Abstract: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.

Abstract: An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.

Abstract: The methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.

Abstract: Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.

Abstract: The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.

Abstract: A method of forming a semiconductor device is disclosed. A semiconductor substrate is provided that has a first contact and an undoped electroplated lead-free solder bump (610) formed thereon. A device package substrate is provided that has a second contact and a doped lead-free solder layer (510) on the second contact that includes a dopant. The dopant reduces a solidification undercooling temperature of the undoped lead-free solder bump when the dopant is incorporated into the lead-free solder bump. The undoped electroplated lead-free solder bump and the doped lead-free solder layer are melted thereby incorporating the dopant into the undoped lead-free solder to form a doped solder bump (140). The solder bump provides an electrical connection between the first contact and the second contact.

Abstract: An apparatus provides environmental monitoring of an item and includes an RFID tag, and a passive switch for sensing an environmental parameter to which the item is subjected, and coupled to the RFID tag so that a measurement of the sensed environmental parameter can be stored, the RFID tag for providing remote readout of the sensed environmental parameter. A method provides environmental monitoring of an item and includes the steps of sensing an environmental parameter to which the item is subjected with activation of a passive switch, storing a measurement of the sensed environmental parameter upon the event of activation of the passive switch, and providing remote readout of the measurement of the sensed environmental parameter with an RFID tag.

Abstract: The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.

Abstract: Systems and methods are providing for performing high-throughput, programmable, multiplexed assays of biological, chemical or biochemical systems. Preferably, a micro-pallet includes a small flat surface designed for single adherent cells to plate, a cell plating region designed to protect the cells, and shaping designed to enable or improve flow-through operation. The micro-pallet is preferably patterned in a readily identifiable manner and sized to accommodate a single cell to which it is comparable in size. Each cell thus has its own mobile surface. The cell can be transported from place to place and be directed into a system similar to a flow cytometer. Since, since the surface itself may be tagged (e.g., a bar code), multiple cells of different origin and history may be placed into the same experiment allowing multiplexed experiments to be performed.

Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature disposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.

Abstract: A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.

Abstract: A semiconductor device has a singulated die having a substrate and a die edge. An interconnect dielectric layer is located on the substrate, and integrated circuit has interconnections located within the interconnect dielectric layer. A trench is located in the interconnect dielectric layer and between a seal ring and a remnant of the interconnect dielectric layer. The seal ring is located within the interconnect dielectric layer and between the trench and the integrated circuit, with the remnant of the interconnect dielectric layer being located between the trench and the edge of the die.

Abstract: A microfluidic dynamic vapor control system adapted to change the chemistry of small drops by dynamically controlling the vapor content surrounding the drops. The small volume surface area ratio makes this an efficient mechanism for controlling chemistry in nanovolumes. The system uses small reservoirs of material that can produce vapor on demand, and microfluidic channels that direct the vapor into a small chamber that holds a drop of the solution of interest. By changing the vapors that enter the chamber, the chemical composition of the drop can be modified.

Abstract: A plate manufactured to enable samples of cells, micro-organisms, proteins, DNA, biomolecules and other biological media to be positioned at specific locations or sites on the plate for the purpose of performing addressable analyses on the samples. Preferably, some or all of the sites are built from a removable material or as pallets so that a subset of the samples of interest can be readily isolated from the plate for further processing or analysis. The plate can contain structures or chemical treatments that enhance or promote the attachment and/or function of the samples, and that promote or assist in their analyses. Use of the plate advantageously enables the selection and sorting of cells based on dynamic phenomena and the rapid establishment of stable tranfectants.

Abstract: A plate manufactured to enable samples of cells, micro-organisms, proteins, DNA, biomolecules and other biological media to be positioned at specific locations or sites on the plate for the purpose of performing addressable analyses on the samples. Preferably, some or all of the sites are built from a removable material or as pallets so that a subset of the samples of interest can be readily isolated from the plate for further processing or analysis. The plate can contain structures or chemical treatments that enhance or promote the attachment and/or function of the samples, and that promote or assist in their analyses.

Abstract: An integrated circuit package comprising an integrated circuit that includes transistors coupled to copper interconnect structures. The integrated circuit package also comprises copper pads located on the integrated circuit and directly contacting uppermost ones of the copper interconnect structures. Each of copper pads has a thickness of at least about 2 microns. The integrated circuit package further comprises copper wires pressure-welded directly to the copper pads.

Abstract: An antenna whose resonance and electromagnetic radiation properties can be modified by environmental conditions, acoustic conditions, and the like. The reconfiguring antenna acts to facilitate wireless transmission of information about the local environment without the need for local power.

Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.

Abstract: Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.

Abstract: A directionally-sensitive device for detecting and processing vibration waves includes an array of polymeric optical waveguide resonators positioned between a light source, such as an LED array, and a light detector, such as a photodiode array. The resonators which are preferably oriented substantially perpendicularly with respect to incoming vibration waves, vibrate when a wave is detected, thus modulating light signals that are transmitted between the light source and the light detector. The light detector converts the modulated light into electrical signals which, in a preferred embodiment, are used to drive either the speaker of a hearing aid or the electrode array of a cochlear implant. The device is manufactured using a combination of traditional semiconductor processes and polymer microfabrication techniques.