Patents by Inventor Makoto Shibuya
Makoto Shibuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250046684Abstract: A semiconductor package comprises an integrated circuit die covered by a mold compound to form a four-sided package with a top surface and a bottom surface. A first group of no-lead contacts are exposed on a first side and on the bottom surface of the package. A second group of no-lead contacts are exposed on a second side and on the bottom surface of the package, wherein the second side is opposite the first side. A first external lead extends from a third side of the package. A second external lead extends from a fourth side of the package opposite the third side. The first and second external leads bent to extend above the top surface of the package. The first and second external leads have a gull-wing shape or a J-shape.Type: ApplicationFiled: July 31, 2023Publication date: February 6, 2025Inventors: Makoto Shibuya, Yasmine Yan, Masamitsu Matsuura, Anindya Poddar
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Publication number: 20240379509Abstract: In some examples, a semiconductor package includes a semiconductor die having a device side and a non-device side opposing the device side. The device side has a circuit formed therein. The package includes a first conductive member having a first surface coupled to the non-device side of the semiconductor die and a second surface opposing the first surface. The second surface is exposed to a top surface of the semiconductor package. The package includes a second conductive member exposed to an exterior of the semiconductor package and coupled to the device side of the semiconductor die. The package includes a plurality of wirebonded members coupled to the second surface of the first conductive member and exposed to the exterior of the semiconductor package. At least one of the wirebonded members in the plurality of wirebonded members has a gauge of at least 5 mils.Type: ApplicationFiled: July 23, 2024Publication date: November 14, 2024Inventors: Makoto SHIBUYA, Makoto YOSHINO, Kengo AOYA
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Patent number: 12119263Abstract: In a described example, an integrated circuit (IC) package includes an IC die disposed on a die attach pad; a plurality of leads electrically connected to terminals on the IC die, the leads including a base metal; and molding compound material encapsulating portions of the IC die, the die attach pads, and the plurality of leads; the plurality of leads having a solder joint reinforcement tab. The solder joint reinforcement tabs include a first side, a second side opposite to the first side, a third side, a fourth side opposite to and in parallel to the third side, a fifth side forming an end portion of the solder joint reinforcement tab, the solder joint reinforcement tabs including a solderable metal layer on the second, third and fourth sides and on portions of the fifth side.Type: GrantFiled: May 11, 2021Date of Patent: October 15, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Makoto Shibuya
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Publication number: 20240332141Abstract: A semiconductor device includes: a package substrate having a device mount surface and on an opposite bottom side surface; at least one semiconductor die mounted on the device mount surface; and leads having a base portion attached to the device mount surface and having an internal portion extending away from a first bend at a first angle, the internal portion of the leads extending to a second bend, a remaining portion of the leads extending from the second bend and lying in a horizontal plane parallel to the device mount surface, the leads having a third bend in the remaining portion forming terminals extending at a second angle with respect to the horizontal plane of the remaining portion. Mold compound covers the device mount surface, portions of the leads, and the semiconductor die. The terminals are exposed at a board side surface of the mold compound.Type: ApplicationFiled: March 31, 2023Publication date: October 3, 2024Inventors: Kwang-Soo Kim, Makoto Shibuya, Woochan Kim
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Publication number: 20240290676Abstract: A microelectronic device includes one or more electronic components attached to a package substrate which has an exposed surface to provide an area for mounting a heatsink. The microelectronic device includes one or more leads that are electrically connected to the electronic component. The lead extends away from the exposed surface of the package substrate. The microelectronic device includes a shielding dielectric material that laterally surrounds the lead and extends over the lead between the lead and the exposed surface of the package substrate. An electronic system includes the microelectronic device and a circuit board electrically connected to the lead. The electronic system also includes a heatsink attached to the exposed surface of the package substrate.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Inventors: Masamitsu Matsuura, Makoto Shibuya, Daiki Komatsu, Kengo Aoya
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Publication number: 20240258288Abstract: In a described example, an apparatus includes: a package substrate with conductive leads; a semiconductor die mounted to the package substrate, the semiconductor die having a first thickness; electrical connections coupling bond pads on the semiconductor die to conductive leads on the package substrate; brackets attached to the package substrate spaced from the semiconductor die and extending away from the package substrate to a distance from the package substrate that is greater than the first thickness of the semiconductor die; and mold compound covering the package substrate, the semiconductor die, the brackets, and the semiconductor die to form a semiconductor device package having a board side surface and a top surface opposite the board side surface, and having portions of the brackets exposed from the mold compound on the top surface of the semiconductor device package to form mounts for a passive component.Type: ApplicationFiled: January 27, 2023Publication date: August 1, 2024Inventors: Makoto Shibuya, Kwang-Soo Kim
