Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.

Abstract: The present invention is related to a lighting device (100, 200, 300) and to a method for manufacturing such lighting device (100, 200, 300). A template (102) is provided having cavities (104) distributed across the template (102). The cavities (104) define mounting positions for a plurality of light source packages (110) each comprising a light source (112). The shape of the cavities matches the shape of the light source packages (110) such that the light source packages (110) have a limited number of possible mounting configurations in the cavities (104). Subsequently electrical conductors (122) are applied on a top surface of the template (102) for contacting electrodes of the light source packages (110). The light source packages (110, 208, 300) or the plurality of cavities comprise a reflective bottom layer (132, 220) and a light emitting surface of the light source (112, 210) faces the reflective bottom layer (132, 220).

Abstract: In a wafer bonding process, one or both of two wafer substrates are scored prior to bonding. By creating slots in the substrate, the wafer's characteristics during bonding are similar to that of a thinner wafer, thereby reducing potential warpage due to differences in CTE characteristics associated with each of the wafers. Preferably, the slots are created consistent with the singulation/dicing pattern, so that the slots will not be present in the singulated packages, thereby retaining the structural characteristics of the full-thickness substrates.

Abstract: A system (100) for receiving electrical power wirelessly comprises a first (101) and a second electrode (102), with sandwiched there between at least one load module (103) dispersed in a matrix (104). Wherein at least the matrix (104) is applied in wet form.

Abstract: A method for producing a lighting device is disclosed. The method comprises: providing two or more light sources (1, 9) sandwiched between and electrically connected to a first electrically conductive layer (5) and a second electrically conductive layer (7), the first electrically conductive layer (5) being transparent or translucent and both of the first (5) and second (7) electrically conductive layers initially lacking a conductive pattern; and thereafter forming a first electrically conductive pattern (16) in the first electrically conductive layer (5) and a second electrically conductive pattern (7) in the second electrically conductive layer (7) to provide at least one desired electrical circuit for the lighting device the first electrically conductive pattern (16) being different from the second electrically conductive pattern (17).

Abstract: A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer (50) over the guard layer (36) of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements (62, 64) and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements (62, 64) are formed by regions of reduced thickness or increased thickness in the guard layer (36).

Abstract: The invention provides a cooking apparatus (CA) and method for preparing a food product (1) from a food component (10) in a cooking process, wherein the method comprises: acquiring food component input information concerning the food component; controlling a cooking process parameter of the cooking process as function of (i) the food component input information and (ii) a cooking process model, wherein the food component input information comprises historical information concerning the food component, and wherein the cooking process model includes a relation between the food component input information and the cooking process parameter of the cooking process for preparing the food product from the food component.

Abstract: A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.

Abstract: Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.

Abstract: A system (100) for receiving electrical power wirelessly comprises a first (101) and a second electrode (102), with sandwiched there between at least one load module (103) dispersed in a matrix (104). Wherein at least the matrix (104) is applied in wet form.

Abstract: A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.

Abstract: A liquid immersion transfer process for applying electronics on a 3D object and a system is disclosed. In one embodiment, the process comprises providing a foil on a solid carrier in a foil provision stage, providing electronic wiring and an electronic component to the foil in an electronics provision stage, to provide said electronics, removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage, and transferring the electronics to the 3D object in a transfer stage, as well as a 3D object obtainable by such process.

Abstract: A light emitting diode, LED, package (2) arranged to emit light when connected to an AC power supply (30), comprising a first and a second LED package terminal (24, 26), at least one pair of diodes (20, 22) connected in anti-parallel between the LED package terminals (24, 26), wherein at least one of the diodes is a light emitting diode. The first LED package terminal (24) is detachably connectable to a first power supply terminal (34), and adapted to form a first capacitive coupling (14) together with the first power supply terminal (34), and the second LED package terminal (26) is detachably connectable to a second power supply terminal (36), and adapted to form a second capacitive coupling (16) together with the second power supply terminal (36). By providing electrical connections which are less sensitive to temperature dependent degradation, the life time of the LED package (2) may be increased.

Abstract: A method according to embodiments of the invention includes growing on a first surface of a sapphire substrate a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure is formed into a plurality of LEDs. Cracks are formed in the sapphire substrate. The cracks extend from the first surface of the sapphire substrate and do not penetrate an entire thickness of the sapphire substrate. After forming cracks in the sapphire substrate, the sapphire substrate is thinned from a second surface of the sapphire substrate. The second surface is opposite the first surface.

Abstract: A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region and first and second metal contacts, wherein the first metal contact is in direct contact with the n-type region and the second metal contact is in direct contact with the p-type region. First and second metal layers are disposed on the first and second metal contacts, respectively. The first and second metal layers are sufficiently thick to mechanically support the semiconductor structure. A portion of a sidewall the device adjacent to one of the first and second metal layers is reflective.

Abstract: A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.

Abstract: A light source assembly, a method for producing a light source assembly, and a lamp are provided. In one example, the light source assembly comprises a substrate comprising first and second substrate portions being arranged at a tilt angle (?) to each other forming a V-shaped structure, wherein, at the tip of the V-shaped structure, the first portion comprises a first electrical terminal and the second portion comprises a second electrical terminal. The light source assembly further comprises a light source arranged to bridge a terminal gap between the first and second electrical terminals such that the light source is in electrical connection with the first and second electrical terminals.

Abstract: The invention relates to a LED package (10) suitable for capacitive driving, comprising at least one pair of anti-parallel oriented LEDs (20, 30). These LEDs are provided with electrical terminals (21, 22, 31, 32) at opposing surfaces of the LEDs. The LEDs are sandwiched between two substantially parallel oriented substrates (40, 50) of a dielectric material, which substrates are provided on their facing surfaces (41, 51) with a film (42, 52) of electrically conductive material, so that electrical contacts (61, 62) are available between the electrical terminals and the films of electrically conductive material. The LED package is cheap, technically simple, reliable and small-dimensioned, and can be applied in a LED assembly. A method for manufacturing such LED packages is claimed as well.

Abstract: A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.

Abstract: A lighting device (30) and a method of manufacturing such a lighting device are provided. The lighting device comprises a sheet assembly (7), which comprises a substrate (1) being at least partly light transmissive, a plurality of light sources (5) coupled to the substrate. At least a portion of the sheet assembly (7) is fixed in a rolled-up arrangement so as to form a roll (12), whereby the light sources (5) in the portion of the sheet assembly (7) are arranged to emit light at least partly inwards in the roll and/or at least partly towards at least one end (31) of the roll. The present invention is advantageous in that it provides enhanced lumen density output, which makes the lighting device useful for high brightness applications, such as head lights and fluid purification.