Abstract: Proposed is a light source comprising: a plurality of LED light sources, each of the plurality of LED light sources having: a semiconductor diode structure adapted to generate light; and a light output section above the semiconductor diode structure adapted to output light from the semiconductor diode structure, the area of the light output section being less than the area of the semiconductor diode structure; and an optically transmissive structure overlapping the light output sections of the plurality of LED light sources so as to receive light from the light output sections of the plurality of LED light sources and having a light exit section adapted to output the received light. The area of the light exit section of the optically transmissive structure is less than the footprint area of the plurality of LED light sources.

Abstract: A liquid immersion transfer process for applying electronics on a 3D object and a system is disclosed. In one embodiment, the process comprises providing a foil on a solid carrier in a foil provision stage, providing electronic wiring and an electronic component to the foil in an electronics provision stage, to provide said electronics, removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage, and transferring the electronics to the 3D object in a transfer stage, as well as a 3D object obtainable by such process.

Abstract: The present invention relates to a device, system and method for detecting illness- and/or therapy-related fatigue of a person in an easy and reliable way. For this purpose the device comprises an input unit (20) for obtaining white blood cell count data related to the person's white blood cell count, hemoglobin level data related to the person's hemoglobin level and cortisol level data related to the person's cortisol level, and an analyzer (21) for detecting illness- and/or therapy-related fatigue of the person based on the obtained white blood cell count data, hemoglobin level data and cortisol level data.

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallisations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Abstract: A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer (50) over the guard layer (36) of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements (62, 64) and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements (62, 64) are formed by regions of reduced thickness or increased thickness in the guard layer (36).

Abstract: Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.

Abstract: A light source assembly, a method for producing a light source assembly, and a lamp are provided. In one example, the light source assembly comprises a substrate comprising first and second substrate portions being arranged at a tilt angle (?) to each other forming a V-shaped structure, wherein, at the tip of the V-shaped structure, the first portion comprises a first electrical terminal and the second portion comprises a second electrical terminal. The light source assembly further comprises a light source arranged to bridge a terminal gap between the first and second electrical terminals such that the light source is in electrical connection with the first and second electrical terminals.

Abstract: A lighting device (30) and a method of manufacturing such a lighting device are provided. The lighting device comprises a sheet assembly (7), which comprises a substrate (1) being at least partly light transmissive, a plurality of light sources (5) coupled to the substrate. At least a portion of the sheet assembly (7) is fixed in a rolled-up arrangement so as to form a roll (12), whereby the light sources (5) in the portion of the sheet assembly (7) are arranged to emit light at least partly inwards in the roll and/or at least partly towards at least one end (31) of the roll. The present invention is advantageous in that it provides enhanced lumen density output, which makes the lighting device useful for high brightness applications, such as head lights and fluid purification.

Abstract: According to an aspect there is provided a method of assessing the severity of chronic obstructive pulmonary disease, COPD, in a subject, the method comprising determining measurements of the breathing rate of the subject, the activity level of the subject, a measure of the respiratory effort of the subject and a measure of the severity or intensity of coughing by the subject; and combining the measurements of the breathing rate, the activity level, the measure of the respiratory effort and the measure of the severity or intensity of coughing to determine a score representing the severity of COPD in the subject.

Abstract: A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer (50) over the guard layer (36) of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements (62, 64) and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements (62, 64) are formed by regions of reduced thickness or increased thickness in the guard layer (36).

Abstract: A light emitting arrangement is suggested for generating directional projections of light with sharply defined beam profile. Light from a top-emitting solid state light source (12), having reflective side-coating (34), is pre-collimated via a beam-shaping optic (16), before being propagated through a secondary collimating funnel (18), capturing any light rays with still too great an escape angle. Chip-scale package dimensions may be achieved through the use of a thin-film side-coating and undersized phosphor layers. Substrate level process flow further allows for parallel processing of a plurality of devices.

Abstract: A lighting device (100) is provided comprising optically transmissive emitters and receivers. The receivers are configured to receive power via an optical signal transmitted from a light source (102). Furthermore, the receiver is provided with functionality for converting the optical signal to electrical power and supply an emitter with the electrical power. The optical signal may further comprise an address such that a receiver-emitter pair of the device may be wirelessly individually addressed and controlled. The optical signals of the device are not guided but are free to propagate through optically transmissive receivers, optically transmissive emitters or other optically transmissive materials of the lighting device. This enables a lighting device which provides new light effects in a simple manner.

Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.

Abstract: LED lighting elements are provided over a first conductive layer, each comprising a pad with top and bottom electrical contacts. A spray coating fills the spaces between the LED lighting elements. It also initially covers the LED lighting elements until a top portion of the sprayed material is removed to reveal the LED lighting element top contact. A second conductive layer is formed over the sprayed material and the revealed top contact, the second conductive layer being connected to a second electrical terminal.

Abstract: The invention provides a water-activatable luminescent particulate material (1) comprising particles (100), wherein each particle (100) comprises a solid state light source (10) functionally coupled with a water-activatable battery (20) and a water absorbing shell (120) enclosing at least part of the water-activatable battery (20). The invention also provides a luminescent particulate material spray device comprising a container configured to host the water-activatable luminescent particulate material.

Abstract: There is proposed a light source comprising: a semiconductor diode structure adapted to generate light; and an optical enhancement section above the semiconductor diode structure and adapted to output light from the semiconductor diode structure. A partially-reflective layer covers at least a portion of the top of the optical enhancement section and is adapted to reflect a portion of the output light towards the optical enhancement section. The partially-reflective layer has a light transmittance characteristic that varies laterally.

Abstract: A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c).

Abstract: Proposed is a light source comprising: first and second semiconductor diode structures adapted to generate light, the first and second semiconductor diode structures being laterally adjacent to each other; a light output section at least partially overlapping both of the first and second semiconductor diode structures and adapted to output light from the first and second semiconductor diode structures; and a light reflecting structure at least partially enclosing side surfaces of the first and second semiconductor diode structures and the light output section and adapted to reflect light from the semiconductor diode structures towards the light output section. The area of the light output section is less than the combined area of the first and second semiconductor diode structures.

Abstract: In a wafer bonding process, one or both of two wafer substrates are scored prior to bonding. By creating slots in the substrate, the wafer's characteristics during bonding are similar to that of a thinner wafer, thereby reducing potential warpage due to differences in CTE characteristics associated with each of the wafers. Preferably, the slots are created consistent with the singulation/dicing pattern, so that the slots will not be present in the singulated packages, thereby retaining the structural characteristics of the full-thickness substrates.

Abstract: Proposed is a light source comprising first and second LED light sources. Each of the first and second LED light sources have: a semiconductor diode structure adapted to generate light; and a light output section above the semiconductor diode structure adapted to output light from the semiconductor diode structure in a light output direction, the area of the light output section being less than the area of the semiconductor diode structure. The second LED light source is arranged above and at least partially overlapping the first LED light source with non-aligned light output sections with respect to the light output direction.