Abstract: The invention relates to a measuring cell, comprising a support and a sensor, whereby a measuring chamber is arranged between the support and the sensor and the sensor is arranged on the support by means of individual material deposits provided between the support and the sensor. Said material deposits are preferably gold bumps.

Abstract: A pair of brake linings for a disk brake, particularly a disk brake with a sliding caliper, including one brake lining which is actively connected on the clamping side to a clamping device and one brake lining on the reaction side, each having a lining carrier plate and a friction lining which are frictionally arranged on a brake disk in a braking position. The pair of brake linings is embodied in such a way that the clamping-sided and reaction-sided lining carrier plate are adapted, configured and dimensioned differently corresponding to the respectively occurring loads and construction areas of the brake caliper.

Abstract: A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.

Abstract: A brake disc for a disc brake is provided, which can be fixed to a wheel hub, especially of a utility vehicle. The brake disc includes two concentric friction rings and a brake disc neck that is connected thereto and is joined to the wheel hub. The disc brake is embodied such that the brake disc neck is fastened to the wheel hub by way of a joining piece, which is connected in a fixed manner to the brake disc neck and be elastically deformed relative to the friction rings in an axial direction.

Abstract: A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.

Abstract: A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.