Abstract: A transmission path control system includes a management server and a number of path control device connected to the management server, each path control device is connected to one corresponding router device and located in the same area as that of the corresponding router device. The management server can transmit a virtual lease line (VLL) establishing request comprising information of a start area and an end area of the VLL to one of the path control devices when the management server receives the VLL establishing request from a user, the corresponding path control devices determines which router devices are transmission nodes constituting the VLL according to the start area and the end area, and establishes the VLL by connecting corresponding ports of the router devices determined as the transmission nodes constituting the VLL.

Abstract: A transmission path management method, configured to establish a virtual lease line (VLL), the method includes: assigning configuration information to ports to be connected according to VLL information including each router device determined as transmission nodes of the VLL and the ports to be connected, the configuration information comprising a VLL identifier code; labeling the ports used to connect of each router device by using the VLL identifier; and connecting the ports labeled the VLL identifier one by one to establish the VLL.

Abstract: An on-demand transmission path providing method includes: receiving a virtual lease line (VLL) establishing request including a start area and an end area of the VLL and an establishing duration of the VLL; producing a VLL establishing information including a connection relationship of router devices constituting the VLL and ports of the router devices to be connected; assigning a timed task for the VLL according to the establishing duration, therein, the timed task includes a start time and an end time when establishing the VLL; judging whether current time reaches to the beginning time of the timed task; and establishing the VLL if yes.

Abstract: A network system capable of enhancing connection performance includes a first connection object, a second connection object, and a virtual lease line (VLL) network. The VLL network includes a number of router devices, a number of path control devices, and a management server. Each router device is coupled to one corresponding path control device, and each router device and the corresponding path control device are located in one corresponding area. The management server is coupled to all of the path control devices; the management and the path control devices establish a VLL constituted by a number of router devices according to areas in which the first connection object and the second connection object locates. The first connection object and the second connection object are coupled to each other and communicate with each other via the VLL established in the VLL network.

Abstract: A transmission path control device is connected to a management server and a router device located on the same area as the transmission path control device. The transmission path control device determines whether a corresponding router device has a port directed to an end area when receiving a virtual lease line (VLL) establishing request including a start area and the end area of the VLL. If not, the transmission path control device transmits the VLL establishing request to a default transmission path control device. If yes, the transmission path control device determines which router devices are transmission nodes constituting the VLL and determines which ports are ports to be connected. The transmission path control device further connect the ports used to connect one by one, thus to establish the VLL.

Abstract: A transmission path management device includes a communication unit, a storage unit, and a processor. The communication unit is used to connect to a number of path control devices located in different areas. The processor is used to run a number of modules including an interface providing module to provide a user interface provided for a user to input a start area and an end area of a virtual lease line (VLL) to be established; a request receiving module to receive a VLL establishing request; an assignment module to assign a VLL identifier code to the VLL to be established; and a sending module to send the VLL establishing request and the VLL identifier code to the path control device located in a start area, thus to trigger the path control device located in the start area and related path control devices to determine and establish the VLL.

Abstract: A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurance of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided.

Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced.

Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced.

Abstract: This invention relates to liquid crystal compound of formula I containing a difluoromethyleneoxy linking group that hydrogen substituted by deuterium and therefore being very suitable for formulating a liquid crystal mixture. A liquid crystal mixture containing such type of liquid crystal compounds can be applied in various display devices.

Abstract: This invention relates to liquid crystal compound of formula I containing benzene derivatives group that hydrogen substituted by deuterium. Liquid crystal compounds of formula I have not only large positive dielectric anisotropy, but also moderate optical anisotropy and driving voltage, thereby having great significance to formulate a liquid crystal mixture. A liquid crystal mixture containing such type of liquid crystal compounds can be applied in various display devices, which is particularly suitable for TN and STN display devices, and can also be used in IPS and VA display devices.

Abstract: A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.

Abstract: An emergency light device includes a housing having an upper flange, a barrel having a peripheral rib engaged with the flange for latching the barrel to the housing and having a partition for forming two compartments, a plate disposed in the upper compartment and secured to the barrel and having a number of light members, a circuit board disposed in the lower compartment of the barrel and secured to the barrel and having a control circuit for controlling the light members, and a battery for energizing the light members, the circuit board and the plate may be solidly secured to the partition of the barrel, and the barrel may be quickly attached to the housing and to a hood, and the light device may be used as a flashlight or a hand-held light, and a night light.

Abstract: Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a second cavity penetrating the core layer and second metal layer. Portions of the second metal layer are exposed from a first cavity penetrating the core layer and first metal layer. Semiconductor chips each having an active surface with electrode pads thereon and an opposite inactive surface are received in the first and second cavities and attached to the second metal layer and the first metal layer respectively. Conductive vias disposed in build-up circuit structures electrically connect to the electrode pads of the semiconductor chips. A heat-dissipating through hole penetrating the core layer and build-up circuit structures connects the metal layers and contact pads.

Abstract: Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a second cavity penetrating the core layer and second metal layer. Portions of the second metal layer are exposed from a first cavity penetrating the core layer and first metal layer. Semiconductor chips each having an active surface with electrode pads thereon and an opposite inactive surface are received in the first and second cavities and attached to the second metal layer and the first metal layer respectively. Conductive vias disposed in build-up circuit structures electrically connect to the electrode pads of the semiconductor chips. A heat-dissipating through hole penetrating the core layer and build-up circuit structures connects the metal layers and contact pads.

Abstract: A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.

Abstract: A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility.

Abstract: The present invention concerns a process for preparing each of the 4 individual diastereomers of formula (I) in stereochemically pure form from a single enantiomerically pure precursor. The tetracyclic ringsystem having cis-fused five and seven membered rings is formed in a base-catalysed cyclization reaction.

Abstract: The present invention concerns a process for preparing each of the 4 individual diastereomers of formula (I) in stereochemically pure form from a single enantiomerically pure precursor. The tetracyclic ringsystem having cis-fused five and seven membered rings is formed in a base-catalysed cyclization reaction. The invention further relates to the thus obtained cis-fused tetracyclic alcohol intermediates and methanamine end-products, and the methanamine end-products for use as a medicine, in particular as CNS active medicines.

Abstract: Method and apparatus for making nanoparticles of a material having a diameter of 100 nanometers or less wherein the material to be formed into nanoparticles is evaporated to form a vapor plume therein, a non-reactive entrainment gaseous atmosphere suitable for evaporation conditions is introduced to a first chamber, a gaseous jet is directed through the vapor plume in a direction to carry nanoparticles formed by quenching of the vapor plume through a flow restriction orifice between the first chamber and a second chamber downstream of the first chamber, recirculation of the gaseous jet and nanoparticles entrained therein from the second chamber to the first chamber is substantially prevented to thereby provide a second stage of the gaseous jet downstream of the orifice and substantially isolated from said first chamber for flow to the second chamber, and collecting the nanoparticles from the second stage of said gaseous jet in a collection chamber downstream from the orifice.