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Publication number: 20240258214Abstract: An example electronic device includes a substrate having a die pad and a semiconductor device on the die pad electrically connected to the substrate. The device also includes a mold compound over the semiconductor device to provide a packaged electronic device. The packaged electronic device has respective side edges that extend from a first end to terminate in a second end at a distal surface of the mold compound that is spaced apart from the substrate. At least one side edge of the mold compound has a respective surface that is orthogonal to the distal surface and includes a notch extending inwardly from the respective surface.Type: ApplicationFiled: January 31, 2023Publication date: August 1, 2024Inventors: Makoto SHIBUYA, Kengo AOYA
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Publication number: 20240250075Abstract: An electronic device includes a semiconductor die attached to a substrate and coupled to a circuit of the electronic device, an electronic component coupled to the circuit, and a package structure that encloses the semiconductor die, the package structure having an opening that exposes a portion of the electronic component. A method includes attaching a semiconductor die to a substrate or a die attach pad, performing an electrical connection process that couples the semiconductor die to a circuit, forming a package structure that encloses the semiconductor die and having an opening that exposes a metal terminal attached to the substrate, and attaching an electronic component through the opening to the metal terminal.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Inventors: Makoto Shibuya, Kwang-Soo Kim
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Patent number: 12046542Abstract: In some examples, a semiconductor package includes a semiconductor die having a device side and a non-device side opposing the device side. The device side has a circuit formed therein. The package includes a first conductive member having a first surface coupled to the non-device side of the semiconductor die and a second surface opposing the first surface. The second surface is exposed to a top surface of the semiconductor package. The package includes a second conductive member exposed to an exterior of the semiconductor package and coupled to the device side of the semiconductor die. The package includes a plurality of wirebonded members coupled to the second surface of the first conductive member and exposed to the exterior of the semiconductor package. At least one of the wirebonded members in the plurality of wirebonded members has a gauge of at least 5 mils.Type: GrantFiled: April 30, 2021Date of Patent: July 23, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Makoto Shibuya, Makoto Yoshino, Kengo Aoya
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Patent number: 12040260Abstract: An electronic package includes an electronic component including terminals, a plurality of surface contacts, at least some of the surface contacts being electrically coupled to the terminals within the electronic package, a mold compound covering the electronic component and partially covering the surface contacts with a bottom surface exposed from the mold compound, and a plurality of wires extending from exposed surfaces of the surface contacts, each of the wires providing a solderable surface for mounting the electronic package at a standoff on an external board.Type: GrantFiled: December 31, 2020Date of Patent: July 16, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Makoto Shibuya, Ayumu Kuroda, Kengo Aoya
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Publication number: 20240178104Abstract: An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.Type: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Inventors: MAKOTO SHIBUYA, DAIKI KOMATSU, MASAMITSU MATSUURA
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Publication number: 20240167755Abstract: The disclosed refrigerator includes a compartment defined by a partition wall, a door configured to open and close the compartment, a sealing member on the door so that, when the compartment is closed by the door, the sealing member is between the compartment and the door and seals an inside of the compartment, an elastic member on the door or the compartment so that, when the compartment is closed by the door, the elastic member is between the compartment and the door and is further outside than the sealing member, and a heat transfer member in contact with the elastic member and configured so that, when the compartment is closed by the door, the heat transfer member transfers heat of outside air to the partition wall.Type: ApplicationFiled: January 24, 2024Publication date: May 23, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Hiroshi NAKAMURA, Ryota AOKI, Hitoshi TAKASE, Tomohiko MATSUNO, Makoto SHIBUYA
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Publication number: 20240151460Abstract: A refrigerator comprising a cabinet, a door configured to open and close an opening of the cabinet, and an outside air heat inductor arrangeable inside the door to extend toward the cabinet from a front portion of the door. The outside air heat inductor includes a first heat transfer path forming member configured to transfer outside air heat from outside the refrigerator toward a surface of the cabinet, and a second heat transfer path forming member arrangeable between the first heat transfer path forming member and an inside of the cabinet such that while the second heat transfer path forming member is arranged between the first heat transfer path forming member and the inside of the cabinet, the second heat transfer path forming member receives the outside air heat and prevents cold air within the cabinet from being transferred to the first heat transfer path forming member.Type: ApplicationFiled: January 17, 2024Publication date: May 9, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hitoshi TAKASE, Ryota AOKI, Tomohiko MATSUNO, Makoto SHIBUYA
