Patents by Inventor Mark Melvin

Mark Melvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11320722
    Abstract: In a thin flash module for a camera, a rectangular array of LEDs is mounted on a single lead frame. The lead frame connects the LEDs in series. The LEDs are much smaller than conventional LEDs in a flash module. The LEDs may be in 5×3 array or a 4×3 array, for example. An array of reflective cups is molded over the lead frame or attached to the 10 lead frame, where each of the cups has a substantially square aperture to produce a square sub-beam. A layer of phosphor is located within each cup overlying its associated LED to produce white light. The aspect ratio of the array is selected to generally match the aspect ratio of the camera's field of view (e.g., 16:9). Since the LEDs are very small, the height of the cups may be small to form an ultra-thin flash module. Thin lenses may instead be used.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: May 3, 2022
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Publication number: 20220102599
    Abstract: A light emitting device is disclosed. The light emitting device comprises a metal lead frame including a first lead and a second lead. The light emitting device comprises a first bonding pad on the first lead. The light emitting device comprises a second bonding pad on the second lead. The light emitting device comprises a structure molded on the first lead and the second lead. The structure includes walls extending from a first area of the structure proximate to the metal lead frame. The light emitting device comprises a light emitting diode (LED) die disposed on the first area of the structure. The LED die includes a first electrode electrically coupled to the first bonding pad and a second electrode electrically coupled to the second bonding pad. The light emitting device comprises an encapsulant partially filling the structure.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 31, 2022
    Applicant: LUMILEDS LLC
    Inventor: Mark Melvin Butterworth
  • Patent number: 11287726
    Abstract: In a thin flash module for a camera, a rectangular array of LEDs is mounted on a single lead frame. The lead frame connects the LEDs in series. The LEDs are much smaller than conventional LEDs in a flash module. The LEDs may be in 5×3 array or a 4×3 array, for example. An array of reflective cups is molded over the lead frame or attached to the 10 lead frame, where each of the cups has a substantially square aperture to produce a square sub-beam. A layer of phosphor is located within each cup overlying its associated LED to produce white light. The aspect ratio of the array is selected to generally match the aspect ratio of the camera's field of view (e.g., 16:9). Since the LEDs are very small, the height of the cups may be small to form an ultra-thin flash module. Thin lenses may instead be used.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 29, 2022
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Patent number: 11227982
    Abstract: An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of electrodes exposed at the bottom area of the cup for electrically contacting a set of LED die electrodes (18, 20). The lead frame also forms a second set of electrodes outside of the cup for connection to a power supply. A reflective metal (28) is then deposited on the curved walls of the cup. An LED die (16) is mounted at the bottom area of the cup and electrically connected to the first set of electrodes. The cup is then partially filled with an encapsulant (64) containing a phosphor (66).
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: January 18, 2022
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Patent number: 11081471
    Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: August 3, 2021
    Assignee: Lumileds LLC
    Inventors: Kentaro Shimizu, Brendan Jude Moran, Mark Melvin Butterworth, Oleg Borisovich Shchekin
  • Patent number: 11036114
    Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: June 15, 2021
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Patent number: 11031530
    Abstract: Embodiments of the invention include a light emitting device, a first wavelength converting material, and a second wavelength converting material. The first wavelength converting material includes a nanostructured wavelength converting material. The nanostructured wavelength converting material includes particles having at least one dimension that is no more than 100 nm in length. The first wavelength converting material is spaced apart from the light emitting device.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: June 8, 2021
    Assignee: Lumileds LLC
    Inventors: Debasis Bera, Mark Melvin Butterworth, Oleg Borisovich Shchekin
  • Patent number: 11003053
    Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: May 11, 2021
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Patent number: 10833227
