Patents by Inventor Manfred Mengel

Manfred Mengel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200283636
    Abstract: A method for producing pigments having a specified contour, comprises the steps of creating a pigment layer on a starting substrate; detaching from the starting substrate; and structuring the pigment layer into a plurality of the pigments; characterized by bringing into contact the pigment layer with an intermediate substrate, wherein the pigment layer adheres at least in sections to the intermediate substrate; and separating intermediate substrate and starting substrate.
    Type: Application
    Filed: June 5, 2018
    Publication date: September 10, 2020
    Inventors: Christian FUHSE, Manfred HEIM, Patrick RENNER, Michael RAHM, Thomas MANG, Christoph MENGEL, Peter SCHIFFMANN, Maik Rudolf Johann SCHERER, Christoph HUNGER
  • Patent number: 10546767
    Abstract: In various embodiments, a wafer box is provided. The wafer box may include a housing with a receiving space for receiving a stack comprising a plurality of wafers, each arranged above a housing base. The wafers are to be arranged with their main surfaces parallel to the housing base. The receiving space is delimited by the housing base and side walls arranged thereon. The wafer box may further include at least one base opening, arranged in the housing base, for receiving a guide structure of a wafer stacking aid. The guide structure is to be arranged in such a way that, on a side of the housing base on which the side walls are arranged, it extends out of the housing base in order to limit tilting of a wafer raised or lowered in the receiving space in a manner guided by the guide structure.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 28, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Nina Wenger, Manfred Mengel, Andreas Niederhofer, Holger Tamme
  • Patent number: 10535542
    Abstract: Various embodiments provide a wafer box. The wafer box may include a housing with a receiving space for receiving at least one wafer arranged above a housing base, at least one fixing structure which is connected to the housing base and which extends from the housing base, and at least one fixing device which is fastenable to the at least one fixing structure at a variable distance from the housing base. The fixing device and the fixing structure are designed such that the at least one wafer for arrangement in the receiving space can be fixed in a position by means of the at least one fixing device fastened to the fixing structure.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 14, 2020
    Assignee: Infineon Technologies AG
    Inventors: Andreas Niederhofer, Manfred Mengel, Holger Tamme, Nina Wenger
  • Patent number: 10350206
    Abstract: Compounds of formula (I) as defined herein and their use as pharmaceuticals.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: July 16, 2019
    Assignee: Bayer Pharma Aktiengesellschaft
    Inventors: Anne Mengel, Hans-Georg Lerchen, Manfred Möwes, Thomas Müller, Lars Bärfacker, Marion Hitchcock, Arwed Cleve, Joachim Kuhnke, Hans Briem, Gerhard Siemeister, Wilhelm Bone, Amaury Ernesto Fernandez-Montalvan, Jens Schröder, Ursula Mönning, Simon Holton
  • Publication number: 20190131508
    Abstract: A thermoelectric device includes a plurality of first semiconductor mesa structures having a first conductivity type and a plurality of second semiconductor mesa structures having a second conductivity type. First semiconductor mesa structures of the plurality of first semiconductor mesa structures and second semiconductor mesa structures of the plurality of second semiconductor mesa structures are electrically connected in series. The thermoelectric device further includes a glass structure made of at least one of a borosilicate glass, boron-zinc-glass and a low transition temperature glass. The glass structure is arranged laterally between the first semiconductor mesa structures of the plurality of first semiconductor mesa structures and the second semiconductor mesa structures of the plurality of second semiconductor mesa structures.
    Type: Application
    Filed: November 1, 2018
    Publication date: May 2, 2019
    Inventors: Christian Kasztelan, Alexander Breymesser, Manfred Mengel, Andreas Niederhofer
  • Patent number: 9984897
    Abstract: A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: May 29, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Manfred Mengel, Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz
  • Publication number: 20180033662
    Abstract: In various embodiments, a wafer box is provided. The wafer box may include a housing with a receiving space for receiving a stack comprising a plurality of wafers, each arranged above a housing base. The wafers are to be arranged with their main surfaces parallel to the housing base. The receiving space is delimited by the housing base and side walls arranged thereon. The wafer box may further include at least one base opening, arranged in the housing base, for receiving a guide structure of a wafer stacking aid. The guide structure is to be arranged in such a way that, on a side of the housing base on which the side walls are arranged, it extends out of the housing base in order to limit tilting of a wafer raised or lowered in the receiving space in a manner guided by the guide structure.
