Abstract: An apparatus for aging a chip, comprising a first bit line connected to a first memory cell; a second bit line connected to a second memory cell; an access circuit for accessing the first memory cell via the first bit line and for accessing the second memory cell via the second bit line; a first controller for selectively connecting/disconnecting the first bit line to the access circuit and from the access circuit, respectively; a second controller for selectively connecting/disconnecting the second bit line to the access circuit and from the access circuit, respectively; a normal operating mode controller for controlling the first and second controller, wherein the normal operating mode controller is formed such to select the first controller in a normal operating mode for accessing the first memory cell, and to connect the access circuit to the first bit line, while the second controller is controlled to disconnect the access circuit from the second bit line; wherein the apparatus comprises: an aging mode c

Abstract: A circuit arrangement for setting a voltage supply for a read/write amplifier of an integrated memory has a first voltage generator circuit for generating a supply voltage for application to the read/write amplifier during an assessment and amplification operation and a second voltage generator circuit for generating a precharge voltage for precharging bit lines of the memory which are connected to the read/write amplifier. A temperature detector circuit, which is connected to the first voltage generator circuit, is used to detect a temperature of the memory and interacts with the first voltage generator circuit to set the supply voltage applied to the read/write amplifier in a manner depending on a temperature of the memory.

Abstract: A test apparatus for testing integrated modules has a plurality of connection locations on a carrier substrate. An integrated module may be connected, via a connection location, to a test unit connected to the carrier substrate. The connection locations are arranged in groups within a connection array. A control terminal via which an integrated module may be selected for a test can be provided for each connection location. An address and command terminal can be provided for each connection location. The modules of the number of groups, which are simultaneously operated, are connected to the address and command bus via the respective switching means or switch. The test frequency can thus be increased without adversely affecting the driver load.

Abstract: A semiconductor product includes a first semiconductor circuit and at least one further integrated semiconductor circuit arranged together on a semiconductor substrate. The first semiconductor circuit and the at least one further semiconductor circuit are separated from one another by a frame region and each including contact connections. Interconnects cross the frame region and short-circuit a contact connection of the first semiconductor circuit with a contact connection of the at least one further semiconductor circuit.

Abstract: An integrated semiconductor memory includes at least one word line and a number of memory cells. Each memory cell has a selection transistor coupled to the word line. A word line driver is coupled to the word line. The word line driver provides a first electrical potential or a second electrical potential to the word line such that the word line is activated by the first electrical potential and is deactivated by the second electrical potential. A passive component (e.g., a diode or a resistor) is coupled between the word line and the second electrical potential such that the word line is coupled to the second electrical potential in a high-resistance fashion through the passive component. The passive component is transmissive for a leakage current between the word line and the contact connection.

Abstract: An integrated memory can include a memory cell array, which has word lines for the selection of memory cells, bit lines for reading out or writing data signals of the memory cells, and a sense amplifier connected to bit lines of a bit line pair at one end of the bit line pair. In an activated state during a memory access, at least one activatable isolation circuit which is switched into one of the bit line pairs can isolate a part of the bit line pair, which is more remote from the sense amplifier from the sense amplifier. As a result, the effective capacitance of the bit lines can be significantly reduced during the memory access.

Abstract: An integrated semiconductor memory includes a DRAM memory, in which primary sense amplifiers (SA) are coupled to a bit line (BL) of a respective cell block and can be connected to a common local data line (LDQ) by means of a respective assigned CSL switch in response to a CSL signal and in which an MDQ/LDQ switch arrangement connects a main data line (MDQ) to the local data line (LDQ) of a respective cell block in response to an MDQ/LDQ switch signal. In the case of the semiconductor memory, a control input of each CSL switch is connected to an AND element, which ANDs the CSL signal with the MDQ/LDQ switch signal and thereby activates the CSL switches only in cell blocks in which a word line has been activated.

Abstract: An integrated dynamic memory includes memory cells which are combined to form individual independently addressable units, and a control circuit for controlling a refresh mode for the memory cells. The memory cells can have their memory cell content refreshed. The control circuit is designed such that one or more units of memory cells can be subject to a refresh mode in parallel in a refresh cycle. The control circuit sets a number of memory cell units, which are to be refreshed in parallel in a refresh cycle based on a temperature reference value. A maximum possible operating temperature for a memory chip can be increased without additional restrictions on memory access.

Abstract: A voltage generator arrangement supplies a largely constant output voltage with a high current driver capability. A bandgap reference circuit drives a voltage generator on the output side, if necessary via an impedance converter. The bandgap reference circuit and the impedance converter on the one hand, and the voltage generator on the other hand, are connected to different reference ground potential lines. The voltage generator on the output side is preceded by a correction circuit, which corrects for the voltage drop on that reference ground potential line to which the output-side voltage generator is connected. The voltage generator arrangement is suitable for a greater integration density.

Abstract: An integrated memory has a memory cell array having word lines and bit lines. The bit lines are organized in bit line pairs. The bit lines of the bit line pairs cross one another at a crossing location and run parallel to one another. A sense amplifier is connected to one of the bit line pairs at one end. Two precharge circuits are provided. One precharge circuit is arranged on a side of the crossing location and the other precharge circuit is arranged on a side of the crossing location. The precharge circuit facing the sense amplifier is arranged at a first distance from the crossing location and at a second distance from the sense amplifier. The RC constant of the bit lines, which is effective during the precharge operation, is reduced, so that the time period required for a precharge operation is reduced.

Abstract: A RAM memory with a shared sense amplifier structure, in which sense amplifiers are arranged in strips between two adjacent cell blocks and are configured as differential amplifiers. In an exemplary embodiment, a one of four bit line pairs of the two adjacent cell blocks can be selected for connection to a sense amplifier at any one time using respective isolation transistor pairs, in response to a connection control signal fed to the latter. A signal sent on a word line coupled to a memory cell associated with the selected bit line pair, provides access to the memory cell by the sense amplifier.

Abstract: An integrated semiconductor memory, and method for operating such a memory, in particular a DRAM memory, having local data lines (LDQT, LDQC) segmented in the column direction (Y), which local data lines can be connected by a CSL switch in response to a column select signal fed via a CSL line (CSL) running in the row direction (X) to primary sense amplifiers for transferring or accepting spread data signals to or from bit lines of the respective segment (I, II, III), LDQ switches are arranged at the interfaces between adjacent segments of the local data lines (LDQT, LDQC) for their connection to the local data lines (LDQT, LDQC) of adjacent segments (I, II, III). LDQ switches, depending on a control signal fed separately to each of said LDQ switches, are closed during a precharge phase, which takes place before each read cycle, of at least two adjacent LDQ segments.

Abstract: A voltage generator arrangement supplies a largely constant output voltage with a high current driver capability. A bandgap reference circuit is downstream from an impedance converter and downstream a voltage generator. The bandgap reference circuit and the impedance converter on the one hand and the voltage generator on the other hand are connected to different reference ground potential line. The impedance converter contains a charge pump circuit to provide increased control potential, which drives the voltage generator. The voltage generator in contrast produces a reduced output potential. The influence of any voltage drop on that reference ground potential line to which the voltage generator is connected in the output potential is thus likewise reduced.

Abstract: A semiconductor memory includes storage cells (2) that have storage capacitors and transistors with an electrode, which is electrically biasable with two different electrical potentials (V1, V2) in order to open and close the transistor. The electrode potential (V2) intended for the off state of the transistor is a temperature-dependent potential, the value of which is controlled temperature-dependently by the semiconductor memory (1) so that the second electrical potential (V2) becomes more different from the first electrical potential (V1) as the temperature (T) increases.

Abstract: A dynamic RAM semiconductor memory with a shared sense amplifier organization concept, in which the cell arrays are subdivided into blocks whose bit lines are connected in pairs from two adjacent blocks in each case to a common sense amplifier and the sense amplifiers are disposed between the cell blocks. In which case bit line switches are disposed in sense amplifier strips—lying between the blocks—between in each case two adjacent sense amplifiers in order to momentarily connect the other ends—not connected to the sense amplifiers—of two bit line pairs from the adjacent cell blocks during a precharge phase of a bit line pair activated directly beforehand. The precharge phase takes place at the start of a charge equalization phase.

Abstract: The invention relates to a RAM store having a shared SA structure, in which sense amplifiers (SA) arranged in SA strips (10) between two respective adjacent cell blocks are used by a plurality of bit line pairs (21, 22; 21-24) from the adjacent cell blocks and the bit line pairs (21, 22; 21-24) have respective charge equalization circuits individually associated with them for the purpose of performing charge equalization between the bit line halves of the bit line pairs (21, 22; 21-24) in a precharge phase, where a shorting transistor (30) is provided which, when prompted by a control signal (EQLx), connects the bit line halves (BLT, BLC) of the bit line pairs (21, 22; 21-24) which are in the precharge phase to one another.

Abstract: A RAM memory with a shared sense amplifier structure, in which sense amplifiers are arranged in strips between two adjacent cell blocks and are configured as differential amplifiers. In an exemplary embodiment, a one of four bit line pairs of the two adjacent cell blocks can be selected for connection to a sense amplifier at any one time using respective isolation transistor pairs, in response to a connection control signal fed to the latter. A signal sent on a word line coupled to a memory cell associated with the selected bit line pair, provides access to the memory cell by the sense amplifier.

Abstract: The invention relates to an integrated semiconductor memory, in particular a DRAM memory, in which primary sense amplifiers (SA) are coupled to a bit line (BL) of a respective cell block and can be connected to a common local data line (LDQ) by means of a respective assigned CSL switch in response to a CSL signal and in which an MDQ/LDQ switch arrangement connects a main data line (MDQ) to the local data line (LDQ) of a respective cell block in response to an MDQ/LDQ switch signal. In the case of the semiconductor memory, a control input of each CSL switch is connected to an AND element, which ANDs the CSL signal with the MDQ/LDQ switch signal and thereby activates the CSL switches only in cell blocks in which a word line has been activated.

Abstract: An integrated semiconductor memory, and method for operating such a memory, in particular a DRAM memory, having local data lines (LDQT, LDQC) segmented in the column direction (Y), which local data lines can be connected by a CSL switch in response to a column select signal fed via a CSL line (CSL) running in the row direction (X) to primary sense amplifiers for transferring or accepting spread data signals to or from bit lines of the respective segment (I, II, III), LDQ switches are arranged at the interfaces between adjacent segments of the local data lines (LDQT, LDQC) for their connection to the local data lines (LDQT, LDQC) of adjacent segments (I, II, III). LDQ switches, depending on a control signal fed separately to each of said LDQ switches, are closed during a precharge phase, which takes place before each read cycle, of at least two adjacent LDQ segments.

Abstract: An additional test mode is introduced in a semiconductor memory. A multiplicity of word lines are simultaneously activated by a word line decoder in the test mode. After a potential equalization of complementary bit lines, a logic “0” or a logic “1” is applied to an equalization circuit via a voltage generator. It is thus possible for the entire memory cell array to be preallocated an identical data value or, in strip form, alternating data values. Test time is thereby saved.