Abstract: Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer. The method comprises generating beamlet control data for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices, wherein the beamlet control data is generated based on a feature data set defining features selectable for individualizing the electronic devices, wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different selection of the features from the feature data set for different subsets of the electronic devices.

Abstract: Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer, wherein beamlet control data is generated for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices. The beamlet control data is generated based on design layout data defining a plurality of structures, such as vias, for the electronic devices to be manufactured from the wafer, and selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices. Exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of the structures for different subsets of the electronic devices.

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset.

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset.

Abstract: A method of creating electronic devices such as semiconductor chips using a maskless lithographic exposure system such as a charged particle multi-beamlet lithography system (301A-301D). The maskless lithographic exposure system comprises a lithography subsystem (316) including a maskless pattern writer such as a charged particle multi-beamlet lithography machine (1) or ebeam machine. The method comprises introducing unique chip design data (430) or information related thereto into pattern data comprising common chip design data before streaming the pattern data to the maskless pattern writer.

Abstract: An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.

Abstract: A lithography system having one or more lithography elements Each lithography element has a plurality of lithography subsystems. The lithography system further has a control network forming a control network path between the plurality of the lithography subsystems and at least one element control unit for communication of control information. The lithography system is arranged for: issuing control information to the at least one element control unit to control operation of one or more of the lithography subsystems for exposure of one or more wafers; issuing a process program to the element control unit. The process program has a set of predefined commands and associated parameters. The element control unit is arranged to transmit a command of the process program to a lithography subsystem to be executed by the lithography subsystem, regardless of an execution status of a preceding command transmitted to the lithography subsystem.

Abstract: The invention relates to a clustered substrate processing system comprising a plurality of lithography elements. Each lithography element is arranged for independent exposure of substrates according to pattern data, and comprises a plurality of lithography subsystems, a control network arranged for communication of control information between the lithography subsystems and at least one element control unit, the element control unit arranged to transmit commands to the lithography subsystems and the lithography subsystems arranged to transmit responses to the element control unit, and a data network arranged for communication of data logging information from the lithography subsystems to at least one data network hub, the lithography subsystems arranged to transmit data logging information to the data network hub and the data hub arranged for receiving and storing the data logging information. The system further comprises a cluster front-end for interface to an operator or host system.

Abstract: An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.

Abstract: An apparatus for transferring substrates within a lithography system, the lithography system comprising a substrate preparation unit for clamping a substrate onto a substrate support structure to form a clamped substrate, and an interface with a substrate supply system for receiving unclamped substrates. The apparatus comprises a body provided with a first set of fingers for carrying an unclamped substrate and a second set of fingers for carrying a substrate support structure, and the first set of fingers is located below the second set of fingers, and fingers of the first set of fingers have a different shape than the fingers of the second set of fingers.

Abstract: A lithography system having one or more lithography elements Each lithography element has a plurality of lithography subsystems. The lithography system further has a control network forming a control network path between the plurality of the lithography subsystems and at least one element control unit for communication of control information. The lithography system is arranged for: issuing control information to the at least one element control unit to control operation of one or more of the lithography subsystems for exposure of one or more wafers; issuing a process program to the element control unit. The process program has a set of predefined commands and associated parameters. The element control unit is arranged to transmit a command of the process program to a lithography subsystem to be executed by the lithography subsystem, regardless of an execution status of a preceding command transmitted to the lithography subsystem.

Abstract: A clustered substrate processing system comprising one or more lithography elements, each lithography element arranged for independent exposure of substrates according to pattern data. Each lithography element comprises a plurality of lithography subsystems, a control network arranged for communication of control information between the lithography subsystems and at least one element control unit for transmitting commands to and receiving responses from the lithography subsystems. Each lithography element also comprises a cluster front-end for interface to an operator or host system. The front-end is arranged for issuing a process program to the element control unit, the process program comprising a set of predefined commands and associated parameters, each command corresponding to a predefined action or sequence of actions to be performed by one or more of the lithography subsystems, and the parameters further defining how the action or sequence of actions are to be performed.

Abstract: The invention relates to a lithography system for patterning a target, said system comprising a feedback control system comprising an actuator for displacing the target, a measurement system for measuring a position of said target, and a control unit adapted for controlling the actuator based on the position measured by the measurement system, said feedback control system having a first latency being a maximum latency between measuring and controlling the actuator based on said measuring, a storage system for storing the measured positions, comprising a receive buffer and a storage unit with a second latency being an average latency between receiving measured positions in the receive buffer and storing said measured positions in the storage unit, wherein the first latency is at least an order of magnitude smaller than the second latency, the feedback control system comprising a unidirectional connection for transmitting said measured positions to the storage system.