    Type: Application
    Filed: July 28, 2017
    Publication date: February 1, 2018
    Inventors: Nina Wenger, Manfred Mengel, Andreas Niederhofer, Holger Tamme
  • Publication number: 20180033665
    Abstract: Various embodiments provide a wafer box. The wafer box may include a housing with a receiving space for receiving at least one wafer arranged above a housing base, at least one fixing structure which is connected to the housing base and which extends from the housing base, and at least one fixing device which is fastenable to the at least one fixing structure at a variable distance from the housing base. The fixing device and the fixing structure are designed such that the at least one wafer for arrangement in the receiving space can be fixed in a position by means of the at least one fixing device fastened to the fixing structure.
    Type: Application
    Filed: July 28, 2017
    Publication date: February 1, 2018
    Inventors: Andreas Niederhofer, Manfred Mengel, Holger Tamme, Nina Wenger
  • Publication number: 20170323865
    Abstract: A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.
    Type: Application
    Filed: July 26, 2017
    Publication date: November 9, 2017
    Inventors: Manfred MENGEL, Alexander HEINRICH, Steffen ORSO, Thomas BEHRENS, Oliver EICHINGER, Lim FONG, Evelyn NAPETSCHNIG, Edmund RIEDL
  • Patent number: 9790086
    Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: October 17, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel
  • Patent number: 9735126
    Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: August 15, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Manfred Mengel, Alexander Heinrich, Steffen Orso, Thomas Behrens, Oliver Eichinger, Lim Fong, Evelyn Napetschnig, Edmund Riedl
  • Publication number: 20170117208
    Abstract: An electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant, wherein the interface structure has a compressibility in a range between 1% and 20%, in particular in a range between 5% and 15%.
    Type: Application
    Filed: October 25, 2016
    Publication date: April 27, 2017
    Inventors: Christian KASZTELAN, Edward FUERGUT, Manfred MENGEL, Fabio BRUCCHI, Thomas BASLER
  • Patent number: 9567211
    Abstract: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: February 14, 2017
    Assignee: Infineon Technologies AG
    Inventors: Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel
  • Patent number: 9559078
    Abstract: An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: January 31, 2017
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz
  • Publication number: 20170004979
    Abstract: A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.
    Type: Application
    Filed: September 19, 2016
    Publication date: January 5, 2017
    Inventors: Manfred Mengel, Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz
  • Publication number: 20170003180
    Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
    Type: Application
    Filed: September 16, 2016
    Publication date: January 5, 2017
    Inventors: Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel
  • Publication number: 20160372399
    Abstract: Method for manufacturing an electronic semiconductor package, in which method an electronic chip (100) is coupled to a carrier, the electronic chip is at least partially encapsulated by means of an encapsulation structure having a discontinuity, and the carrier is partially encapsulated, and at least one part of the discontinuity and a volume connected thereto adjoining an exposed surface section of the carrier are covered by an electrically insulating thermal interface structure, which electrically decouples at least one part of the carrier with respect to its surroundings.
    Type: Application
    Filed: September 5, 2016
    Publication date: December 22, 2016
    Inventors: Edward FUERGUT, Manfred MENGEL
  • Publication number: 20160372393
    Abstract: A method for forming semiconductor devices includes placing a laminar structure having electrically insulating material arranged between a plurality of electrically conductive structures onto a surface of a semiconductor wafer comprising a plurality of semiconductor device structures. An electrically conductive structure of the plurality of electrically conductive structures is located adjacent to a semiconductor device structure of the plurality of semiconductor device structures. Each electrically conductive structure of the plurality of electrically conductive structures extends from a first surface of the laminar structure towards a second opposite surface of the laminar structure.
    Type: Application
    Filed: June 15, 2016
    Publication date: December 22, 2016
    Inventors: Christian Kasztelan, Alexander Breymesser, Manfred Mengel
  • Patent number: 9437513
    Abstract: Method for manufacturing an electronic semiconductor package, in which method an electronic chip (100) is coupled to a carrier, the electronic chip is at least partially encapsulated by means of an encapsulation structure having a discontinuity, and the carrier is partially encapsulated, and at least one part of the discontinuity and a volume connected thereto adjoining an exposed surface section of the carrier are covered by an electrically insulating thermal interface structure, which electrically decouples at least one part of the carrier with respect to its surroundings.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 6, 2016
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Manfred Mengel
  • Publication number: 20160240449
    Abstract: A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.
    Type: Application
    Filed: April 11, 2016
    Publication date: August 18, 2016
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz