Patents by Inventor Mark Kenneth Hoffmeyer

Mark Kenneth Hoffmeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7197818
    Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: April 3, 2007
    Assignee: International Business Machines Corporation
    Inventors: Todd Arthur Cannon, William James Csongradi, Jr., Benjamin Aaron Fox, Roger John Gravrok, Mark Kenneth Hoffmeyer, David Lawrence Pease, Ryan James Schlichting
  • Patent number: 7199309
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: April 3, 2007
    Assignee: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Patent number: 7173193
    Abstract: A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: February 6, 2007
    Assignee: International Business Machines Corporation
    Inventors: William Louis Brodsky, Mark Kenneth Hoffmeyer, James R. Stack
  • Patent number: 7129417
    Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: October 31, 2006
    Assignee: International Business Machines Corporation
    Inventors: Todd Arthur Cannon, William James Csongradi, Jr., Benjamin Aaron Fox, Roger John Gravrok, Mark Kenneth Hoffmeyer, David Lawrence Pease, Ryan James Schlichting
  • Patent number: 7079398
    Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.
    Type: Grant
    Filed: September 27, 2003
    Date of Patent: July 18, 2006
    Assignee: International Business Machines Corporation
    Inventor: Mark Kenneth Hoffmeyer
  • Patent number: 6912780
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: July 5, 2005
    Assignee: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Publication number: 20040216919
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Application
    Filed: June 3, 2004
    Publication date: November 4, 2004
    Applicant: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Publication number: 20040188135
    Abstract: A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William Louis Brodsky, Mark Kenneth Hoffmeyer, James R. Stack
  • Patent number: 6784377
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: August 31, 2004
    Assignee: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Publication number: 20040080057
    Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.
    Type: Application
    Filed: September 27, 2003
    Publication date: April 29, 2004
    Applicant: International Business Machine Corporation
    Inventor: Mark Kenneth Hoffmeyer
  • Patent number: 6711026
    Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: March 23, 2004
    Assignee: International Business Machines Corporation
    Inventor: Mark Kenneth Hoffmeyer
  • Patent number: 6700068
    Abstract: An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site for form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: March 2, 2004
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson
  • Publication number: 20030089523
    Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 15, 2003
    Applicant: International Business Machines Corporation
    Inventor: Mark Kenneth Hoffmeyer
  • Patent number: 6499215
    Abstract: A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site to form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: December 31, 2002
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson
  • Patent number: 6497582
    Abstract: Land grid array (LGA) connectors are used to attach circuit modules to printed circuit boards that present an array of noble metal or semi-noble metal plated contacts to not only effect a reliable connection, but also enable circuit module release and replacement. During replacement, the connector is discarded and a replacement circuit module is used. Only the contact array on the printed circuit board is reused. An in situ gasket carried by the connector is compressed against the circuit board in the assembled condition to form a sealed enclosure about the contact array at the printed circuit board surface which excludes particulate and gaseous contaminants. Thus when the module is replaced, the contact array site on the printed circuit board does not require cleaning or processing to overcome degradation of the contact materials or surfaces.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: December 24, 2002
    Assignee: International Business Machines Corporation
    Inventor: Mark Kenneth Hoffmeyer
  • Publication number: 20020179324
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Application
    Filed: July 25, 2002
    Publication date: December 5, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Publication number: 20020166696
    Abstract: A method and structure to repair or modify a land grid array (LGA) interface mounted on a printed circuit card. The land grid array interface has a plurality of contact pads on a first surface of the printed circuit card, each contact pad is connected to at least one electronic component by a conductor. The method includes, for a preselected one of the contact pads to be replaced, drilling a first hole through printed circuit card at a predetermined location and having a first diameter predetermined to be sufficient to electrically isolate the preselected contact pad from all circuits contained in or on the printed circuit card. If any of the preselected contact pad or any conductor material directly attached to it remains attached to the first surface, it is delaminated, thereby separating it from the first surface of the printed circuit card.
    Type: Application
    Filed: May 10, 2001
    Publication date: November 14, 2002
    Applicant: International Business Machines Corporation
    Inventors: Bruce J. Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch F. Nuttall, James R. Stack
  • Publication number: 20020000329
    Abstract: An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site for form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.
    Type: Application
    Filed: August 8, 2001
    Publication date: January 3, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson
  • Patent number: 6300578
    Abstract: Fine pitch area array packaging is achieved using a via-in-pad design within the area array attach portion of a printed circuit board (PCB). The limitation of the design is the wicking action, whereby solder applied to the capture pad contact surface is depleted by capillary action into the via hole when reflowed, causing insufficient solder to be present at the contact surface to effect reliable and repeatable electrical connections. In one implementation, an initial application of solder is applied to plug the via hole with a material having a higher final melting temperature than eutectic solder, thereby providing a stable plug. This plug is formed by the initial solder application that may be either a eutectic solder containing a third metal that forms intermetallic compounds, when reflowed, that elevate the liquidus temperature or a solder having a different formulation with an inherent higher melting temperature.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: October 9, 2001
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, Phillip Duane Isaacs
  • Patent number: 6134776
    Abstract: A direct chip attach to heatsink structure is shown and described which implements rework when the chip must be removed and replaced. A laminated heatsink includes a metal heatsink with a foil layer adhered to the chip attachment surface with the assembly secured to a carrier at a cutout opening therein that defines the chip attach site. The adhesive, either a dry film adhesive or a pressure sensitive adhesive, secures foil layer to heatsink and provides the interface of separation when a chip must be removed and replaced. By peeling the foil away from the heatsink, the foil, chip and non-reworkable die attach adhesive are removed as a unit, leaving no chip attach adhesive residue at the attachment site to be scraped or abraded away. The replacement chip can be installed either by directly installing with new die attach adhesive or by first restoring the foil layer prior to chip installation.
    Type: Grant
    Filed: February 5, 1998
    Date of Patent: October 24, 2000
    Assignee: International Business Machines Corporation
    Inventor: Mark Kenneth Hoffmeyer