Abstract: A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant.

Abstract: A device and methods are provided for a hearing device. In one embodiment, a hearing device includes a microphone to receive sound, an interactive tip and actuator. The actuator can include an actuator element and preload force element to place the interactive tip in contact with a portion of an ear. The hearing device includes circuitry coupled to the microphone and actuator, the circuitry configured to process sound received by the microphone and drive the actuator based on processed sound, wherein the actuator drives the interactive tip relative to a portion of the ear based on one or more signals received from the circuitry.

Abstract: Systems and methods that facilitate magnetic collection and/or manipulation of individual micropallets are provided. The embodiments provided herein are directed to a new method for collecting micropallets once released from a substrate. It is accomplished by endowing the micropallets with magnetic properties by incorporating ferromagnetic or superparamagnetic nanoparticles into the photoresist material or otherwise incorporating magnetically responsive material into the micropallet structure. The magnetic particles, which posses magnetic qualities, e.g., ferromagnetism, ferrimagnetism, paramagnetism, and are composed of iron, nickel, and/or other magnetic materials, are mixed into the bulk photoresist prior to its use in the fabrication of microstructures. Also covered are other methods of incorporating magnetically-attractable material into the micropallet structure, such as plating of the micropallets with a material that is magnetically responsive, such as nickel.

Abstract: Micro-electromagnetically actuated latched miniature relay switches formed from laminate layers comprising a spring and magnet, electromagnetic coils, magnetic latching material, and transmission line with contacts. Preferably the miniature relay switches transmit up to about 50 W of DC or AC line power, and carry up to about 10 A of load current, with an overall volume of less than about 100 mm3. In addition to switching large power, the device preferably requires less than 3 V to actuate, and has a latching feature that retains the switch state after actuation without the need for external applied voltage or current.

Abstract: A method is provided. The method includes providing an integrated circuit having a substrate. The method also includes locating a via within the substrate. The method further includes connecting the via to a corresponding heat spreader via. The corresponding heat spreader via may pass through a thermally conductive core of a heat spreader.

Abstract: A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.

Abstract: Systems and methods are provided for patterning biological and non-biological material at specific sites on a plate, as well as growing three dimensional structures. Preferred embodiments comprise a plate with regions that will trap gas, usually in the form of bubbles, when the plate is submerged in liquid. Other embodiment of the present invention include a method for placing materials on the plate at pre-determined locations through the use of trapped gas to prevent materials from collecting at unwanted regions. The plate has great utility for plating cells and tissues at specific sites, such as on an array. The disclosed method can also be used to coat the surface of a plate with coatings at specific locations for patterned coating applications and to build up materials to produce three dimensional structures, including micromechanical structures—where the structures may be formed from living or non-living material, tissue or non-tissue, organic or inorganic, and the like.

Abstract: A device and methods are provided for a hearing device. In one embodiment, a hearing device includes a microphone to receive sound, an interactive tip and actuator. The actuator can include an actuator element and preload force element to place the interactive tip in contact with a portion of an ear. The hearing device includes circuitry coupled to the microphone and actuator, the circuitry configured to process sound received by the microphone and drive the actuator based on processed sound, wherein the actuator drives the interactive tip relative to a portion of the ear based on one or more signals received from the circuitry.

Abstract: A hearing aid apparatus is provided. In one embodiment, a system and method are provided for using a tympanostomy tube as a platform for driving the middle ear. The system and method may employ a mechanical interface for driving the middle ear. In another embodiment, a hearing aid apparatus includes a direct-drive hearing device (DHD) having a silicone mold on one end, where the silicone mold has an attached magnet; and a tympanostomy tube with a ferromagnetic cap, where the tympanostomy tube is insertable into a tympanic membrane. The DHD is configured for insertion in an ear canal such that the magnet attached to the silicone mold is in contact with the ferromagnetic cap of the tympanostomy tube.

Abstract: A method of manufacturing a through-substrate-via structure. The method comprises providing a substrate having a front-side and an opposite back-side. A through-substrate via opening is formed in the front-side of the substrate. The through-substrate-via opening does not penetrate an outer surface of the back-side of the substrate. The through-substrate-via opening is filled with a solid fill material. Portions of the substrate from the outer surface of the back-side of the substrate are removed to thereby expose the fill material. At least portions of the exposed fill material are removed to form a back-side through-substrate via opening that traverses an entire thickness of the substrate. The back-side through-substrate via opening is filled with an electrically conductive material.

Abstract: A device and methods are provided for a hearing device. In one embodiment, a hearing device includes a microphone to receive sound, an interactive tip and actuator. The actuator can include an actuator element and preload force element to place the interactive tip in contact with a portion of an ear. The hearing device includes circuitry coupled to the microphone and actuator, the circuitry configured to process sound received by the microphone and drive the actuator based on processed sound, wherein the actuator drives the interactive tip relative to a portion of the ear based on one or more signals received from the circuitry.

Abstract: Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.

Abstract: A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant.

Abstract: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.

Abstract: Systems and methods are provided for patterning biological and non-biological material at specific sites on a plate, as well as growing three dimensional structures. Preferred embodiments comprise a plate with regions that will trap gas, usually in the form of bubbles, when the plate is submerged in liquid. Other embodiment of the present invention include a method for placing materials on the plate at pre-determined locations through the use of trapped gas to prevent materials from collecting at unwanted regions. The plate has great utility for plating cells and tissues at specific sites, such as on an array. The disclosed method can also be used to coat the surface of a plate with coatings at specific locations for patterned coating applications and to build up materials to produce three dimensional structures, including micromechanical structures—where the structures may be formed from living or non-living material, tissue or non-tissue, organic or inorganic, and the like.

Abstract: Magnetically actuated micro-electro-mechanical capacitor switches in laminate are disclosed. According to one embodiment, an apparatus comprises a first layer comprising a coil and magnetic element, the magnetic element made from one of nickel and iron; a second layer comprising a flexible member, wherein a permanent magnet is attached to the flexible member; a conductive plate having an insulating dielectric coating, the conductive plate attached to one of the flexible member or a magnet; and a third layer comprising a transmission line and magnetic material, wherein the transmission line comprises one or more of a signal conductor and one or more ground conductors in near proximity.

Abstract: A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously.

Abstract: An electronic device, comprising a semiconductor substrate having a first metal pad formed thereover, a device package substrate having a second metal pad formed thereover, and, a doped solder bump. The doped solder bump is located between and in contact with said first and second metal pads. The doped solder bump consisting of Sn, one or both of Ag and Cu, and a fourth row transition metal dopant in a concentration range from 0.35 wt. % to 2 wt. %.

Abstract: Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.

Abstract: A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously.