Abstract: The method for manufacturing a plurality of optical modules each comprising a first (C1) and a second (C2) optical component comprises the steps of a) providing a first substrate wafer (S1) on which a plurality of the first optical components (C1) is present on a top side of the first substrate wafer; b) providing a second substrate wafer (S2) having a material region which is a continuous laterally defined region in which material of the second substrate is present, wherein a plurality of the second optical components (C2) is present in said material region; c) achieving a lateral alignment of the first (S1) and second (S2) substrate wafers such that each of the first optical components (C1) is present in a laterally defined region not overlapping said material region; d) interconnecting the first and second substrate wafers in said lateral alignment such that the top side of the first substrate wafer faces a bottom side of the second substrate wafer with no further wafer in between.

Abstract: A lens module includes a substrate, a first array of passive optical elements on the substrate, and a second array of passive optical elements separate from the first array. The optical elements of the first array and the optical elements of the second array form multiple optical channels, in which at least one optical channel is a catadioptric optical channel including a reflective optical element and a refractive optical element. The reflective optical element is arranged to reflect light toward the refractive optical element, each optical channel has a corresponding field-of-view, and the lens module has an overall field of view defined by the range of angles subtended by the field-of-view of the plurality of optical channels.

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract: An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.

Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

Abstract: The disclosure describes light sensing optoelectronic modules that include reflective surfaces to enhance light collection and/or light emission. For example, an optoelectronic module can include a light sensing element mounted on a substrate. A spacer over the substrate has a through-hole over the light sensing element. The through-hole is defined by a surface that is at least partially sloped or curved with respect to a plane of the substrate. The surface is highly reflective for light detectable by the light sensing element. Various methods for fabricating the modules are described as well.

Abstract: A peristaltic pump that includes an assembly including a rotor configured to compress a hose/tube being positioned on a pump cavity inner perimeter and an adjustment mechanism configured to adjust the compression force imposed on the hose/tube. The adjustment mechanism includes a gear unit and a counterpart for the gear unit. The counterpart is operatively coupled to the rotor, wherein the gear unit in cooperation with the counterpart is configured to adjust a gap between the rotor outer surface and the pump cavity inner perimeter. The assembly is fixed to a sliding guide that is configured to support the hose/tube.

Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers.

Abstract: The invention concerns a peristaltic hose pump and an equipment for the peristaltic hose pump. The pump includes a rotor configured to compress a hose/tube being positioned on the pump cavity inner perimeter. The rotor is coupled to a one end of a crankshaft of the pump body and the pump includes a device to receive an equipment for rotating the rotor manually. The equipment for rotating the rotor includes a connection point that is configured to connect the equipment to the pump. The equipment includes also weight configured to act as a counterbalance to the rotor in order to maintain the position of the rotor.

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array comprising a multitude of transmissive or reflective microlenses which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array of light sources for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced.

Abstract: Manufacturing optical devices (e.g., for cameras) includes providing and allocating mount elements to lens modules wherein the mount elements are to be arranged within the optical devices to define a fixed separation distance between the lens modules and the image sensor plane. The mount elements have variable mount FFL sections by means of which the geometrical distance between the lens module and the image sensor plane is adjusted for each lens module, individually or in groups dependent on the optical properties of the lens modules, to compensate the variation of the lens module values among the lens modules, so that the focal planes of the lens modules falls into the image sensor plane.

Abstract: The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.

Abstract: The disclosure describes light sensing optoelectronic modules that include reflective surfaces to enhance light collection and/or light emission. For example, an optoelectronic module can include a light sensing element mounted on a substrate. A spacer over the substrate has a through-hole over the light sensing element. The through-hole is defined by a surface that is at least partially sloped or curved with respect to a plane of the substrate. The surface is highly reflective for light detectable by the light sensing element. Various methods for fabricating the modules are described as well.

Abstract: Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.

Abstract: Disclosed is an arrangement for detecting first light (L1) and second light (L2), with the first light (L1) and second light (L2) having no wavelength in common. The arrangement includes a first effective detector area (D1) and a second effective detector area (D2). The first effective detector area (D1) is exposed to the first light (L1) and/or second light (L2) different from the first light (L1) and/or second light (L2) to which the second effective detector area (D2) is exposed when the arrangement is exposed to spatially uniformly distributed first light (L1) and second light (L2). The difference between the first light (L1) and/or second light (L2) to which said first detector area (D1) and second detector area (D2) are exposed to can be a difference in intensity and/or difference in an angle of incidence relative to the arrangement.

Abstract: The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31?; 31??) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31?. . .

Abstract: Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; at least two separate portions referred to as open portions (4) in which no material of the spacer is present; and one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

Abstract: The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a?;5b;5b?); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element

Abstract: The opto-electronic module (1) comprises—a first substrate member (P); —a second substrate member (O); —a first spacer member (S) comprised in said first substrate member or comprised in said second substrate member or distinct from and located between these, which comprises at least one opening (4); —a light emission element (E) arranged on said first substrate member; —a first passive optical component (8); at least one of said first and second substrate members comprising one or more transparent portions (t) through which light can pass, said first passive optical component (8) being comprised in or distinct from said one or more transparent portions, and wherein said first passive optical component has adjustable optical properties. Such modules (1) are well mass-producible in high precision and can be used in photo cameras, e.g., as flashes.

Abstract: A compact camera module includes an image sensor including photosensitive areas, and an array of lenses optically aligned with sub-groups of the photosensitive areas. The array of lenses includes a first array of lenses and one or more groups of lenses disposed around the periphery of the first array of lenses. Each lens in the first array has a respective central optical axis that is substantially perpendicular to a plane of the image sensor and each of which has field of view. Each of the lenses in the one or more groups disposed around the periphery of the first array of lenses has a field of view that is centered about an optical axis that is tilted with respect to the optical axes of the lenses in the central array.