cheng
  • Publication number: 20240061703
    Abstract: A transaction merging method for a first electronic device and a second electronic device. The transaction merging method comprises: (a) receiving a plurality of input transactions from the first electronic device; (b) setting a merge condition of the input transactions according to a transmission condition between the first electronic device and the second electronic device; (c) merging the input transactions according to the merge condition to generate at least one transaction group; and (d) transmitting the transaction group to the second electronic device.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 22, 2024
    Applicant: MEDIATEK INC.
    Inventors: En-Shou Tang, Yuan-Chun Lin, Ming-Lun Hsieh, Chia-Yuan Chang
  • Patent number: 11851435
    Abstract: Disclosed are compounds of formula (I) as follows: in which each of R1, R2, R3, R4, R5, L1, W, and Het is defined herein. Also provides are a method of inhibiting prostaglandin reductase 2 (“PTGR2”) using such a compound and a pharmaceutical composition containing same.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: December 26, 2023
    Assignees: National Health Research Institutes, National Taiwan University
    Inventors: Lun Kelvin Tsou, Ming-Shiu Hung, Chieh Wen Chen, Meng-Lun Hsieh, Yi-Cheng Chang, Lee Ming Chuang
  • Publication number: 20230301751
    Abstract: A distinguishing device for dental plaque and dental calculus includes a light-emitting diode, an image sensing unit, and a processor. The light-emitting diode movies in a first direction and is separated from teeth in an oral cavity by a predetermined distance in a second direction. The second direction is perpendicular to the first direction. The light-emitting diode generates a blue light to illuminate the teeth, so that dental plaque on the teeth generates a first autofluorescence and dental calculus on the teeth generates a second autofluorescence. The image sensing unit is configured to sense the first autofluorescence and the second autofluorescence. The processor is coupled to the image sensing unit to distinguish a dental plaque area from a dental calculus area on the teeth according to the first autofluorescence and the second autofluorescence.
    Type: Application
    Filed: August 4, 2022
    Publication date: September 28, 2023
    Inventors: Kai-Ju CHENG, Yu-Hsun CHEN, Hao-Ping LEE, Tong-Ming HSU, Chin-Yuan TING, Shao-Ang CHEN, Kuan-Chung CHEN, Hsin-Lun HSIEH
  • Publication number: 20230279008
    Abstract: Disclosed are compounds of formula (I) as follows: in which each of R1, R2, R3, R4, R5, L1, W, and Het is defined herein. Also provides are a method of inhibiting prostaglandin reductase 2 (“PTGR2”) using such a compound and a pharmaceutical composition containing same.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 7, 2023
    Inventors: Lun Kelvin Tsou, Ming-Shiu Hung, Chieh Wen Chen, Meng-Lun Hsieh, Yi-Cheng Chang, Lee Ming Chuang
  • Patent number: 11733166
    Abstract: A fabrication method of a SERS substrate includes (a) preparing a hydrophilic membrane; (b) dipping the hydrophilic membrane in an alcohol; (c) immersing the hydrophilic membrane in a chloride ion aqueous solution; and (d) depositing Ag or Au nanoparticles on the hydrophilic membrane by suction filtration to form the SERS substrate. The hydrophilic membrane includes 10˜20 wt % PVDF, PTFE, PC, PES, nylon, or mixtures thereof, 10˜20 wt % PVP, and 0.2˜1.6 wt % PMMA, PHEMA, or mixtures thereof.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: August 22, 2023
    Assignee: NATIONAL DEFENSE MEDICAL CENTER
    Inventors: Jenn-Jong Young, Cheng-Cheung Chen, Chia-Ying Chin, Xin-An Chen, Hui-Ju Yen, Ying-Chuan Chen, Hsin-Lun Hsieh
  • Publication number: 20230197365
    Abstract: An illuminated keyswitch includes a keycap, a pair of frames adapted to support the keycap in an up-down movement, the pair of frames disposed corresponding to each other and substantially rotatably coupled to each other to define an inner space under the keycap, a pair of elastic members connecting the pair of frames to be located at two opposite sides of the inner space, respectively, and an illumination light source disposed between the pair of elastic members in the inner space and adapted to provide an illumination light. During the up-down movement of the keycap, a vertical projection of the pair of frames surrounds the inner space without interfering therewith, so the illumination light passes the inner space to illuminate the keycap.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 22, 2023
    Inventors: Chen Yang, Ling-Hsi Chao, Shao-Lun Hsieh, Yu-Chun Hsieh
  • Patent number: 11619753
    Abstract: The disclosure provides a processing circuit adapted to read out a sensing voltage of an X-ray sensor and a signal processing method of a sampling circuit. The processing circuit includes an amplifier and the sampling circuit. An inverting input terminal of the amplifier is coupled to the X-ray sensor. The sampling circuit is coupled to an output terminal of the amplifier. The sampling circuit obtains a first voltage, a second voltage, and a sampling voltage of the X-ray sensor in different periods. The sampling voltage is between the first voltage and the second voltage. In the readout period, the sampling circuit subtracts the second voltage from the sampling voltage to obtain a third voltage, subtracts the second voltage from the first voltage to obtain a fourth voltage, and divides the third voltage by the fourth voltage to read out the sensing voltage of the X-ray sensor.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 4, 2023
    Assignees: InnoCare Optoelectronics Corporation, National Yang Ming Chiao Tung University
    Inventors: Zhi-Hong Wang, Hsin-Hung Lin, Chih-Hao Wu, Yu-Lun Hsieh, Ya-Hsiang Tai, Cheng Che Tu
  • Publication number: 20230070905
    Abstract: A SIMO power converter includes: a power stage having an inductor and a plurality of switches, the power stage generating a plurality of output voltages from an input voltage; a control circuit, the control circuit controlling the SIMO power converter to be operated at either an OPDC (Ordered Power Distributive Control) mode or a Peak Current Control (PCC) mode according with different loading conditions, the control circuit further generating a plurality of duty cycles based on an inductor current of the inductor and the plurality of output voltages; and a logic control and gate driver for generating a plurality of switch control signals based on the duty cycles from the control circuit, the plurality of switch control signals for controlling the plurality of switches of the power stage.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Inventors: Wen-Chia PI, Wei-Lun HSIEH, Wei-Hsin WEI
  • Publication number: 20230064560
    Abstract: A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, an LED element, and a solder material. The first conductive pattern has a first portion and a second portion, the first portion fills a through hole of the first insulating layer, and the second portion is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern. The LED element is bonded to the second conductive pattern. The solder material is disposed on the first portion of the first conductive pattern.
    Type: Application
    Filed: August 23, 2022
    Publication date: March 2, 2023
    Applicant: AUO Corporation
    Inventors: Shuo-Yang Sun, Hao-Lun Hsieh, Xiao-Yun Li, Yu-Hao Chang, Fu-Yang Chen, Jhih-Jhu Jhan, Yu-Chih Wang, Ying-Hui Lai