Abstract: Fin structures and methods of manufacturing fin structures using a dual-material sidewall image transfer mask to enable patterning of sub-lithographic features is disclosed. The method of forming a plurality of fins includes forming a first set of fins having a first pitch. The method further includes forming an adjacent fin to the first set of fins. The adjacent fin and a nearest fin of the first set of fins have a second pitch larger than the first pitch. The first set of fins and the adjacent fin are sub-lithographic features formed using a sidewall image transfer process.

Abstract: Fin-defining spacers are formed on an array of mandrel structure. Mask material portions can be directionally deposited on fin-defining spacers located on one side of each mandrel structure, while not deposited on the other side. A photoresist layer is subsequently applied and patterned to form an opening, of which the overlay tolerance increases by a pitch of fin-defining spacers due to the mask material portions. Alternately, a conformal silicon oxide layer can be deposited on fin-defining spacers and structure-damaging ion implantation is performed only on fin-defining spacers located on one side of each mandrel structure. A photoresist layer is subsequently applied and patterned to form an opening, from which a damaged silicon oxide portion and an underlying fin-defining spacer are removed, while undamaged silicon oxide portions are not removed. An array of semiconductor fins including a vacancy can be formed by transferring the pattern into a semiconductor layer.

Abstract: In a replacement gate scheme, after formation of a gate dielectric layer, a work function material layer completely fills a narrow gate trench, while not filling a wide gate trench. A dielectric material layer is deposited and planarized over the work function material layer, and is subsequently recessed to form a dielectric material portion overlying a horizontal portion of the work function material layer within the wide gate trench. The work function material layer is recessed employing the dielectric material portion as a part of an etch mask to form work function material portions. A conductive material is deposited and planarized to form gate conductor portions, and a dielectric material is deposited and planarized to form gate cap dielectrics.

Abstract: In a replacement gate scheme, after formation of a gate dielectric layer, a work function material layer completely fills a narrow gate trench, while not filling a wide gate trench. A dielectric material layer is deposited and planarized over the work function material layer, and is subsequently recessed to form a dielectric material portion overlying a horizontal portion of the work function material layer within the wide gate trench. The work function material layer is recessed employing the dielectric material portion as a part of an etch mask to form work function material portions. A conductive material is deposited and planarized to form gate conductor portions, and a dielectric material is deposited and planarized to form gate cap dielectrics.

Abstract: In a replacement gate scheme, after formation of a gate dielectric layer, a work function material layer completely fills a narrow gate trench, while not filling a wide gate trench. A dielectric material layer is deposited and planarized over the work function material layer, and is subsequently recessed to form a dielectric material portion overlying a horizontal portion of the work function material layer within the wide gate trench. The work function material layer is recessed employing the dielectric material portion as a part of an etch mask to form work function material portions. A conductive material is deposited and planarized to form gate conductor portions, and a dielectric material is deposited and planarized to form gate cap dielectrics.

Abstract: A metal interconnect structure, which includes metal alloy capping layers, and a method of manufacturing the same. The originally deposited alloy capping layer element within the interconnect features will diffuse into and segregate onto top surface of the metal interconnect. The metal alloy capping material is deposited on a reflowed copper surface and is not physically in contact with sidewalls of the interconnect features. The metal alloy capping layer is also reflowed on the copper. Thus, there is a reduction in electrical resistivity impact from residual alloy elements in the interconnect structure. That is, there is a reduction, of alloy elements inside the features of the metal interconnect structure. The metal interconnect structure includes a dielectric layer with a recessed line, a liner material on sidewalls, a copper material, an alloy capping layer, and a dielectric cap.

Abstract: A metal interconnect structure, which includes metal alloy capping layers, and a method of manufacturing the same. The originally deposited alloy capping layer element within the interconnect features will diffuse into and segregate onto top surface of the metal interconnect. The metal alloy capping material is deposited on a reflowed copper surface and is not physically in contact with sidewalls of the interconnect features. The metal alloy capping layer is also reflowed on the copper. Thus, there is a reduction in electrical resistivity impact from residual alloy elements in the interconnect structure. That is, there is a reduction, of alloy elements inside the features of the metal interconnect structure. The metal interconnect structure includes a dielectric layer with a recessed line, a liner material on sidewalls, a copper material, an alloy capping layer, and a dielectric cap.

Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.

Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.

Abstract: An optical device inspection system and method employing a narrow aperture on a magnifying objective lens in order to reduce the circle of confusion and increase the depth of field. The smaller aperture resulting in an increase in depth of field allows for simultaneous focus for all portions of objects being inspected. An arc lamp with an elliptical reflector in combination with a condenser lens focuses a more intense beam of light through the objective lens, thereby providing sufficient brightness without sacrificing any depth of field.

Abstract: A method and apparatus for an inspection cell that allows contact lenses to be presented in a known orientation to an operator or vision system for inspection. The cell can be tipped to allow the inspected lens to be placed into a known pick-cup location upon passing inspection, or if the lens does not pass inspection, it can be discarded. The placement or discarding of the lens can be readily automated by selecting the rate at which the cell is tipped.

Abstract: An optical device inspection system and method employing a narrow aperture on a magnifying objective lens in order to reduce the circle of confusion and increase the depth of field. The smaller aperture resulting in an increase in depth of field allows for simultaneous focus for all portions of objects being inspected. An arc lamp with an elliptical reflector in combination with a condenser lens focuses a more intense beam of light through the objective lens, thereby providing sufficient brightness without sacrificing any depth of field.

Abstract: A method and apparatus for an inspection cell that allows contact lenses to be presented in a known orientation to an operator or vision system for inspection. The cell can be tipped to allow the inspected lens to be placed into a known pickup pick-cup location upon passing inspection, or if the lens does not pass inspection, it can be discarded. The placement or discarding of the lens can be readily automated by selecting the rate at which the cell is tipped.

Abstract: An assembly for orienting and fixturing an array of contact lenses in a lens-fixturing tray to enable automated picking of the lenses includes an array of tubes to which a first support tray having an array of lens receptacles each having a respective contact lens therein is removably mounted. A lens-fixturing tray having an array of lens receptacles is removably mounted to the other end of the tubes and the assembly is rotated and submerged in a fluid bath whereby the lenses release from the first support tray and float downwardly through a respective tube coming to rest in a centered, concave side-up position in a respective receptacle of the lens-fixturing tray.

Abstract: An assembly for orienting and fixturing an array of contact lenses in a lens-fixturing tray to enable automated picking of the lenses includes an array of tubes to which a first support tray having an array of lens receptacles each having a respective contact lens therein is removably mounted. A lens-fixturing tray having an array of lens receptacles is removably mounted to the other end of the tubes and the assembly is rotated and submerged in a fluid bath whereby the lenses release from the first support tray and float downwardly through a respective tube coming to rest in a centered, concave side-up position in a respective receptacle of the lens-fixturing tray.