Abstract: A dielectric layer (e.g., an interpoly dielectric layer) is deposited over low and high voltage devices of a peripheral memory device. The dielectric behaves as an oxidation and wet oxide etch barrier. The dielectric prevents the devices from being stripped by a wet oxide etch that can result in the exposure of the silicon corners. The exposure of a silicon corner may increase thinning of a gate oxide at the field edge. This causes variability and unreliability in the device. The dielectric is not removed from a device until the device is ready for processing. That is, the dielectric remains on a device until the growing of a gate oxide on that device has begun. This reduces the exposure of the silicon corner. Hedges that result may be removed by exposing a trench in the field oxide at the hedge.

Abstract: A dielectric layer (e.g., an interpoly dielectric layer) is deposited over low and high voltage devices of a peripheral memory device. The dielectric behaves as an oxidation and wet oxide etch barrier. The dielectric prevents the devices from being stripped by a wet oxide etch that can result in the exposure of the silicon corners. The exposure of a silicon corner may increase thinning of a gate oxide at the field edge. This causes variability and unreliability in the device. The dielectric is not removed from a device until the device is ready for processing. That is, the dielectric remains on a device until the growing of a gate oxide on that device has begun. This reduces the exposure of the silicon corner. Hedges that result may be removed by exposing a trench in the field oxide at the hedge.

Abstract: A source line is formed by forming a source slot in a bulk insulation layer overlying a substrate to expose a portion of a substrate within the source slot, where the exposed portion of the substrate includes source regions of select gates associated with two or more columns of serially-connected floating-gate transistors formed on the substrate. A layer of epitaxial silicon is grown on the exposed portion so as to partially fill the source slot. A conductive layer is formed on the bulk insulation layer and on the layer of epitaxial silicon so as to substantially fill an unfilled portion of the source slot. The conductive layer is removed from a surface of the bulk insulation layer.

Abstract: Field-effect transistors, select gates, and select lines have first and second conductive layers separated by an interlayer dielectric layer. A conductive strap is disposed on either side of the first and second conductive layers. Each strap electrically interconnects the first and second conductive layers.

Abstract: In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer.

Abstract: Methods and apparatus are provided. A NAND memory device has a source line connected to two or more columns of serially-connected floating-gate transistors. The source line includes a first conductive layer formed on a substrate and coupled to source select gates associated with the two or more columns of serially-connected floating-gate transistors. The source line also includes a second conductive layer formed on the first conductive layer, where the second layer has a greater electrical conductivity than the first conductive layer.

Abstract: Apparatus and methods are provided. Field-effect transistors, select gates, and select lines have first and second conductive layers separated by an interlayer dielectric layer. A coductive strap is disposed on either side of the first and second conductive layers. Each strap electrically interconnects the first and second conductive layers.

Abstract: In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer.

Abstract: A method of forming an array of FLASH field effect transistors and circuitry peripheral to such array includes forming a sacrificial oxide over an array area and a periphery area of a semiconductor substrate. After forming the sacrificial oxide, at least one conductivity modifying implant is conducted into semiconductive material of the substrate within the array without conducting the one conductivity modifying implant into semiconductive material of the substrate within the periphery. The sacrificial oxide is removed from the array while the sacrificial oxide is left over the periphery. After removing the sacrificial oxide from the array, at least some FLASH transistor gates are formed within the array and at least some non-FLASH transistor gates are formed within the periphery.

Abstract: In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer.

Abstract: Thermal oxidation of a peripheral area of a semiconductor substrate is globally restricted with an overlying oxidation resistant layer that is not globally received within the array during formation of a sacrificial oxide layer prior to forming any transistor gate dielectric layer within the array. At least some FLASH field effect transistor gates having floating gate dielectric of a first thickness are formed within the array and at least some non-FLASH field effect transistor gates having gate dielectric of a second thickness are formed within the periphery, with the first and second thicknesses being different. Other aspects and implementations are disclosed.

