Abstract: A method for processing an audio signal is performed at a computing device. The method includes the following steps: receiving a digital stereo audio input signal; extracting localization cues from the digital stereo audio input signal; generating a left-side component and a right-side component from the digital stereo audio input signal, at least partially, in accordance with the localization cues; performing crosstalk cancellation to the left-side component and the right-side component, respectively, to obtain a crosstalk-cancelled left-side component and a crosstalk-cancelled right-side component; and generating a digital stereo audio output signal including the crosstalk-cancelled left-side component and the crosstalk-cancelled right-side component.

Abstract: A method for processing an audio signal is performed at a computing device. The method includes the following steps: receiving a digital stereo audio input signal; extracting localization cues from the digital stereo audio input signal; generating a left-side component and a right-side component from the digital stereo audio input signal, at least partially, in accordance with the localization cues; performing crosstalk cancellation to the left-side component and the right-side component, respectively, to obtain a crosstalk-cancelled left-side component and a crosstalk-cancelled right-side component; and generating a digital stereo audio output signal including the crosstalk-cancelled left-side component and the crosstalk-cancelled right-side component.

Abstract: A method for processing an audio signal is performed at a computing device. The method includes the following steps: receiving a digital stereo audio input signal; extracting localization cues from the digital stereo audio input signal; generating a left-side component and a right-side component from the digital stereo audio input signal, at least partially, in accordance with the localization cues; performing crosstalk cancellation to the left-side component and the right-side component, respectively, to obtain a crosstalk-cancelled left-side component and a crosstalk-cancelled right-side component; and generating a digital stereo audio output signal including the crosstalk-cancelled left-side component and the crosstalk-cancelled right-side component.

Abstract: A two-point lock includes a casing unit, an adjusting unit and a locking unit. The adjusting unit includes two first adjusting guide plates pivoted to casing unit, and two second adjusting guide plates pivoted to the casing unit. The locking unit includes first and second hook members respectively pivotable between the first adjusting guide plates and between the second adjusting guide plates. The first adjusting guide plates are operable to adjust an extent by which the first hook member extends out of the casing unit. The second adjusting guide plates are operable to adjust an extent by which the second hook member extends out of the casing unit.

Abstract: A fingerprint sensing device includes a plurality of sensing units. Each sensing unit includes: a readout element, a photosensitive element, a light emitting element and a diode. The photosensitive element is electrically connected to the readout element. The light emitting element is disposed corresponding to the photosensitive element, and includes a first anode, a first cathode, and a light emitting layer located between the first anode and the first cathode. The diode includes a second anode and a second cathode, and a semiconductor layer located between the second anode and the second cathode. The second anode is electrically connected to the first cathode of the light emitting element, and the second cathode is electrically connected to the first anode of the light emitting element.

Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.

Abstract: A semiconductor structure has a semiconductor device, a first seal ring, and a second seal ring. The semiconductor device has a first surface and a second surface opposite to the first surface. The first seal ring is disposed on the first surface of the semiconductor device and adjacent to edges of the first surface. The second seal ring is disposed on the second surface of the semiconductor device and adjacent to edges of the second surface. A semiconductor manufacturing process is also provided.

Abstract: A fingerprint sensing device includes a plurality of sensing units. Each sensing unit includes: a readout element, a photosensitive element, a light emitting element and a diode. The photosensitive element is electrically connected to the readout element. The light emitting element is disposed corresponding to the photosensitive element, and includes a first anode, a first cathode, and a light emitting layer located between the first anode and the first cathode. The diode includes a second anode and a second cathode, and a semiconductor layer located between the second anode and the second cathode. The second anode is electrically connected to the first cathode of the light emitting element, and the second cathode is electrically connected to the first anode of the light emitting element.

Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A polycarbonate diol is provided, including three kinds of repeating diol units, wherein one of the repeating diol units is chosen from an alkoxylated diol monomer.

