Abstract: A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously.

Abstract: A method for providing environmental monitoring of an item with an electronic system includes the steps of operating the electronic system in a deep-sleep mode at a minimal level of power consumption by disabling operation of nonessential portions of the electronic system; activating the electronic system at a monitoring rate to sense an environmental parameter to which the item is subjected; sensing a value of the environmental parameter to which the item is subjected; comparing the sensed environmental parameter with the value of the environmental parameter just previously sensed to derive a rate of change of the environmental parameter; adjusting the monitoring rate to track the rate of change of the environmental parameter; storing the value of the sensed environmental parameter; and returning the electronic system to the deep-sleep mode.

Abstract: In one aspect, there is provided a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and has a contact support pillar opening formed therein. Contact support pillars that comprise a conductive metal and have a metal extension are located within the opening of the passivation layer.

Abstract: Devices, systems and methods for delivering pre-determined quantities of an active ingredient to a biological system are provided. In various embodiments, a device for controlled release of an active ingredient is provided, including a release aperture operably associated with a deflectable member, a base with a porous membrane substrate layer, and at least one chamber juxtaposed between the release aperture and the porous membrane layer. The chamber may contain a matrix including one or more active ingredients and an agent that expands when contacted with an aqueous solution. The device is suitable for implantation in a biological system and can be used for delayed and/or time release of specific drug dosages for various indications.

Abstract: An apparatus provides environmental monitoring of an item and includes an RFID tag, and a passive switch for sensing an environmental parameter to which the item is subjected, and coupled to the RFID tag so that a measurement of the sensed environmental parameter can be stored, the RFID tag for providing remote readout of the sensed environmental parameter. A method provides environmental monitoring of an item and includes the steps of sensing an environmental parameter to which the item is subjected with activation of a passive switch, storing a measurement of the sensed environmental parameter upon the event of activation of the passive switch, and providing remote readout of the measurement of the sensed environmental parameter with an RFID tag.

Abstract: A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.

Abstract: A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.

Abstract: The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.

Abstract: An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.

Abstract: A method and system for sponsored online fundraising in relation to an offer for purchase provided by a retailer, the fundraising campaign, the fundraising service and the retailer having respective account balances. The method comprises matching retailer offers against the fundraising campaign specifying a plurality of campaign criteria; generating a plurality of offers for purchase from among the retailer offers; selecting at least one offer for purchase from among the generated offers for purchase; publishing a fundraising campaign promoting the at least one offer; selecting and purchasing the offer promoted by the fundraising campaign; generating a voucher specifying the monetary value of the purchased offer; redeeming the voucher via a purchase transaction with the retailer, and allocating, from at least a portion of the monetary value, a first payment to the fundraising campaign account balance and a second payment to the fundraising service account balance.

Abstract: The various embodiments provided herein are generally directed to a method, system, and/or device for providing rehabilitation and assessing function from a portion of the human body. In one embodiment, there is disclosed a method, system, and/or device for providing rehabilitation and assessing of hand function using an audio interface. The audio interface may be a music-based interface and device may include a monitor unit, such as a hand monitoring unit, for providing data of a movement to a computing device, such as a microcontroller. The computing device may output data to a music-based interface.

Abstract: Systems and methods are provided for patterning biological and non-biological material at specific sites on a plate, as well as growing three dimensional structures. Preferred embodiments comprise a plate with regions that will trap gas, usually in the form of bubbles, when the plate is submerged in liquid. Other embodiment of the present invention include a method for placing materials on the plate at pre-determined locations through the use of trapped gas to prevent materials from collecting at unwanted regions. The plate has great utility for plating cells and tissues at specific sites, such as on an array. The disclosed method can also be used to coat the surface of a plate with coatings at specific locations for patterned coating applications and to build up materials to produce three dimensional structures, including micro-mechanical structures—where the structures may be formed from living or non-living material, tissue or non-tissue, organic or inorganic, and the like.

Abstract: A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.

Abstract: Systems and methods that facilitate magnetic collection and/or manipulation of individual micropallets are provided. The embodiments provided herein are directed to a new method for collecting micropallets once released from a substrate. It is accomplished by endowing the micropallets with magnetic properties by incorporating ferromagnetic or superparamagnetic nanoparticles into the photoresist material or otherwise incorporating magnetically responsive material into the micropallet structure. The magnetic particles, which posses magnetic qualities, e.g., ferromagnetism, ferrimagnetism, paramagnetism, and are composed of iron, nickel, and/or other magnetic materials, are mixed into the bulk photoresist prior to its use in the fabrication of microstructures. Also covered are other methods of incorporating magnetically-attractable material into the micropallet structure, such as plating of the micropallets with a material that is magnetically responsive, such as nickel.

Abstract: A device and methods are provided for a hearing device. In one embodiment, a hearing device includes a microphone to receive sound, an interactive tip and actuator. The actuator can include an actuator element and preload force element to place the interactive tip in contact with a portion of an ear. The hearing device includes circuitry coupled to the microphone and actuator, the circuitry configured to process sound received by the microphone and drive the actuator based on processed sound, wherein the actuator drives the interactive tip relative to a portion of the ear based on one or more signals received from the circuitry.

Abstract: The present invention provides a solder bump structure. In one aspect, the solder bump structure is utilized in a semiconductor device, such as an integrated circuit. The semiconductor device comprises active devices located over a semiconductor substrate, interconnect layers comprising copper formed over the active devices, and an outermost metallization layer positioned over the interconnect layers. The outermost metallization layer comprises aluminum and includes at least one bond pad and at least one interconnect runner each electrically connected to an interconnect layer. An under bump metallization layer (UBM) is located over the bond pad, and a solder bump is located over the UBM.

Abstract: Micro capacitive switches and methods of manufacturing micro capacitive switches at variable nominal capacitance value using micro-structures on the contact plates of the same dimension. In a preferred embodiment, a separately manufactured contact plate can be mounted to a movable magnet in order to be actuated to “on” and “off” state of the capacitive switch. Depending on the contact plate's surface condition, variable contact capacitance at “on” state can be precisely specified by geometrical properties of the micro-structures on the surface, such as the density, size and depth.

Abstract: Frequency addressable micro-actuators having one or more movable resonating elements actuators, such as cantilevers, can be forced into oscillation by, e.g., electromagnetic actuation. The movable structure is designed to latch at a certain amplitude using one of several latching techniques, such as a near-field magnetic field. In operation, the movable element is driven into resonance, producing a large amplitude, which results in the structure latching. Through resonance, a small force applied in a repeating manner can result in the latching of the actuator, an operation which would normally require a large force. If two or more units, each with different harmonic frequencies, are placed under the same influence, only the one with a harmonic response to the driving force will latch. A single influencing signal may be used to latch more than one device on demand by tuning the frequency to match the natural frequency of the device of interest.

Abstract: A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously.

Abstract: A method of manufacturing a through-substrate-via structure. The method comprises providing a substrate having a front-side and an opposite back-side. A through-substrate via opening is formed in the front-side of the substrate. The through-substrate-via opening does not penetrate an outer surface of the back-side of the substrate. The through-substrate-via opening is filled with a solid fill material. Portions of the substrate from the outer surface of the back-side of the substrate are removed to thereby expose the fill material. At least portions of the exposed fill material are removed to form a back-side through-substrate via opening that traverses an entire thickness of the substrate. The back-side through-substrate via opening is filled with an electrically conductive material.