Patents by Inventor Marco Francesco Aimi
Marco Francesco Aimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11854958Abstract: A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.Type: GrantFiled: July 27, 2022Date of Patent: December 26, 2023Assignee: General Electric CompanyInventors: Marco Francesco Aimi, Joseph Alfred Iannotti, Joleyn Eileen Brewer
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Patent number: 11525674Abstract: A measuring system is disclosed. The measuring system includes a surface acoustic wave (SAW) device including a piezoelectric substrate and a first and second electrode disposed on a surface of the piezoelectric substrate, and a measuring device communicatively coupled to the first electrode via a first probe and the second electrode via a second probe and configured to apply an electrical signal to the first and second electrode to generate an incident bulk acoustic wave within the piezoelectric substrate, detect at least a first reflected bulk acoustic wave and a second reflected bulk acoustic wave at the first and second electrode, and calculate a thickness between a first interface corresponding to the first reflected bulk acoustic wave and a second interface corresponding to the second reflected bulk acoustic wave based on a time elapsed between detecting the first and second reflected bulk acoustic waves.Type: GrantFiled: October 28, 2019Date of Patent: December 13, 2022Assignee: General Electric CompanyInventors: Marco Francesco Aimi, Joseph Alfred Iannotti
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Publication number: 20220367339Abstract: A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.Type: ApplicationFiled: July 27, 2022Publication date: November 17, 2022Inventors: Marco Francesco Aimi, Joseph Alfred Iannotti, Joleyn Eileen Brewer
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Patent number: 11499545Abstract: A sensor system for monitoring a condition of a piston rod includes an interrogator system having a first coil winding coupled to a housing and radially spaced from the piston rod such that a gap is defined between the first coil winding and the piston rod. A second coil winding is coupled to the piston rod and is inductively coupled to the first coil winding. The second coil winding is configured to communicate with the first coil winding through a range of linear movement of the piston rod relative to the housing. A sensor is coupled to the second coil winding. The sensor is configured to measure a characteristic associated with the piston rod and generate a current in the second coil winding to transmit, via the inductive coupling with the first coil winding, an electrical output signal associated with the characteristic to the interrogator system.Type: GrantFiled: July 19, 2019Date of Patent: November 15, 2022Assignee: General Electric CompanyInventors: Joseph Alfred Iannotti, Christopher James Kapusta, Marco Francesco Aimi
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Patent number: 11440051Abstract: A method of forming a capacitive micromachined ultrasonic transducer (CMUT) device includes bonding a CMUT substrate to a silicon on insulator (SOI) substrate. The CMUT substrate has a first thickness and the SOI substrate includes a handle, a buried oxide layer, and a device layer. At least one of the CMUT substrate or the SOI substrate includes a patterned dielectric layer. The device layer is bonded to the patterned dielectric layer to form a plurality of sealed cavities and the device layer forms a diaphragm of the plurality of cavities. The method further includes reducing the first thickness of the CMUT substrate to a second thickness and forming a plurality of through-silicon vias from a second surface of the CMUT substrate opposite the first surface.Type: GrantFiled: February 26, 2020Date of Patent: September 13, 2022Assignee: GENERAL ELECTRIC COMPANYInventors: Yizhen Lin, Marco Francesco Aimi, Alessandro Stuart Savoia
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Patent number: 11430728Abstract: A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.Type: GrantFiled: October 28, 2019Date of Patent: August 30, 2022Assignee: General Electric CompanyInventors: Marco Francesco Aimi, Joseph Alfred Iannotti, Joleyn Eileen Brewer
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Patent number: 11180366Abstract: A method includes obtaining an active device layer. The active device layer has a first surface with one or more active feature areas. First portions of the active feature areas are exposed, and second portions of the active feature areas are covered by an insulating layer. A conformal overcoat layer is formed on the first surface. A base of a microelectromechanical systems (MEMS) device layer is formed on the conformal overcoat layer. The MEMS device layer is spatially segregated from the active feature areas by removing portions of the base of the MEMS device layer in one or more antiparasitic regions (APRs) that correspond to the active feature areas. Metal MEMS features are formed on the base of the MEMS device layer. Selected portions of the active feature areas are exposed removing portions of the conformal overcoat layer that overlay the active feature areas.Type: GrantFiled: March 23, 2020Date of Patent: November 23, 2021Assignee: General Electric CompanyInventors: Marco Francesco Aimi, Joleyn Eileen Brewer
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Publication number: 20210292161Abstract: A method includes obtaining an active device layer. The active device layer has a first surface with one or more active feature areas. First portions of the active feature areas are exposed, and second portions of the active feature areas are covered by an insulating layer. A conformal overcoat layer is formed on the first surface. A base of a microelectromechanical systems (MEMS) device layer is formed on the conformal overcoat layer. The MEMS device layer is spatially segregated from the active feature areas by removing portions of the base of the MEMS device layer in one or more antiparasitic regions (APRs) that correspond to the active feature areas. Metal MEMS features are formed on the base of the MEMS device layer. Selected portions of the active feature areas are exposed removing portions of the conformal overcoat layer that overlay the active feature areas.Type: ApplicationFiled: March 23, 2020Publication date: September 23, 2021Inventors: Marco Francesco Aimi, Joleyn Eileen Brewer