Abstract: A method of processing substrates in a lithography system unit, the lithography system unit comprising at least two substrate preparation units, a load lock unit comprising at least first and second substrate positions, and a substrate handling robot for transferring substrates between the substrate preparation units and the load lock unit. The method comprises providing a sequence of substrates to be exposed to the robot, including an Nth substrate, an N?1th substrate, and an N+1th substrate; transferring the Nth substrate to a first one of the substrate preparation units; clamping the Nth substrate on a first substrate support structure in the first substrate preparation unit to form a clamped Nth substrate; transferring the clamped Nth substrate from the first substrate preparation unit to an unoccupied one of the first and second positions in the load lock unit; and exposing the clamped Nth substrate in the lithography system unit.

Abstract: A clustered substrate processing system comprising one or more lithography elements, each lithography element arranged for independent exposure of substrates according to pattern data. Each lithography element comprises a plurality of lithography subsystems, a control network arranged for communication of control information between the lithography subsystems and at least one element control unit for transmitting commands to and receiving responses from the lithography subsystems. Each lithography element also comprises a cluster front-end for interface to an operator or host system. The front-end is arranged for issuing a process program to the element control unit, the process program comprising a set of predefined commands and associated parameters, each command corresponding to a predefined action or sequence of actions to be performed by one or more of the lithography subsystems, and the parameters further defining how the action or sequence of actions are to be performed.

Abstract: An apparatus for transferring substrates within a lithography system, the lithography system comprising a substrate preparation unit for clamping a substrate onto a substrate support structure to form a clamped substrate, and an interface with a substrate supply system for receiving unclamped substrates. The apparatus comprises a body provided with a first set of fingers for carrying an unclamped substrate and a second set of fingers for carrying a substrate support structure, and the first set of fingers is located below the second set of fingers, and fingers of the first set of fingers have a different shape than the fingers of the second set of fingers.

Abstract: The invention relates to a clustered substrate processing system comprising a plurality of lithography elements. Each lithography element is arranged for independent exposure of substrates according to pattern data, and comprises a plurality of lithography subsystems, a control network arranged for communication of control information between the lithography subsystems and at least one element control unit, the element control unit arranged to transmit commands to the lithography subsystems and the lithography subsystems arranged to transmit responses to the element control unit, and a data network arranged for communication of data logging information from the lithography subsystems to at least one data network hub, the lithography subsystems arranged to transmit data logging information to the data network hub and the data hub arranged for receiving and storing the data logging information. The system further comprises a cluster front-end for interface to an operator or host system.

Abstract: A method of processing substrates in a lithography system unit, the lithography system unit comprising at least two substrate preparation units, a load lock unit comprising at least first and second substrate positions, and a substrate handling robot for transferring substrates between the substrate preparation units and the load lock unit. The method comprises providing a sequence of substrates to be exposed to the robot, including an Nth substrate, an N?1th substrate, and an N+1th substrate; transferring the Nth substrate to a first one of the substrate preparation units; clamping the Nth substrate on a first substrate support structure in the first substrate preparation unit to form a clamped Nth substrate; transferring the clamped Nth substrate from the first substrate preparation unit to an unoccupied one of the first and second positions in the load lock unit; and exposing the clamped Nth substrate in the lithography system unit.

Abstract: The invention relates to a lithography system for patterning a target, said system comprising a feedback control system comprising an actuator for displacing the target, a measurement system for measuring a position of said target, and a control unit adapted for controlling the actuator based on the position measured by the measurement system, said feedback control system having a first latency being a maximum latency between measuring and controlling the actuator based on said measuring, a storage system for storing the measured positions, comprising a receive buffer and a storage unit with a second latency being an average latency between receiving measured positions in the receive buffer and storing said measured positions in the storage unit, wherein the first latency is at least an order of magnitude smaller than the second latency, the feedback control system comprising a unidirectional connection for transmitting said measured positions to the storage system.

Abstract: During scanned exposure of target portions at the edge of the substrate, the position of an edge of the illumination field is changed so as to prevent or reduce radiation falling onto the substrate table or to expose an L-shaped area. In this way the heat load on the substrate table can be reduced and dummy structures can fill a mouse bite without overlapping an alignment mark.