Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.

Abstract: A MEMS switch includes a substrate and a switch structure formed on the substrate, with the switch structure further including a conductive contact formed on the substrate, a self-compensating anchor structure coupled to the substrate, and a beam comprising a first end and a second end, the beam integrated with the self-compensating anchor structure at the first end and extending out orthogonally from the self-compensating anchor structure and suspended over the substrate such that the second end comprises a cantilevered portion positioned above the conductive contact. The cantilevered portion of the beam undergoes deformation during periods of strain mismatch between the substrate and the switch structure so as to have a takeoff angle relative to the substrate, and the self-compensating anchor structure directs a portion of the strain mismatch orthogonally to the cantilevered portion so as to warp the anchor and compensate for the takeoff angle of the cantilevered portion.

Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

Abstract: In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.

Abstract: A MEMS switch includes a substrate and a switch structure formed on the substrate, with the switch structure further including a conductive contact formed on the substrate, a self-compensating anchor structure coupled to the substrate, and a beam comprising a first end and a second end, the beam integrated with the self-compensating anchor structure at the first end and extending out orthogonally from the self-compensating anchor structure and suspended over the substrate such that the second end comprises a cantilevered portion positioned above the conductive contact. The cantilevered portion of the beam undergoes deformation during periods of strain mismatch between the substrate and the switch structure so as to have a takeoff angle relative to the substrate, and the self-compensating anchor structure directs a portion of the strain mismatch orthogonally to the cantilevered portion so as to warp the anchor and compensate for the takeoff angle of the cantilevered portion.

Abstract: An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, Cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.

Abstract: An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, Cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.

Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has gold/tin solder preforms attached to a sealing surface of the lid.

Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.

Abstract: X-ray imaging systems are provided that include an X-ray source and an X-ray detector. A filtering device is positioned between the X-ray source and the X-ray detector and includes one or more micro-filters each adapted to transition between an X-ray filtering position and an X-ray non-filtering position. A controller is programmed to control operation of the micro-filters.

Abstract: X-ray imaging systems are provided that include an X-ray source and an X-ray detector. A filtering device is positioned between the X-ray source and the X-ray detector and includes one or more micro-filters each adapted to transition between an X-ray filtering position and an X-ray non-filtering position. A controller is programmed to control operation of the micro-filters.

Abstract: A system includes a plurality of micro-electromechanical switches including a plurality of gates, coupled to each other. Each micro-electromechanical switch includes a beam electrode disposed on a substrate. A beam includes an anchor portion coupled to the beam electrode. The beam includes a first beam portion extending from the anchor portion along a first direction; and a second beam portion extending from the anchor portion along a second direction opposite to the first direction. A first control electrode and a first contact electrode are disposed on the substrate, facing the first beam portion. A second control electrode and a second contact electrode are disposed on the substrate, facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate among the plurality of gates. The plurality of micro-electromechanical switches is arranged in at least one of a series arrangement, parallel arrangement.

Abstract: An apparatus, such as an electrical distribution system, is provided. The apparatus can include a first conductor and a second conductor. Multiple conduction paths can form parallel electrical connections along a connection span between the first and second conductors, with each of the conduction paths having a respectively similar nominal electrical resistance. The first and second conductors can have respective cross-sectional areas that decrease in opposing directions along said connection span.

Abstract: A system includes a plurality of micro-electromechanical switches including a plurality of gates, coupled to each other. Each micro-electromechanical switch includes a beam electrode disposed on a substrate. A beam includes an anchor portion coupled to the beam electrode. The beam includes a first beam portion extending from the anchor portion along a first direction; and a second beam portion extending from the anchor portion along a second direction opposite to the first direction. A first control electrode and a first contact electrode are disposed on the substrate, facing the first beam portion. A second control electrode and a second contact electrode are disposed on the substrate, facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate among the plurality of gates. The plurality of micro-electromechanical switches is arranged in at least one of a series arrangement, parallel arrangement.

Abstract: A device, such as a switch structure, is provided. The switch structure can include a contact and a conductive element each respectively disposed on a substrate. The conductive element can be composed substantially of metallic material, and can be configured to be deformable between a first position, in which the conductive element is separated from the contact by a separation distance, and a second position, in which the conductive element contacts the contact and stores mechanical energy. The conductive element can be further configured such that, subsequent to being deformed into the second position at a temperature between about room temperature and about half of a melting temperature of the metallic material for a cumulative time of at least 107 seconds, the separation distance in the absence of external forces varies by less than 20 percent over the cumulative time. Associated methods are also provided.

Abstract: A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches.

Abstract: In accordance with one aspect of the present invention, a MEMS switch is provided. The MEMS switch includes a substrate, a first and a second actuating element electrically coupled together, an anchor mechanically coupled to the substrate and supporting at least one of the first and second actuating elements, and a gate driver configured to actuate the first and second actuating elements.

Abstract: A Micro-electro-mechanical systems (MEMS) switching array includes circuitry, which may be coupled to a gate line of the array to adjust a temporal distribution of a gating signal applied to a plurality of MEMS switches that make up the switching array. The temporal distribution may be shaped to reduce a voltage surge that can develop in the switches during switching of electrical current. This voltage surge reduction is conducive to improving the durability of the array.

Abstract: The switch incudes a beam electrode disposed on a substrate. A beam includes at least one anchor portion coupled to the beam electrode, a first beam portion extending from the at least one anchor portion along a first direction; and a second beam portion extending from the at least one anchor portion along a second direction opposite to the first direction. A first control electrode is disposed on the substrate facing the first beam portion. A first contact electrode is disposed on the substrate facing the first beam portion. A second control electrode is disposed on the substrate facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate. A second contact electrode is disposed on the substrate facing the second beam portion.

Abstract: A method to reduce an inductive voltage surge across a switch array is disclosed. The method comprises the steps of, (a) directing at least a portion of an electric current away from at least a portion of said switch array; and (b) independently opening different portions of the switch array. A system to reduce an inductive voltage surge across an electrical device comprising a current bypass circuit is also disclosed.