Patents by Inventor Mark S. Johnson
Mark S. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240081802Abstract: Various methods and devices are provided for allowing multiple surgical instruments to be inserted into sealing elements of a single surgical access device. The sealing elements can be movable along predefined pathways within the device to allow surgical instruments inserted through the sealing elements to be moved laterally, rotationally, angularly, and vertically relative to a central longitudinal axis of the device for ease of manipulation within a patient's body while maintaining insufflation.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Inventors: Mark S. Ortiz, David T. Martin, Matthew C. Miller, Mark J. Reese, Wells D. Haberstich, Carl Shurtleff, Charles J. Scheib, Frederick E. Shelton, IV, Jerome R. Morgan, Daniel H. Duke, Daniel J. Mumaw, Gregory W. Johnson, Kevin L. Houser
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Patent number: 11887970Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: GrantFiled: June 27, 2022Date of Patent: January 30, 2024Assignee: Micron Technology, Inc.Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Publication number: 20230008716Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: ApplicationFiled: June 27, 2022Publication date: January 12, 2023Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Patent number: 11373979Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: GrantFiled: August 17, 2018Date of Patent: June 28, 2022Assignee: Micron Technology, Inc.Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Publication number: 20200148072Abstract: The disclosed system and methods advantageously track credits from generation through ownership trades to retirement; raw data will be submitted to one blockchain or a conventional database, while credit transactions will be tracked on a separate blockchain. This system leaves a simple audit trail, significantly reducing the time and cost associated with reconciliation and auditing and enables producers to monetize their credits quickly after generation. Importantly, while microtransactions are currently prohibitively expensive, the use of blockchain technology enables smaller producers to participate in credit programs, and incentives to be designed at the consumer level.Type: ApplicationFiled: November 7, 2019Publication date: May 14, 2020Inventors: Michael J. Ashley, Mark S. Johnson
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Publication number: 20180358331Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: ApplicationFiled: August 17, 2018Publication date: December 13, 2018Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Patent number: 10062667Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: GrantFiled: December 2, 2016Date of Patent: August 28, 2018Assignee: Micron Technology, Inc.Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Publication number: 20170084585Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: ApplicationFiled: December 2, 2016Publication date: March 23, 2017Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Patent number: 9515046Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: GrantFiled: March 18, 2013Date of Patent: December 6, 2016Assignee: Micron Technology, Inc.Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Patent number: 9490220Abstract: Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.Type: GrantFiled: February 2, 2015Date of Patent: November 8, 2016Assignee: Micron Technology, Inc.Inventor: Mark S. Johnson
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Patent number: 9447497Abstract: Disclosed are apparatus and methods for supplying a constant flow of precursor gas to a processing chamber. The apparatus described, and methods of use, allow a precursor ampoule to be removed from the gas delivery system without interrupting the process.Type: GrantFiled: March 13, 2014Date of Patent: September 20, 2016Assignee: Applied Materials, Inc.Inventors: Dien-Yeh Wu, Mark S. Johnson, David M. Santi, Hyman Lam
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Patent number: 9313902Abstract: Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.Type: GrantFiled: June 29, 2012Date of Patent: April 12, 2016Assignee: Micron Technology, Inc.Inventor: Mark S. Johnson
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Publication number: 20150145593Abstract: Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.Type: ApplicationFiled: February 2, 2015Publication date: May 28, 2015Inventor: Mark S. Johnson
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Patent number: 8946873Abstract: Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.Type: GrantFiled: August 28, 2007Date of Patent: February 3, 2015Assignee: Micron Technology, Inc.Inventor: Mark S. Johnson
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Publication number: 20140261733Abstract: Disclosed are apparatus and methods for supplying a constant flow of precursor gas to a processing chamber. The apparatus described, and methods of use, allow a precursor ampoule to be removed from the gas delivery system without interrupting the process.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Inventors: Dien-Yeh Wu, Mark S. Johnson, David M. Santi, Hyman Lam
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Patent number: 8400780Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.Type: GrantFiled: June 22, 2010Date of Patent: March 19, 2013Assignee: Micron Technology, Inc.Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
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Publication number: 20120302054Abstract: Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.Type: ApplicationFiled: June 29, 2012Publication date: November 29, 2012Applicant: MICRON TECHNOLOGY, INC.Inventor: Mark S. Johnson
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Patent number: 8222727Abstract: Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.Type: GrantFiled: November 5, 2009Date of Patent: July 17, 2012Assignee: Micron Technology, Inc.Inventor: Mark S. Johnson
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Publication number: 20110147910Abstract: Several embodiments of microelectronic device packaging configurations with lead frames without downsets are disclosed herein. In one embodiment, the configuration includes a pair of microelectronic dies with active surfaces facing one another, and a lead frame positioned between the dies. The lead frame has no downset and extends from between the dies and protrudes out of an encapsulant material. In one embodiment the lead frame is connected to both an upper and a lower die. In other embodiments, the lead frame is connected to a first die by wirebonds and is not connected to a second die. The first and second die may be connected to one another by interconnects such as solder ball interconnects.Type: ApplicationFiled: December 21, 2009Publication date: June 23, 2011Applicant: MICRON TECHNOLOGY, INC.Inventors: Tracy V. Reynolds, Mark S. Johnson
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Patent number: 7923824Abstract: The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads may have an outer length and an outer edge. The dam bar may include a plurality of dam bar elements, with each dam bar element being joined to the outer lengths of two adjacent leads. In this example, each dam bar element has an outer edge that extends farther outwardly than the outer edges of the two adjacent leads. The outer edges of the leads and the outer edges of the dam bar elements together define an irregular outer edge of the dam bar. Other lead frame structures and various microelectronic component assemblies are also shown and described.Type: GrantFiled: November 20, 2007Date of Patent: April 12, 2011Assignee: Micron Technology, Inc.Inventor: Mark S. Johnson