Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

Abstract: Various optoelectronic modules are described that include an emitter operable to produce light (e.g., electromagnetic radiation in the visible or non-visible ranges), an emitter optical assembly aligned with the emitter so as to illuminate an object outside the module with light produced by the emitter, a detector operable to detect light at one or more wavelengths produced by the emitter, and a detector optical assembly aligned with the detector so as to direct light reflected by the object toward the detector. In some implementations, the modules include features for expanding or shifting the linear photocurrent response of the detector.

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

Abstract: An optoelectronic module includes a light guide arranged to receive light, such as ambient light or light reflected by an object. The light guide has a diffractive grating that includes multiple sections, each of which is tuned to a respective wavelength or narrow band of wavelengths. The module further includes multiple photosensitive elements, each of which is arranged to receive light diffracted by a respective one of the sections of the diffractive grating. The module can be integrated, for example, as part of a spectrometer or other apparatus for optically determining characteristics of an object.

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Abstract: Imaging systems include multi-tap demodulation pixels for biometric measurements such as heart rate or blood oxygen level. Using multi-tap demodulation pixels can, in some cases, help facilitate the generation of differential signals to remove background noise and achieve a higher dynamic range for the biometric measurements.

Abstract: A time of flight-based system is operable for ambient light measurements. A method of operation includes detecting, in at least one active demodulation detection pixel, a first particular wavelength and generating amplitude data of the first particular wavelength; and detecting, in at least one spurious reflection detection pixel, a second particular wavelength and generating amplitude data of the second particular wavelength. In a computational device that stores spectrum data corresponding respectively to a plurality of different ambient light source types, an ambient lighting condition is determined based on the amplitude data of the first particular wavelength, the amplitude data of the second particular wavelength and the spectrum data of a particular one of the ambient light source types associated with the amplitude data of the first particular wavelength and the amplitude data of the second particular wavelength.

Abstract: An optoelectronic module includes a first light emitter operable to emit radiation at a first wavelength toward an object outside the module. The module also includes demodulation pixels operable to detect radiation of the first wavelength reflected from the object. One or more processors are operable to determine a distance to the object based on the radiation detected by the demodulation pixels. The module is further operable to perform a supplemental measurement other than distance.

Abstract: A lens module includes a substrate, a first array of passive optical elements on the substrate, and a second array of passive optical elements separate from the first array. The optical elements of the first array and the optical elements of the second array form multiple optical channels, in which at least one optical channel is a catadioptric optical channel including a reflective optical element and a refractive optical element. The reflective optical element is arranged to reflect light toward the refractive optical element, each optical channel has a corresponding field-of-view, and the lens module has an overall field of view defined by the range of angles subtended by the field-of-view of the plurality of optical channels.

Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract: The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement.

Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers.

Abstract: This disclosure describes optical systems for projecting an irregular or complex pattern onto a region of space (e.g., a two-dimensional or three-dimensional object or scene). A respective light beam is emitted from each of a plurality of light sources. The emitted light beams collectively are diffracted in accordance with a plurality of different first grating parameters to produce a plurality of first diffracted light beams. The first diffracted light beams then collectively are diffracted in accordance with one or more second grating parameters.

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.