Abstract: A method for identifying an angle of roll for a multi-nozzle extruder includes moving the extruder in a first process direction to form a first set of swaths of extrusion material using two nozzles in the extruder and moving the extruder in a second process direction to form a second set of swaths of extrusion material. The method further includes identifying a location of one nozzle relative to the other nozzle in two dimensions based on cross-process direction distances between the first and second sets of swaths and identifying the angle of extruder roll for the extruder based on the location of the one nozzle and a predetermined geometry of the extruder.

Abstract: A method for identifying an angular deviation in the orientation of a multi-nozzle extruder includes moving the multi-nozzle extruder in a first process direction to form a first extrusion material swath and moving the multi-nozzle extruder in a second process direction opposing the first process direction to form a second extrusion material swath. The method further includes identifying widths and heights of the swaths from scanned image data and identifying a component of angular deviation for the multi-nozzle extruder with reference to at least one of a difference between the first swath width and the second swath width and another difference between the first swath height and the second swath height.

Abstract: A method for forming piezoelectric transducers for inkjet printheads includes: forming at least one piezoelectric layer on a substrate; forming at least one electrode pattern by depositing a conductive material on an exposed surface of the at least one piezoelectric layer; and forming a plurality of individual piezoelectric elements from the at least one piezoelectric layer before or after the forming of the at least one electrode pattern.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: An apparatus includes a heater for converting a filament of extrusion material into thermoplastic material. The heater has a channel configured to change the cross-sectional shape of the filament to a cross-sectional shape that has a greater surface area than the surface area of the filament before the heater receives the filament. The channel of the heater can also be configured to drive the center portion of the filament toward the heated walls of the channel and to mix thermoplastic material in the channel while exposing the center portion of the filament to the heated wall of the channel.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A method for forming piezoelectric transducers for inkjet printheads includes: forming at least one piezoelectric layer on a substrate; forming at least one electrode pattern by depositing a conductive material on an exposed surface of the at least one piezoelectric layer; and forming a plurality of individual piezoelectric elements from the at least one piezoelectric layer before or after the forming of the at least one electrode pattern.

Abstract: A multi-nozzle extrusion printhead includes a chamber with an inlet to receive an extrusion material and a plurality of outlets fluidly coupled to the chamber. The printhead also includes a plurality of valves that control flow of extrusion material through the fluid outlets to nozzles in the printhead. Each valve includes a member and an electromechanical actuator configured to move the member to a first position to block a flow of the extrusion material through one of the fluid outlets and nozzles and to a second position to enable the flow of the extrusion material through the fluid outlet and nozzles.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Abstract: A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Abstract: A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.

Abstract: An electrostatic ink jet printhead having an electrostatic actuator with improved resistance to adverse effects resulting from misalignment of a body layer to a gap standoff layer. In an embodiment, first and second portions of the gap standoff layer each have a first width and first and second sections of the body have each have a second width that is wider than the first width. Even with an amount of misalignment, the first and second sections of the body layer define nodes for an actuator membrane, thereby maintaining an effective width (WE) of the actuator membrane that is equal to a target width (WT) of the actuator membrane.

Abstract: A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.

Abstract: An electrostatic actuator for a printhead. The electrostatic actuator may include a substrate. A dielectric layer may be disposed on the substrate. An electrode layer may be disposed on the dielectric layer. A first standoff layer may be disposed at least partially on the electrode layer. A second standoff layer may be disposed at least partially on the electrode layer and at least partially on the first standoff layer. A portion of the second standoff layer disposed on the electrode layer may be removed to form one or more landing pads. A membrane may be disposed at least partially on the second standoff layer.