Abstract: A process for preparing a polybromoaryl ether, the polybromoaryl ether prepared by this process comprising adding to a solvent for the polybromoaryl ether a mixture of (1) at least one compound of the structure HO—Ar—X1X2X3X4X5, wherein Ar is an aryl group and X1, X2, X3, X4, and X5 are independently selected from hydrogen and bromine, provided that at least one of X1, X2, X3, X4, and X5 is bromine, (2) at least one alkali or alkaline metal hydroxide, and (3) at least one polymerization initiator, wherein said solvent for the polybromoaryl ether is a non-solvent for alkali metal bromides. The current invention also relates to a composition comprising a mixture of a polymeric resin and the polybromoaryl ether prepared by the process of the current invention.

Abstract: A process for preparing a polybromoaryl ether comprising adding to a solvent for the polybromoaryl ether a mixture of (1) at least one compound of the structure HO—Ar—X1, X2, X3, X4, X5, wherein Ar is an aryl group and X1, X2, X3, X4, and X5 are independently selected from hydrogen and bromine, provided that at least one of X1, X2, X3, X4, and X5 is bromine, (2) at least one alkali or alkaline metal hydroxide, and (3) at least one polymerization initiator, wherein the solvent for the polybromoaryl ether is a non-solvent for alkali metal bromides.

Abstract: The invention is a flame retardant for styrene foams. The flame retardant contains both aromatic bromine and an olefin. The olefin is an internal olefin. Desirable flame retardants are selected from: formula I: wherein R1 is C1-C6 and optionally containing a heteroatom or olefin; R2 is C1-C6 and optionally containing a heteroatom or olefin; and R3-R12 is H, C1-C6 (optionally containing a heteroatom), or halogen; and further wherein the compound of formula I is present in a concentration of at least 50 percent of a trans isomer; formula II: wherein R1 is Halogen, C1-C6 and optionally containing a heteroatom or olefin; R2 is Halogen, C1-C6 and optionally containing a heteroatom or olefin; and R3-R7 is H, C1-C6 (optionally containing a heteroatom), or halogen; and formula III: wherein R1 is Halogen, C1-C6 and optionally containing a heteroatom or olefin; R2 is Halogen, H, C1-C6 and optionally containing a heteroatom or olefin; and R3-R6 is H, halogen.

Abstract: A process for preparing a polybromoaryl ether, the polybromoaryl ether prepared by this process comprising adding to a solvent for the polybromoaryl ether a mixture of (1) at least one compound of the structure HO—Ar—X1, X2, X3, X4, X5, wherein Ar is an aryl group and X1, X2, X3, X4, and X5 are independently selected from hydrogen and bromine, provided that at least one of X1, X2, X3, X4, and X5 is bromine, (2) at least one alkali or alkaline metal hydroxide, and (3) at least one polymerization initiator, wherein said solvent for the polybromoaryl ether is a non-solvent for alkali metal bromides. The current invention also relates to a composition comprising a mixture of a polymeric resin and the polybromoaryl ether prepared by the process of the current invention.

Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.

Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.

Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.

Abstract: A mixture of hydroxyarylphosphine oxides comprising (a) a mono(hydroxyaryl)phosphine oxide, (b) a bis(hydroxyaryl)phosphine oxide, (c) a tris((hydroxyaryl)phosphine oxide, and, optionally (d) a tri- aryl, alkyl, or aralkyl-substituted phosphine oxide combined with a phenolic co-crosslinking composition is useful as a polyhtdroxy mixture for co-crosslinking an epoxy resin which also imparts flame resistance.

Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.

Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.

Abstract: A mixture of hydroxyarylphosphine oxides comprising (a) a mono(hydroxyaryl)phosphine oxide, (b) a bis(hydroxyaryl)phosphine oxide, (c) a tris(hydroxyaryl)phosphine oxide, and, optionally (d) a tri- aryl, alkyl or aralkyl-substituted phosphine oxide is useful in the preparation of polyglycidyl ethers derived therefrom, or is employed as flame retardants in epoxy resin compositions which can be processed into resin-impregnated composites.

Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.

Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.