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Publication number: 20210260622Abstract: A method of forming a capacitive micromachined ultrasonic transducer (CMUT) device includes bonding a CMUT substrate to a silicon on insulator (SOI) substrate. The CMUT substrate has a first thickness and the SOI substrate includes a handle, a buried oxide layer, and a device layer. At least one of the CMUT substrate or the SOI substrate includes a patterned dielectric layer. The device layer is bonded to the patterned dielectric layer to form a plurality of sealed cavities and the device layer forms a diaphragm of the plurality of cavities. The method further includes reducing the first thickness of the CMUT substrate to a second thickness and forming a plurality of through-silicon vias from a second surface of the CMUT substrate opposite the first surface.Type: ApplicationFiled: February 26, 2020Publication date: August 26, 2021Inventors: Yizhen Lin, Marco Francesco Aimi, Alessandro Stuart Savoia
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Publication number: 20210123730Abstract: A measuring system is disclosed. The measuring system includes a surface acoustic wave (SAW) device including a piezoelectric substrate and a first and second electrode disposed on a surface of the piezoelectric substrate, and a measuring device communicatively coupled to the first electrode via a first probe and the second electrode via a second probe and configured to apply an electrical signal to the first and second electrode to generate an incident bulk acoustic wave within the piezoelectric substrate, detect at least a first reflected bulk acoustic wave and a second reflected bulk acoustic wave at the first and second electrode, and calculate a thickness between a first interface corresponding to the first reflected bulk acoustic wave and a second interface corresponding to the second reflected bulk acoustic wave based on a time elapsed between detecting the first and second reflected bulk acoustic waves.Type: ApplicationFiled: October 28, 2019Publication date: April 29, 2021Inventors: Marco Francesco Aimi, Joseph Alfred Iannotti
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Publication number: 20210125918Abstract: A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.Type: ApplicationFiled: October 28, 2019Publication date: April 29, 2021Inventors: Marco Francesco Aimi, Joseph Alfred Iannotti, Joleyn Eileen Brewer
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Publication number: 20210017979Abstract: A sensor system for monitoring a condition of a piston rod includes an interrogator system having a first coil winding coupled to a housing and radially spaced from the piston rod such that a gap is defined between the first coil winding and the piston rod. A second coil winding is coupled to the piston rod and is inductively coupled to the first coil winding. The second coil winding is configured to communicate with the first coil winding through a range of linear movement of the piston rod relative to the housing. A sensor is coupled to the second coil winding. The sensor is configured to measure a characteristic associated with the piston rod and generate a current in the second coil winding to transmit, via the inductive coupling with the first coil winding, an electrical output signal associated with the characteristic to the interrogator system.Type: ApplicationFiled: July 19, 2019Publication date: January 21, 2021Inventors: Joseph Alfred Iannotti, Christopher James Kapusta, Marco Francesco Aimi
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Patent number: 10804174Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.Type: GrantFiled: November 30, 2018Date of Patent: October 13, 2020Assignee: General Electric CompanyInventors: Christopher James Kapusta, Marco Francesco Aimi
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Patent number: 10431509Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.Type: GrantFiled: October 31, 2014Date of Patent: October 1, 2019Assignee: General Electric CompanyInventors: Christopher James Kapusta, Marco Francesco Aimi
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Patent number: 10432168Abstract: In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.Type: GrantFiled: August 31, 2015Date of Patent: October 1, 2019Assignee: GENERAL ELECTRIC COMPANYInventors: Christopher James Kapusta, Marco Francesco Aimi
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Publication number: 20190103331Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.Type: ApplicationFiled: November 30, 2018Publication date: April 4, 2019Inventors: Christopher James Kapusta, Marco Francesco Aimi
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Patent number: 10211902Abstract: An antenna system includes a plurality of true time delay (TTD) modules, each having a plurality of switching elements configured to selectively define alternative RF signal transmission paths between a signal input and a signal output of the TTD module. A controller is programmed to control the plurality of TTD modules to steer a beam according to a make-before-break switching technique by closing a first pair of switching elements within at least a subset of the plurality of TTD modules to activate a first RF signal transmission path; closing a second pair of switching elements of the subset of the plurality of TTD modules to activate a second RF signal transmission path in parallel with the first RF transmission path; and opening the first pair of switching elements of the subset of TTD modules after closing the second pair of switching elements.Type: GrantFiled: October 13, 2017Date of Patent: February 19, 2019Assignee: General Electric CompanyInventors: Joseph Alfred Iannotti, Marco Francesco Aimi
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Patent number: 10208382Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.Type: GrantFiled: March 21, 2017Date of Patent: February 19, 2019Assignee: General Electric CompanyInventors: Christopher James Kapusta, Marco Francesco Aimi
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Patent number: 10196745Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.Type: GrantFiled: October 31, 2014Date of Patent: February 5, 2019Assignee: General Electric CompanyInventors: Christopher Kapusta, Marco Francesco Aimi
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Patent number: 9845235Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.Type: GrantFiled: September 3, 2015Date of Patent: December 19, 2017Assignee: General Electric CompanyInventors: Joleyn Eileen Brewer, Christopher Fred Keimel, Marco Francesco Aimi, Andrew Minnick, Renner Stephen Ruffalo