Abstract: A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract: Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.

Abstract: A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.

Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

Abstract: An enhanced contact construction and loading support mechanism for plastic land grid array (PLGA) modules. A plurality of inverted hybrid land grid array (LGA) contacts are each respectively captured in and extend at least partially through one of a plurality of holes of an inverted hybrid LGA interposer. The inverted hybrid LGA contacts are affixed to a plurality of metal pads on a PLGA module carrier. Preferably, the inverted hybrid LGA contacts are affixed simultaneously using surface-mount technology (SMT) and have a metallurgy construction (e.g., beryllium-copper springs coated with nickel and hard gold) that provides enhanced wear and corrosion resistance. Each of the inverted hybrid LGA contacts is configured to make mechanical/pressure contact with a metal contact on another substrate, such as a printed wiring board (PWB).

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A pad array for a surface mount technology board includes a front row ground pad as a single pad, followed by a signal pad. The ground pads internal to the array may be arranged as pairs of pads interconnected to each other, with sandwiching signal pads on the internal portion of the array. To minimize stress on connector wafers of large scale connectors, external rows of ground pads may be enlarged by a predetermined amount in a Y-direction to minimize potential formation of stress risers, while ensuring that electrical spacing requirements to adjacent signal leads may be preserved for optimal signal integrity.

Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

Abstract: A method and apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.

Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape generating module, and a clamping arrangement for clamping the first, second and shape generating modules together. The shape generating module imparts a desired shape to the second module for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer, a second insulating layer and a shape producing layer disposed between the first and second insulating layers. The shape producing layer includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.