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Publication number: 20240128246Abstract: One example includes an apparatus that includes an insulating layer and an electrically conductive layer on the insulating layer. The conductive layer includes a plurality of electrically isolated and conductive regions. A first switch is on a first of the conductive regions, and the first switch has a first terminal and a second terminal. A second switch is on a second of the conductive regions, and the second switch has a third terminal and fourth terminal. A passive component has a fifth terminal and a sixth terminal. The first and third terminals are coupled to the first conductive region. The fourth and sixth terminals are coupled to the second conductive region. The second and fifth terminals are coupled to a third of the conductive regions.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Inventors: Kwang-Soo KIM, Makoto SHIBUYA, Johan STRYDOM
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Publication number: 20240120308Abstract: An electronic device includes a substrate having first and second conductive traces, a semiconductor die having a transistor with a first terminal and a second terminal, and first and second metal clips. The first metal clip has a first end portion coupled to the first terminal of the transistor, and a second end portion coupled to the first conductive trace of the substrate. The second metal clip has a first end portion coupled to the second terminal of the transistor and a second end portion coupled to the second conductive trace of the substrate, and a middle portion of the second metal clip is spaced apart from and at least partially overlying a portion of the first metal clip.Type: ApplicationFiled: October 6, 2022Publication date: April 11, 2024Inventors: Kwang-Soo Kim, Makoto Shibuya, Woochan Kim, Vivek Arora
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Patent number: 11955456Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.Type: GrantFiled: June 30, 2021Date of Patent: April 9, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Anindya Poddar, Ashok Surendra Prabhu, Hau Nguyen, Kurt Edward Sincerbox, Makoto Shibuya
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Publication number: 20240105537Abstract: An electronic device includes a semiconductor die attached to a die attach pad, a package structure having opposite first and second sides, opposite third and fourth sides spaced apart from one another along a first direction, and opposite fifth and sixth sides spaced apart from one another along an orthogonal second direction, conductive leads positioned along opposite third and fourth sides of the package structure, tie bars extending from the die attach pad and having respective ends exposed along the respective fifth and sixth sides of the package structure, and the fifth and sixth sides of the package structure each have individual indents that extend to a respective one of the third and fourth sides of the package structure.Type: ApplicationFiled: September 27, 2022Publication date: March 28, 2024Inventor: Makoto Shibuya
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Patent number: 11942384Abstract: A semiconductor package including a leadframe has a plurality of leads, and a semiconductor die including bond pads attached to the leadframe with the bond pads electrically coupled to the plurality of leads. The semiconductor die includes a substrate having a semiconductor surface including circuitry having nodes coupled to the bond pads. A mold compound encapsulates the semiconductor die. The mold compound is interdigitated having alternating extended mold regions over the plurality of leads and recessed mold regions in between adjacent ones of the plurality of leads.Type: GrantFiled: October 29, 2021Date of Patent: March 26, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga, Anindya Poddar
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Patent number: 11933533Abstract: A blower configured to circulate cold air inside a body of a refrigerator. The blower includes a casing, an impeller accommodated in the casing, and a support member configured to support the impeller against the casing. The impeller includes a disk-shaped base plate rotatably supported by the support member. The casing includes an inner circumferential surface extending so as to gradually move away from an outer circumference of the base plate toward a rotational direction of the impeller at a predetermined position around the outer circumference of the base plate, and a first case flow path between the inner circumferential surface and the outer circumference. An introduction port configured to introduce the cold air to a second case flow path branched from the first case flow path is formed on the inner circumferential surface of the casing.Type: GrantFiled: June 5, 2020Date of Patent: March 19, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Tomohiko Matsuno, Tomoharu Iwamoto, Makoto Shibuya, Tatsuya Seo, Hitoshi Takase
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Publication number: 20240055275Abstract: A method of fabricating an electronic device includes injecting molding compound into respective column cavities of a mold to enclose semiconductor dies of respective unit regions of a lead frame panel in the respective column cavities and inserting a blade into the respective column cavities of the mold between adjacent unit regions of the lead frame panel to separate individual molded package structures in the respective column cavities of the mold along a column direction.Type: ApplicationFiled: August 15, 2022Publication date: February 15, 2024Inventors: Makoto Shibuya, Han Meng @ Eugene Lee