Abstract: A polygonal panel mounting structure facilitates mounting work, enables a single worker to perform the mounting work, and can adapt to the deformation of a mounting surface of a wall, a roof, a ceiling, or the like even when the mounting surface is slightly deformed due to an earthquake, a strong wind, or the like, thus preventing the distortion of the mounted panel. A fitting portion of a fitting frame provided on a one side portion of a polygonal panel is loosely fitted into a fitting groove provided on one of furring strip base frames that are fixed parallel to each other on mounting surface of the polygonal panel, and a fitting cap provided at a corner facing the one side portion of the polygonal panel is fitted into a fitting receiver provided on the other of the furring strip base frames so as to be swingable.

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface for pressing the substrate against the polishing surface and further having a retaining ring arranged so as to surround the substrate and brought into contact with the polishing surface, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface. The at least one local load exerting mechanism is arranged so as not to rotate together with the substrate holder.

Abstract: An image forming apparatus including: an image bearer; an image formation unit forming toner image on the image bearer according to image formation conditions; a transfer unit including a transfer member, transferring the toner image on the image bearer to recording medium at a transfer nip between the image bearer and the transfer member; a toner adhesion amount detection unit detecting a toner adhesion amount of a toner pattern transferred from the image bearer to the transfer member; an image formation condition adjustment unit adjusting the image formation condition, based on a detection result of the toner adhesion amount detection unit; a transfer pressure setting change unit changing a transfer pressure setting of the transfer nip; and a correction unit correcting an adjustment value of the image formation condition adjustment unit, based on a correction value corresponding to a changed transfer pressure setting by the transfer pressure setting change unit.

Abstract: A coil component includes an element body having a mounting surface, and a terminal electrode disposed on the mounting surface, in which at least a part of the terminal electrode is embedded in the element body, the terminal electrode has an opening penetrating the terminal electrode in a direction orthogonal to the mounting surface, and a part of the element body is disposed in the opening.

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, terminal electrodes disposed in the element body, and a first connection conductor and a second connection conductor that connect the coil and the terminal electrodes. A plurality of first pores are provided in the coil, a plurality of second pores are provided in the first connection conductor and the second connection conductor, and an area of the second pore per unit area in the first connection conductor and the second connection conductor is larger than an area of the first pore per unit area in the coil.

Abstract: A coil component 1 includes an element body having a mounting surface, a coil disposed in the element body, terminal electrodes disposed on the mounting surface of the element body, and a first connection conductor and a second connection conductor connecting the coil and the terminal electrodes, respectively, in which the first connection conductor and the second connection conductor have first portions connected to the terminal electrodes, second portions connected to the coil, and third portions connecting the first portions and the second portions, respectively, and an area of a first pore per unit area in the first portion is larger than an area of a third pore per unit area in the third portion.

Abstract: A bus bar module includes a circuit body, a bus bar, a holder, and a cover configured to be assembled to the holder to protect the circuit body and the holder. The circuit body includes a belt-like main line that extends in a first direction, a belt-like branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position closer to a distal end of the branch line than a folded portion the branch line. The cover is structured so as to be stretchable and shrinkable in the first direction in accordance with a stretching and a shrinking of the holder in the first direction.

Abstract: A pedestrian airbag device includes an airbag and an inflator that supplies an inflating gas to the airbag. The airbag includes a cowl cover portion and two pillar cover portions. The inflator includes a main body portion having a substantially columnar outer shape, and a mounting bolt disposed to protrude from an outer peripheral surface of the main body portion in an axis orthogonal direction of the main body portion. The main body portion is mounted on an accommodation site side by using the mounting bolt in a state where the main body portion is inserted into the cowl cover portion while an axial direction is disposed to substantially extend along a left-right direction. A gas flow regulating member suppressing a rearward outflow of an inflating gas discharged from the main body portion is disposed at a position on a rear side of the main body portion inside the cowl cover portion.

Abstract: A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. The heat-fusible resin layer includes at least one layer having a hardness of at least 70 MPa from a cross-section in the lamination direction of the laminate, measured using a nanoindentation method using an indentation load of 100 ?N.

Abstract: Provided is a bonded body of copper alloy and steel material that has high bonding property at the interface of the copper alloy and the steel material, and is capable of maintaining a high strength without carrying out the subsequent precipitation hardening process accompanied by solution annealing (or by carrying out only the precipitation hardening process that is not accompanied by the solution annealing). This bonded body includes a first member composed of a precipitation-hardenable copper alloy and a second member including an additively manufactured object made of a steel material bonded to the first member at at least one bonding interface. The bonded body, when the cross section perpendicular to the bonding interface is observed by a scanning electron microscope (SEM), is free of voids having a length of 50 ?m or more at the bonding interface in a direction parallel to the bonding interface.

Abstract: A wiring member includes: a flat wiring body including a plurality of wire-like transmission members, and a base member that holds the plurality of wire-like transmission members to be flat; and a pattern provided on the flat wiring body, and making a three-dimensional posture of the flat wiring body recognizable.