Abstract: A dielectric layer (e.g., an interpoly dielectric layer) is deposited over low and high voltage devices of a peripheral memory device. The dielectric behaves as an oxidation and wet oxide etch barrier. The dielectric prevents the devices from being stripped by a wet oxide etch that can result in the exposure of the silicon corners. The exposure of a silicon corner may increase thinning of a gate oxide at the field edge. This causes variability and unreliability in the device. The dielectric is not removed from a device until the device is ready for processing. That is, the dielectric remains on a device until the growing of a gate oxide on that device has begun. This reduces the exposure of the silicon corner. Hedges that result may be removed by exposing a trench in the field oxide at the hedge.

Abstract: Thermal oxidation of a peripheral area of a semiconductor substrate is globally restricted with an overlying oxidation resistant layer that is not globally received within the array during formation of a sacrificial oxide layer prior to forming any transistor gate dielectric layer within the array. At least some FLASH field effect transistor gates having floating gate dielectric of a first thickness are formed within the array and at least some non-FLASH field effect transistor gates having gate dielectric of a second thickness are formed within the periphery, with the first and second thicknesses being different. Other aspects and implementations are disclosed.

Abstract: A method of forming an array of FLASH field effect transistors and circuitry peripheral to such array includes forming a sacrificial oxide over an array area and a periphery area of a semiconductor substrate. After forming the sacrificial oxide, at least one conductivity modifying implant is conducted into semiconductive material of the substrate within the array without conducting the one conductivity modifying implant into semiconductive material of the substrate within the periphery. The sacrificial oxide is removed from the array while the sacrificial oxide is left over the periphery.

Abstract: Thermal oxidation of a peripheral area of a semiconductor substrate is globally restricted with an overlying oxidation resistant layer that is not globally received within the array during formation of a sacrificial oxide layer prior to forming any transistor gate dielectric layer within the array. At least some FLASH field effect transistor gates having floating gate dielectric of a first thickness are formed within the array and at least some non-FLASH field effect transistor gates having gate dielectric of a second thickness are formed within the periphery, with the first and second thicknesses being different. Other aspects and implementations are disclosed.

Abstract: An efficient method for fabricating dual well type structures uses the same number of masks used in single well type structure fabrication. In a preferred embodiment, the current invention allows low voltage and high voltage n-channel transistors and low voltage and high voltage p-channel transistors to be formed in a single substrate. One mask is used for forming a diffusion well, a second mask for both forming a retrograde well and doping the well to achieve an intermediate threshold voltage in that well, and a third mask for both differentiating the gate oxides for the low voltage devices and doping the threshold voltages to achieve the final threshold voltages.

Abstract: The invention includes a method of forming a gated semiconductor assembly. A first transistor gate layer is formed over a substrate. A silicon nitride layer is formed over the first transistor gate layer. The silicon nitride layer comprises a first portion and a second portion elevationally displaced above the first portion. The first portion has less electrical resistance than the second portion and a different stoichiometric composition than the second portion. The first portion is physically against the second portion. A second transistor gate layer is formed over the silicon nitride layer.

Abstract: An efficient method for fabricating dual well type structures uses the same number of masks used in single well type structure fabrication. In a preferred embodiment, the current invention allows low voltage and high voltage n-channel transistors and low voltage and high voltage p-channel transistors to be formed in a single substrate. One mask is used for forming a diffusion well, a second mask for both forming a retrograde well and doping the well to achieve an intermediate threshold voltage in that well, and a third mask for both differentiating the gate oxides for the low voltage devices and doping the threshold voltages to achieve the final threshold voltages.

Abstract: An efficient method for fabricating dual well type structures uses the same number of masks used in single well type structure fabrication. In a preferred embodiment, the current invention allows low voltage and high voltage n-channel transistors and low voltage and high voltage p-channel transistors to be formed in a single substrate. One mask is used for forming a diffusion well, a second mask for both forming a retrograde well and doping the well to achieve an intermediate threshold voltage in that well, and a third mask for both differentiating the gate oxides for the low voltage devices and doping the threshold voltages to achieve the final threshold voltages.

Abstract: In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer.