Abstract: A method and system that provides a user with precision and accuracy of recommended information that matches the user's personality and behavior by obtaining the location of the user's mobile terminal, determining a target area based on the location, the target area including more than one signal transmission source, each signal transmission source carrying an ID that represents the signal transmission source, and the ID carried in the signal transmission source being transmitted within a target range by using the signal transmission source, obtaining other information from the terminal including user basic information and/or user behavior information and/or user relation chain information, selecting target display information associated with this information from the display information associated with the more than one ID of the terminal, and sending the target display information to the terminal.

Abstract: The disclosure provides an electronic package and a method of manufacturing the same. The method is characterized by encapsulating an electronic component with a packaging layer and forming on an upper surface of the packaging layer a circuit structure that is electrically connected to the electronic component; and forming a stress-balancing layer on a portion of the lower surface of the packaging layer to balance the stress exerted on the upper and lower surfaces of the packaging layer, thereby reducing the overall package warpage and facilitating the manufacturing process.

Abstract: A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurrence of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided.

Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.

Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

Abstract: A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurance of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided.

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

Abstract: A display method is applicable for a display apparatus. The display method includes transmitting preview data outputted by a client terminal to a host terminal such that the host terminal displays a preview image corresponding to the preview data. After the host terminal displays the preview image, if the host terminal outputs a first display permission signal, the display apparatus is utilized to display an image corresponding to an image signal outputted by the client terminal. A display apparatus, a video system and a projector are disclosed herein as well.

Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced.

Abstract: A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurance of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided.

Abstract: A package structure is provided, which includes: a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein one ends of the conductive wires are exposed from the encapsulant; and a circuit layer formed on the encapsulant and electrically connected to exposed ends of the conductive wires. According to the present invention, the conductive wires serve as an interconnection structure. Since the wire diameter of the conductive wires is small and the pitch between the conductive wires can be minimized, the present invention reduces the size of the chip carrier and meets the miniaturization requirement.

Abstract: This invention relates to liquid crystal compound of formula I containing benzene derivatives group that hydrogen substituted by deuterium. Liquid crystal compounds of formula I have not only large positive dielectric anisotropy, but also moderate optical anisotropy and driving voltage, thereby having great significance to formulate a liquid crystal mixture. A liquid crystal mixture containing such type of liquid crystal compounds can be applied in various display devices, which is particularly suitable for TN and STN display devices, and can also be used in IPS and VA display devices.

Abstract: The present invention is directed to compounds of the following General Formula I. The cyclopropyl-bearing liquid crystal compounds of Formula I of the present invention have a positive or negative dielectric anisotropy (??), an appropriate optical anisotropy (?n), an appropriate clearing point (CP), good low-temperature miscibility with other liquid crystals, a low rotary viscosity, and good UV stability and high-temperature thermal stability, and therefore have good use value. The compounds of the present invention can be used for preparing positive and negative liquid crystal compositions and can also be employed in passive and active matrix displays.

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

Abstract: The present invention is directed to compounds of the following General Formula I. The cyclopropyl-bearing liquid crystal compounds of Formula I of the present invention have a positive or negative dielectric anisotropy (??), an appropriate optical anisotropy (?n), an appropriate clearing point (CP), good low-temperature miscibility with other liquid crystals, a low rotary viscosity, and good UV stability and high-temperature thermal stability, and therefore have good use value. The compounds of the present invention can be used for preparing positive and negative liquid crystal compositions and can also be employed in passive and active matrix displays.

Abstract: This invention relates to liquid crystal compound of formula I containing a difluoromethyleneoxy linking group that hydrogen substituted by deuterium and therefore being very suitable for formulating a liquid crystal mixture. A liquid crystal mixture containing such type of liquid crystal compounds can be applied in various display devices.

Abstract: A display method is applicable for a display apparatus. The display method includes transmitting preview data outputted by a client terminal to a host terminal such that the host terminal displays a preview image corresponding to the preview data. After the host terminal displays the preview image, if the host terminal outputs a first display permission signal, the display apparatus is utilized to display an image corresponding to an image signal outputted by the client terminal. A display apparatus, a video system and a projector are disclosed herein as well.

Abstract: A package structure is provided, which includes: a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein one ends of the conductive wires are exposed from the encapsulant; and a circuit layer formed on the encapsulant and electrically connected to exposed ends of the conductive wires. According to the present invention, the conductive wires serve as an interconnection structure. Since the wire diameter of the conductive wires is small and the pitch between the conductive wires can be minimized, the present invention reduces the size of the chip carrier and meets the miniaturization requirement.

Abstract: A transmission management method, used for calculating a virtual lease line (VLL), the method includes: providing a user interface for input a start area and an end area of the VLL; receiving a request including the start area and the end area; determining whether there is a port of a router device located on the start area is directed to the end area; if not, determining whether there is a port of a default router device directed by the router device by default is directed to the end area; determining the router devices constituting the VLL when determining there is a router device is directed to the end area; and determining which ports of the router devices are ports to be connected to another port, and producing VLL information including the router devices constituting the VLL and the ports to be connected.