Abstract: An image forming apparatus includes an image forming device to form an image on an image bearer based on a prescribed image-forming condition, and circuitry to change the prescribed image-forming condition and correct image-density unevenness in an image-width direction orthogonal to an image conveyance direction of the image bearer. In the image forming apparatus, the circuitry calculates a corrective value of the prescribed image-forming condition for each one of positions in the image-width direction, based on unevenness-in-density corrective values for the multiple positions in the image-width direction and relational values indicating a relation between the multiple unevenness-in-density corrective values and the corrective value of the prescribed image-forming condition, and the circuitry corrects the image-density unevenness in the image-width direction based on the corrective value of the prescribed image-forming condition.

Abstract: Provided is a cooling device using the vaporization heat of water, the cooling device capable of eliminating the need for a continuous supply of a large amount of water from the outside and reducing an environmental load. A cooling device 1 which cools a cooling target object 3 using vaporization heat of water includes: an air circulation mechanism 10 including an air circulation path 11 including a target object cooling section 11a for cooling the cooling target object 3 with the air mixed with the atomized water and an air cooling section 11b for cooling the heated air; and a water circulation mechanism 20 including a discharge portion 21 for discharging the water in the target object cooling section 11b, a tank 22 for collecting water condensed in the air cooling section 10b, and a pump 22 for delivering the water in the tank 22 to the discharge portion 21.

Abstract: A semiconductor device includes a substrate, a gate structure, a source region, a drain region, a doped region, and a channel region. The gate structure is disposed in the substrate, and the source region and drain regions being a first conductivity type respectively disposed at two sides of the gate structure. The doped region being a second conductivity type different from the first conductivity type is disposed below and separated from the gate structure, the source region, and drain region, the doped region. The channel region is disposed between the doped region and the gate structure and in contact with the doped region, and a dopant concentration of the channel region is less than a dopant concentration of the doped region.

Abstract: Provided is a cable holding device including: a housing includes a terminal having a crimping portion, a cable holding member includes an insertion hole and a guide portion, the crimping portion is insertable into the cable holding member through the insertion hole, the guide portion is provided in the insertion hole, has such a recessed shape that the crimping portion inserted into the insertion hole is fittable therein, and an inner wall of the guide portion includes a first inner wall and a second inner wall provided on a far side with respect to the first inner wall in the insertion hole, and a horizontal width of the second inner wall is set smaller than a horizontal width of the first inner wall such that the second inner wall restricts expansion of a horizontal width of the crimping portion when the crimping portion crimps the cable.

Abstract: Provided is a cable holding member including: a main body; a through-hole; and a cover portion, wherein the through-hole is configured to allow a cable to be inserted therethrough the main body, a part of the cover portion is configured to, upon the cover portion being bent relative to the main body, be capable of covering a plane intersecting with a direction where the cable is inserted, at an opening end face of an opening portion of the through-hole, the main body includes a latch portion, the cover portion includes a cantilever elastic piece having a latched portion, and it is configured in such a manner that upon the cover portion being bent relative to the main body, the elastic piece is elastically displaced at least in a direction along the direction where the cable is inserted, and the latched portion is capable of being latched to the latch portion.

Abstract: A semiconductor device includes a substrate, a gate structure, a source region, a drain region, a doped region, and a channel region. The gate structure is disposed in the substrate, and the source region and drain regions being a first conductivity type respectively disposed at two sides of the gate structure. The doped region being a second conductivity type different from the first conductivity type is disposed below and separated from the gate structure, the source region, and drain region, the doped region. The channel region is disposed between the doped region and the gate structure and in contact with the doped region, and a dopant concentration of the channel region is less than a dopant concentration of the doped region.

Abstract: Provided is a cable holding member which includes: an insulated main body; a through-hole; a bend portion; and a cover portion, in which the through-hole is configured to allow a cable to be inserted therethrough from one end side toward the other side of the main body, the cover portion is configured in such a manner as to be bendable relative to the main body along the bend portion, and at least a part of the cover portion is configured to, upon the cover portion being bent relative to the main body, be capable of covering a plane intersecting with a direction where the cable is inserted, at an opening end face of an opening portion of the through-hole, the opening end face being located on the other end side, or a vicinity thereof.

Abstract: An image forming apparatus includes an image forming device to form an image on an image bearer based on a prescribed image-forming condition, and circuitry to change the prescribed image-forming condition and correct image-density unevenness in an image-width direction orthogonal to an image conveyance direction of the image bearer. In the image forming apparatus, the circuitry calculates a corrective value of the prescribed image-forming condition for each one of positions in the image-width direction, based on unevenness-in-density corrective values for the multiple positions in the image-width direction and relational values indicating a relation between the multiple unevenness-in-density corrective values and the corrective value of the prescribed image-forming condition, and the circuitry corrects the image-density unevenness in the image-width direction based on the corrective value of the prescribed image-forming condition.

Abstract: The present invention provides a sintered metal friction material that has excellent wear resistance, heat resistance even at high load and has a higher friction coefficient while maintaining a friction coefficient and wear resistance that are hard to decrease, and has a reduced content of copper of less than 5 mass %. There is provided a sintered metal friction material characterized in that the sintered metal friction material comprises a sintered material of a friction material composition, the friction material composition comprises matrix metals and a friction modifier, the matrix metals comprise following 20 to 40 mass % of iron powder, 20 to 40 mass % of nickel powder, 0.5 to 10 mass % of zinc powder, 0.5 to 5 mass, of tin powder, 0.5 to 4 mass % of copper powder and 0.5 to 5 mass % of sintering assist powder.