Abstract: An integrated circuit (“IC”) package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.

Abstract: A circuit includes a conductive clip coupled to at least one component in the circuit. At least one lead portion is located on an end of the clip. The circuit further includes a first lead frame having at least one opening sized to receive the at least one lead portion. The at least one lead portion is received in the at least one opening and the at least one lead portion is an external conductor of the circuit.

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract: A dual transistor device includes a first transistor having a first drain, a first gate, and first source and a second transistor having a second drain, a second gate, and a second source. A first terminal is substantially flat and has a first surface. The first source is located adjacent a first portion of the first surface and is electrically coupled to the first terminal. The second drain is located adjacent a second portion of the first surface and is electrically coupled to the first terminal.

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

Abstract: The filter 3 is extruded to the outside of the casing of the air conditioner along the inner side of an open panel 15 which is provided at the front surface side of an air intake grill 14 and opened/closed at the time of the operation of the air conditioner.

Abstract: Provided is an inverter-integrated electric compressor wherein the attachability of a coil component has been improved while reliability of a connection state at the electrical joints is ensured by simplifying a mechanism which electrically connects the coil component, such as one for removing electromagnetic noise, to a motor drive circuit.

Abstract: Provided is an inverter-integrated electric compressor having high heat resistance, which is capable of suppressing thermal interference among a plurality of power devices. Specifically provided is an inverter-integrated electric compressor which comprises a built-in motor and a substrate provided with a motor drive circuit including an inverter, an electric component including the substrate being affixed in a housing space surrounded by a compressor housing, wherein a plurality of power semiconductor elements which constitute the motor drive circuit are disposed radially around a drive shaft of the motor in a plane crossing the drive shaft. For example, the planar shape of the power semiconductor element is formed into a rectangle, and a gap having a sectorial planar shape is formed between the power semiconductor elements adjacent to each other.

Abstract: There are provided a first guide channel 240 for making a U-turn of a leading end of a filter 3 at a front side of a main unit cabinet 1 during forward movement of the filter 3 and a second guide channel 141 for drawing a rear end of the filter to a rear surface side of the main unit cabinet 1 during backward movement of the filter 3.

Abstract: A device controls power supplied from an inverter having a semiconductor switching element to an electric compressor having an external drive source or a built-in motor. The device includes: an apparatus for calculating a starting current value required for starting the compressor from the pressure at the discharge side circuit of the compressor; an apparatus for calculating a permitted current value of the semiconductor switching element from the temperature of the inverter installation portion; and an apparatus for comparing the calculated compressor starting current value to the permitted current value of the semiconductor switching element so as to determine whether to permit a start of the compressor.

Abstract: Provided is an electric compressor whose manufacturing cost is reduced and in which a motor driving circuit can be positively protected. A temperature sensor is provided in the vicinity of a power semiconductor element whose temperature becomes highest among a plurality of power semiconductor elements and control of the number of revolutions of a motor is performed on the basis of temperatures detected by the temperature sensor, whereby it is possible to change the number of revolutions of the motor by using a temperature in the vicinity of a power semiconductor element in a position under the worst temperature conditions as a reference, and it becomes possible to positively protect an inverter circuit without the need for a plurality of temperature sensors.

Abstract: An electric compressor control device includes: an inverter for electric compressor motor; a communication microcontroller arranged in a low-voltage region for transmission of an instruction signal via a high-speed communication bus; and a control microcontroller arranged in a high-voltage region and connected to the communication microcontroller via an insulation element for transmitting the instruction signal from the communication microcomputer as an inverter control signal to the inverter. The power voltage of the communication microcomputer is supplied from a low-voltage power source. The voltage from the low-voltage power source is transformed via a transformer and supplied as a power voltage of the control microcontroller.

Abstract: An electric vacuum cleaner includes electric blower for generating a suction force; dust separating unit, installed on an upstream side of the electric blower, for separating dust from air containing the dust suctioned by electric blower; dust collecting chamber for accumulating the dust separated by dust separating unit opened to dust collecting chamber; and humidifying unit, communicating to humidifying port, for generating air of high humidity; wherein humidifying unit supplies the air of high humidity from humidifying port to the dust accumulated in dust collecting chamber.

Abstract: An air conditioner has a dust catch filter interposed between an inlet and a heat exchanger, a cleaning unit 5 for removing dust caught by the filter, and filter driver 18 for reciprocally driving the filter with respect to the cleaning unit 5. The cleaning unit 5 has a dust box 21 having a cleaning brush for removing dust caught on the surface of the filter and a filter hold plate that is attached to the dust box 21 and that holds a rear surface of the filter. The air conditioner is provided with cleaning brush driver 20 that draws the cleaning brush from the dust box 21 and brings the cleaning brush into contact with the filter during cleaning of the filter and that separates the cleaning brush from the filter and puts the cleaning brush in the dust box 21 when the filter is not cleaned.

Abstract: Provided is an inverter-integrated electric compressor having high heat resistance, which is capable of suppressing thermal interference among a plurality of power devices. Specifically provided is an inverter-integrated electric compressor which comprises a built-in motor and a substrate provided with a motor drive circuit including an inverter, an electric component including the substrate being affixed in a housing space surrounded by a compressor housing, wherein a plurality of power semiconductor elements which constitute the motor drive circuit are disposed radially around a drive shaft of the motor in a plane crossing the drive shaft. For example, the planar shape of the power semiconductor element is formed into a rectangle, and a gap having a sectorial planar shape is formed between the power semiconductor elements adjacent to each other.

Abstract: An inverter-integrated electric compressor configured in such a manner that a motor is incorporated within a compressor, a control circuit board is provided to an inverter section which is provided with a motor drive circuit for driving the motor, and electric component parts including the control circuit board is fixed within a containment space surrounded by a compressor housing, wherein the control circuit board is fixed within the housing space through a board-fixing section, and a board vibration-isolating member, said board vibration-isolating member consisting of an electrically insulative elastic material, is provided between the control circuit board and the board-fixing section. A frame member having a convcave holding section may be loaded on the control circuit board, and a board vibration-isolating member, said board vibration-isolating member consisting of an electrically insulative elastic material, may be provided between the control circuit board and the frame member.

Abstract: In an air conditioner having a main body provided with a panel 1 including a front panel 1a and a top panel 1b, the main body incorporating an air passage connecting an air inlet 2 and an air outlet 3, an air filter 4, a heat exchanger 5, a blower fan 6, and a dedusting device 7 attached to the front face of the air filter 4 which is reciprocated along the surface of the air filter 4, the top panel 1b is opened/closed as the dedusting device 7 is reciprocated.

Abstract: According to one embodiment, an electronic apparatus includes: an outer case formed of a thin metal plate and having a front plate and side plates surrounding the front plate, the side plate having a protrusion formed by bending an edge of the side plates inward of the outer case to prevent exposing the edge to exterior of the electronic apparatus; a middle member formed of a resin material and formed correspondingly to an inner surface of the outer case, the middle member having a side member that confronts the side plate, the side member having a retaining portion to engage with the protrusion; and a casing having a support portion and configured to confront an inside of the side member to keep the protrusion engaged with the retaining portion by preventing the side member from deflection.