    Abstract: Light emitting devices are described herein. A light-emitting device includes a substrate having a surface below an optical cavity, one or more light emitting diodes (LEDs) disposed above the surface of the substrate, a first wavelength-converting layer, and a second wavelength-converting layer. The first wavelength-converting layer is disposed on the surface of the substrate below the optical cavity, covers the entire surface of the substrate except for portions of the surface of the substrate that are situated underneath any of the one or more LEDs, and has a thickness that is equal to or less than a thickness of at least one of the one or more LEDs. The second wavelength-converting layer is disposed above the optical cavity.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: November 10, 2020
    Assignee: Lumileds LLC
    Inventors: Kenneth Vampola, Han Ho Choi, Mark Melvin Butterworth
  • Publication number: 20200328194
    Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 15, 2020
    Inventors: Kentaro SHIMIZU, Brendan Jude MORAN, Mark Melvin BUTTERWORTH, Oleg Borisovich SHCHEKIN
  • Publication number: 20200241391
    Abstract: In a thin flash module for a camera, a rectangular array of LEDs is mounted on a single lead frame. The lead frame connects the LEDs in series. The LEDs are much smaller than conventional LEDs in a flash module. The LEDs may be in 5×3 array or a 4×3 array, for example. An array of reflective cups is molded over the lead frame or attached to the 10 lead frame, where each of the cups has a substantially square aperture to produce a square sub-beam. A layer of phosphor is located within each cup overlying its associated LED to produce white light. The aspect ratio of the array is selected to generally match the aspect ratio of the camera's field of view (e.g., 16:9). Since the LEDs are very small, the height of the cups may be small to form an ultra-thin flash module. Thin lenses may instead be used.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 30, 2020
    Inventor: Mark Melvin Butterworth
  • Patent number: 10700044
    Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate having a high thermal conductivity is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: June 30, 2020
    Assignee: LUMILEDS LLC
    Inventors: Kentaro Shimizu, Brendan Jude Moran, Mark Melvin Butterworth, Oleg Borisovich Shchekin
  • Patent number: 10649315
    Abstract: In a thin flash module for a camera, a rectangular array of LEDs is mounted on a single lead frame. The lead frame connects the LEDs in series. The LEDs are much smaller than conventional LEDs in a flash module. The LEDs may be in 5×3 array or a 4×3 array, for example. An array of reflective cups is molded over the lead frame or attached to the lead frame, where each of the cups has a substantially square aperture to produce a square sub-beam. A layer of phosphor is located within each cup overlying its associated LED to produce white light. The aspect ratio of the array is selected to generally match the aspect ratio of the camera's field of view (e.g., 16:9). Since the LEDs are very small, the height of the cups may be small to form an ultra-thin flash module. Thin lenses may instead be used.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: May 12, 2020
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Publication number: 20200124941
    Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is monunted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex furface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Inventor: Mark Melvin Butterworth
  • Patent number: 10564520
    Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: February 18, 2020
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth
  • Publication number: 20190326483
    Abstract: Embodiments of the invention include a light emitting device, a first wavelength converting material, and a second wavelength converting material. The first wavelength converting material includes a nanostructured wavelength converting material. The nanostructured wavelength converting material includes particles having at least one dimension that is no more than 100 nm in length. The first wavelength converting material is spaced apart from the light emitting device.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 24, 2019
    Inventors: Debasis BERA, Mark Melvin BUTTERWORTH, Oleg Borisovich SHCHEKIN
  • Publication number: 20190250486
    Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 15, 2019
    Inventor: Mark Melvin Butterworth
  • Patent number: 10355182
    Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: July 16, 2019
    Assignee: LUMILEDS LLC
    Inventors: Walter Daeschner, Frederic Stephane Diana, Mohiuddin Mala, Ashim Shatil Haque, Mark Melvin Butterworth
  • Patent number: 10347800
    Abstract: Embodiments of the invention include a light emitting device, a first wavelength converting material, and a second wavelength converting material. The first wavelength converting material includes a nanostructured wavelength converting material. The nanostructured wavelength converting material includes particles having at least one dimension that is no more than 100 nm in length. The first wavelength converting material is spaced apart from the light emitting device.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: July 9, 2019
    Assignee: LUMILEDS LLC
    Inventors: Debasis Bera, Mark Melvin Butterworth, Oleg Borisovich Shchekin
  • Patent number: 10324359
    Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 18, 2019
    Assignee: Lumileds LLC
    Inventor: Mark Melvin Butterworth