Abstract: The present disclosure describes optical radiation sensors and detection techniques that facilitate assigning a specific wavelength to a measured photocurrent. The techniques can be used to determine the spectral emission characteristics of a radiation source. In one aspect, a method of determining spectral emission characteristics of incident radiation includes sensing at least some of the incident radiation using a light detector having first and second photosensitive regions whose optical responsivity characteristics differ from one another. The method further includes identifying a wavelength of the incident radiation based on a ratio of a photocurrent from the first region and a photocurrent from the second region.

Abstract: An optoelectronic module includes a light guide arranged to receive light, such as ambient light or light reflected by an object. The light guide has a diffractive grating that includes multiple sections, each of which is tuned to a respective wavelength or narrow band of wavelengths. The module further includes multiple photosensitive elements, each of which is arranged to receive light diffracted by a respective one of the sections of the diffractive grating. The module can be integrated, for example, as part of a spectrometer or other apparatus for optically determining characteristics of an object.

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract: The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a?;5b;5b?); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing elem

Abstract: This disclosure describes optoelectronic devices that include an event-driven photo-array and methods for using the same. The methods include capturing output signals over a particular illumination time via a change-detection circuit. In some instances, a threshold intensity change can trigger the change-detection circuit. In some instances, an active illumination from an illumination module may produce the threshold intensity change. Output signals may be used to generate distance data. In some instances, the output signals may be substantially free from noise due to background light.

Abstract: According to embodiments of the present invention, an apparatus comprising a beam shaping element (lens) is provided. The apparatus comprises a substrate; a beam shaping element; and an elastic intermediate layer disposed between, and in contact with, the substrate and the beam shaping element, wherein the elastic intermediate layer has a Young's Modulus in a range of 2-600 MPa and a Poisson's ratio in a range of 0.2-0.5. Techniques for reducing thermal distortion of lens are described.

Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).

Abstract: A wafer-level method of fabricating optoelectronic modules performing a first vacuum injection technique, using a first vacuum injection tool, to surround optoelectronic devices laterally with a transparent overmold region, performing a replication technique to form a respective passive optical element on a top surface of each overmold region, and performing a second vacuum injected technique to form sidewalls laterally surrounding and in contact with sides of each overmold region. The replication technique and the second vacuum injection technique are performed using a combined replication and vacuum injection tool.

Abstract: Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises —one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; —at least two separate portions referred to as open portions (4) in which no material of the spacer is present; and —one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

Abstract: The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.

Abstract: Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.

Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract: Light emitting modules, such as flash modules, include features to help reduce the visual impact of interior components and shield them from view. The features also may enhance the outer appearance of the module or of an appliance incorporating the module.

Abstract: The present disclosure describes structured-stereo imaging assemblies including separate imagers for different wavelengths. The imaging assembly can include, for example, multiple imager sub-arrays, each of which includes a first imager to sense light of a first wavelength or range of wavelengths and a second imager to sense light of a different second wavelength or range of wavelengths. Images acquired from the imagers can be processed to obtain depth information and/or improved accuracy. Various techniques are described that can facilitate determining whether any of the imagers or sub-arrays are misaligned.

Abstract: The opto-electronic module (1) comprises —a first substrate member (P); —a third substrate member (B); —a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a?;5b;5b?); —a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); —a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); —a light detecting element (D) arranged on and electrically connected to said first substrate member (P); —a light emission element (E) arranged on and electrically connected to said first substrate member (P); —and a sensing

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract: This invention concerns peristaltic pumps and an adjustment mechanism for adjusting a compression force imposed on a hose. The adjustment mechanism includes at least a gear unit and a counterpart for the gear unit. The counterpart is operatively coupled to a rotor, wherein the gear unit in cooperation with the counterpart are configured to adjust a gap between the rotor outer surface and the pump cavity inner perimeter.