Abstract: Provided is a method of transforming an integrated circuit (IC) pattern into one or more patterns suitable for subsequent processing, such as mask fabrication. The method includes receiving an IC pattern that has an arbitrary shape, and using a computer, deriving an approximation IC pattern that is a user-defined fabrication-friendly shape, such as a rectangle or an ellipse. The method further includes calculating a pattern approximation error between the IC pattern and the approximation IC pattern. The method further includes checking whether the pattern approximation error is less than a user-defined threshold. If it is, the method further includes replacing the IC pattern with the approximation IC pattern for subsequent fabrication. Otherwise, the method further includes splitting the IC pattern into subparts, and recursively transforming each of the subparts.

Abstract: A telehealth care system is configured to provide a first service, in which the first service includes a first operation and a second operation. The telehealth care system includes a first host terminal, first electronic devices, and a central data center. The first electronic devices are configured to correspond to the first host terminal. The central data center is connected to the first host terminal and the first electronic devices. The first electronic devices are configured to perform the first operation via the central data center, and to perform the second operation via the first host terminal. The data processed by the first operation has a first data attribute, the data processed by the second operation has a second data attribute that is different from the first data attribute.

Abstract: A video conferencing system is provided. The video conferencing system includes: a first video conferencing terminal; a second video conferencing terminal, for establishing a video conference with the first video conferencing terminal via a peer-to-peer connection; and a management server. When a user needs to add a third video conferencing terminal to the video conference to establish a multi-way video conference, the first video conferencing terminal and the second video conferencing terminal automatically terminate the peer-to-peer connection, and connect to the third video conferencing terminal through the management server to perform the multi-way video conference.

Abstract: A method for manufacturing a patterned layer includes the steps of: providing a substrate having a first surface and a second surface opposite to the first surface; providing a material source for supplying a plurality of charged particles, in which the first surface faces the material source; providing a magnetic element, in which the second surface is arranged between the magnetic element and the first surface; and depositing the charged particles on the first surface through using the magnetic element so as to form a patterned layer. A method for manufacturing an electrochromic device is disclosed as well.

Abstract: A video conferencing system is provided. The video conferencing system includes: a first video conferencing terminal; a second video conferencing terminal, for establishing a video conference with the first video conferencing terminal via a peer-to-peer connection; and a management server. When a user needs to add a third video conferencing terminal to the video conference to establish a multi-way video conference, the first video conferencing terminal and the second video conferencing terminal automatically terminate the peer-to-peer connection, and connect to the third video conferencing terminal through the management server to perform the multi-way video conference.

Abstract: Provided is a method of transforming an integrated circuit (IC) pattern into one or more patterns suitable for subsequent processing, such as mask fabrication. The method includes receiving an IC pattern that has an arbitrary shape, and using a computer, deriving an approximation IC pattern that is a user-defined fabrication-friendly shape, such as a rectangle or an ellipse. The method further includes calculating a pattern approximation error between the IC pattern and the approximation IC pattern. The method further includes checking whether the pattern approximation error is less than a user-defined threshold. If it is, the method further includes replacing the IC pattern with the approximation IC pattern for subsequent fabrication. Otherwise, the method further includes splitting the IC pattern into subparts, and recursively transforming each of the subparts.

Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

Abstract: A communication system and method are provided. In the communication system, a first electrical device has an end point which is configured to connect to a plurality of 3G dongles, wherein the 3G dongles have different IP addresses; a cloud server integrates the IP addresses to generate an integrated IP address when the cloud server detects that the first electrical device is connected to the 3G dongles; and a second electrical device transmits data packets with the first electrical device via the integrated IP address through the cloud server.

Abstract: Provided is a method of transforming an integrated circuit (IC) pattern into one or more patterns suitable for subsequent processing, such as mask fabrication. The method includes receiving an IC pattern that has an arbitrary shape, and using a computer, deriving an approximation IC pattern, wherein the approximation IC pattern is in a shape that is a user-defined fabrication-friendly shape, such as a rectangle or an ellipse. The method further includes calculating a pattern approximation error between the IC pattern and the approximation IC pattern. The method further includes checking whether the pattern approximation error is less than a user-defined threshold. If it is, the method further includes outputting the approximation IC pattern for subsequent fabrication. Otherwise, the method further includes splitting the IC pattern into a plurality of subparts, and recursively transforming each of the plurality of subparts.