Abstract: A display device with a retaining device is disclosed, which can be placed on the head of a user. The display device contains a first image generator, which is secured or can be secured to the retaining device, and a first optical imaging system which is secured to the retaining device and which is designed to image an image generated on a first image plane (E) by the first image generator such that the user can perceive the image with a first eye (LA) when the retaining device is placed on the head of the user. The retaining device supports a first refraction determining optical system which is designed to determine the subjective refraction of the first eye (LA) when the retaining device is placed on the head of the user and/or the first optical imaging system is configured to be variable.

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a first and second electrical contacts; a first leadframe section comprising a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad; and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, a dielectric element is arranged between the first and second leadframe sections, the first and second leadframe sections and the dielectric element are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible, and a surface of the dielectric element is exposed at the underside of the housing.

Abstract: A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.

Abstract: A method of producing optoelectronic components includes providing an auxiliary carrier, forming separate connection elements on the auxiliary carrier, forming a molded body on the auxiliary carrier with recesses, arranging optoelectronic semiconductor chips on connection elements in the recesses of the molded body, removing the auxiliary carrier, and severing the molded body to form singulated optoelectronic components.

Abstract: Disclosed is a method for producing a wavelength conversion element (10) wherein a wavelength conversion layer (100) is provided, the surface thereof is treated with a plasma (50), and the wavelength conversion layer is punched. Also disclosed are a wavelength conversion layer and an optoelectronic component comprising a wavelength conversion layer.

Abstract: An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.

Abstract: An optoelectronic component includes a housing body, wherein a cavity is formed on the upper side of the housing body, and a channel extending from the cavity to an outer edge of the upper side of the housing body is formed on the upper side of the housing body; and a method of producing an optoelectronic component including providing a flat panel of a multiplicity of housing bodies, each housing body having a cavity opening onto an upper side of the panel wherein the cavities of neighboring housing bodies connect by channels and open onto the upper side of the panel, arranging an encapsulation material in the cavities of the housing bodies, and dividing the panel.

Abstract: An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.

Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the optoelectronic semiconductor chip; providing a carrier having walls arranged on a surface of the carrier, the walls laterally limiting a receiving region; arranging an optoelectronic semiconductor chip in the receiving region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier; filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material up to a height that lies between the upper side of the optoelectronic semiconductor chip and an upper side of the mask layer; removing the mask layer to create a free space in the optically reflective material; and introducing a wavelength-converting material into the free space.

Abstract: A method of manufacturing an optoelectronic component includes providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe section and the second leadframe section are physically separate from one another; embedding the leadframe into a plastic material by a molding process to form a casing body, wherein the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe, wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section.

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract: Disclosed is a method for producing a wavelength conversion element (10) wherein a wavelength conversion layer (100) is provided, the surface thereof is treated with a plasma (50), and the wavelength conversion layer is punched. Also disclosed are a wavelength conversion layer and an optoelectronic component comprising a wavelength conversion layer.

Abstract: The invention relates to a device for the citrate anti-coagulated extracorporeal blood purification comprising: an extracorporeal blood purification system comprising an extracorporeal blood circuit (202), which comprises a dialysis unit (205), a blood inflow (203) and a blood discharge (204), a citrate metering device (212) for supplying citrate at a citrate supply point (213) upstream of the dialysis unit (205), a substitution medium metering device (214) for supplying a substitution medium at a substitution medium supply point (215) downstream from the dialysis unit (205), at least one ion concentration measuring means (224) for measuring bivalent cations and a controller (225), wherein the controller (225) is adapted to regulate the metering of the substitution medium as a function of a comparison between a setpoint value range and the ion concentration measured by means of the ion concentration measuring means (224), wherein the ion concentration measuring means (224) is adapted for the continuous gener

Abstract: An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract: A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract: Blood purification device (100,200) having an extracorporeal blood circuit (102,202) with a blood inflow (103,203) to a dialysis unit (105,205) for blood removed from a patient and a blood outflow (104,204) from the dialysis unit (105,205) for blood being guided back into the patient, wherein the dialysis unit (105,205) comprises an inflow (107,207) for a dialysis solution and a dialysate outflow (108,208), characterised by a control loop for closed-loop control of the acid-base equilibrium of the blood, wherein bicarbonate is supplied to the blood by means of an aqueous bicarbonate-containing solution, wherein at least one measuring means (124,124a,224,224a) for measuring a blood buffer parameter is associated with the control loop, wherein the blood buffer parameter is selected from the group consisting of bicarbonate concentration and CO2 partial pressure, and wherein a signal corresponding to the measured actual value of the blood buffer parameter can be supplied to a closed-loop control apparatus (125,22

Abstract: An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.