Abstract: An apparatus for cleaning stainless steel or aluminum shutter members in a blanked and generally U-shaped form as they are fed continuously comprises a guide rail for guiding the shutter members so that they are transferred in a specified direction and a plurality of cleaning nozzles through which a cleaning solution is sprayed onto the shutter members. A plurality of vessels for supplying the cleaning solution to the Cleaning nozzles are provided along the guide rail and the cleaning solution overflowing a supply vessel downstream the guide rail is allowed to flow into sequentially upstream supply vessels via flow lines. The cleaning solution is recovered from the most upstream supply vessel and, after the cleaning debris is separated out, the cleaning solution is supplied into the most downstream supply vessel. The apparatus enables efficient cleaning of the shutter members.

Abstract: A semiconductor integrated circuit device with a built-in memory circuit group is disclosed, wherein wiring is started from a data terminal position near a data exchange portion of a memory circuit group to reduce the length of a wiring. Accordingly, an operation speed can be improved by the reduction of wiring capacitance and a ratio of unwired wirings can be reduced by reduction of an occupying ratio of wiring channels.

Abstract: A semiconductor integrated circuit device with a built-in memory circuit group is disclosed, wherein wiring is started from a data terminal position near a data exchange portion of a memory circuit group to reduce the length of a wiring. Accordingly, an operation speed can be improved by the reduction of wiring capacitance and a ratio of unwired wirings can be reduced by reduction of an occupying ratio of wiring channels.

Abstract: In a semiconductor integrated circuit device adopting a master slice system, a plurality of lattice points of an X-Y lattice-shaped channel region set by an automatic arrangement and routing system correspond to one input/output terminal of a prescribed basic cell (or logic circuit), thereby a plurality of signal wirings can be connected to the one input/output terminal.

Abstract: A semiconductor integrated circuit is so designed that it is possible to form any one of the three different kinds of circuit configuration, that is, an inverter circuit, a Schmitt circuit and a common-mode circuit, as desired, by employing circuit elements prepared in advance and by changing wiring. Also disclosed is a semiconductor integrated circuit having these circuit configurations. The output stage of any one of the three kinds of circuit is constituted by a bipolar transistor, and the other portions are constituted by MOS field-effect transistors.

Abstract: A semiconductor integrated circuit device, in which a system including a plurality of modules (functional blocks) such as a microprocessor unit and a memory unit is integrated on the main surface of a single semiconductor substrate, and each module of the system is connected through its corresponding interface circuits to the external terminals. The external terminals and the interface circuits are provided on the main surface of said semiconductor substrate, and are connected through an internal bus line commonly used between said modules. Also, and commonly use or internal bus line is connected directly to said external terminals to permit connection to a common external bus line.

Abstract: Compositions particularly adapted to the damping sheet are provided. They contain a binder component and a filler component consisting of inorganic fillers and an organic filler.The organic filler occupies from 1 to 25 parts by weight of the total amount of the filler and it is an organic fibrous filler having the fiber length of from about 50 to about 300.mu., the mean length being about 100.mu.. Quick lime occupies from 0.05 to 10 parts by weight of the total amount of the filler as one of the inorganic fillers. The compositions possess distinguished properties when used as the damping sheet for vehicles.

Abstract: An integrated circuit having the circuit construction wherein a plurality of each of input and output circuits are formed in such a manner as to form pairs and to correspond to a plurality of external connection pads, respectively, and are used selectively to replace the function of an internal circuit. A signal transmission path of an input circuit formed so as to correspond to an external connection pad to which an external input signal is applied at an input portion and at least part of a signal transmission path of an output circuit formed so as to correspond to the external connection pad are connected in series between the external connection pad and an input terminal of the internal circuit in order to use the signal transmission function of the output circuit as the function of the internal circuit.