Patents by Inventor Martin Gruber

Martin Gruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210166998
    Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.
    Type: Application
    Filed: February 16, 2021
    Publication date: June 3, 2021
    Inventors: Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer, Bun Kian Tay
  • Patent number: 10989742
    Abstract: A current sensor and a current sensing method are disclosed. The current sensor includes a sensor chip having a first chip surface, a second chip surface and at least one sensor element, and a housing having a first housing surface adjoining the second chip surface and a second housing surface spaced apart from the first housing surface and separated from the first housing surface by a spacer section of the housing. The second housing surface is configured to be mounted on a conductor and is electrically insulating.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: April 27, 2021
    Assignee: Infineon Technologies Austria AG
    Inventors: Anton Mauder, Martin Gruber, Goran Keser
  • Publication number: 20210111108
    Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Applicant: Infineon Technologies AG
    Inventors: Frank Singer, Martin Gruber, Thorsten Meyer, Thorsten Scharf, Peter Strobel, Stefan Woetzel
  • Patent number: 10971457
    Abstract: A semiconductor device is disclosed. In one example, the semiconductor device comprises a first semiconductor die comprising a first surface, a second surface opposite to the first surface, and a contact pad disposed on the first surface, a further contact pad spaced apart from the semiconductor die, a clip comprising a first layer of a first metallic material and a second layer of a second metallic material different from the first metallic material, wherein the first layer of the clip is connected with the contact pad, and the second layer of the clip is connected with the further contact pad.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: April 6, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thomas Bemmerl, Martin Gruber, Thorsten Scharf
  • Patent number: 10964628
    Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: March 30, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer, Bun Kian Tay
  • Patent number: 10898842
    Abstract: A filter element with at least one filter medium body and with a grip configured to hold and guide the filter element is provided. At least one locking element is arranged at the grip and configured to lock the filter element on a receiving filter housing. A filter device with such a filter element has a receiving filter housing to receive the filter element and a cover to secure the locking element in locked position on the filter housing.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: January 26, 2021
    Assignee: MANN+HUMMEL GmbH
    Inventors: Torsten Fritzsching, Pedro Miguel Pereira Madeira, Andreas Franz, Nadine Donauer, Martin Gruber, Joachim-Paul Krieger, Marcel Holzwarth, Manfred Winter
  • Publication number: 20210005557
    Abstract: A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.
    Type: Application
    Filed: July 1, 2020
    Publication date: January 7, 2021
    Applicant: Infineon Technologies AG
    Inventors: Thorsten Meyer, Thomas Behrens, Martin Gruber, Thorsten Scharf, Peter Strobel
  • Patent number: 10886186
    Abstract: A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: January 5, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss, Thorsten Meyer, Xaver Schloegel
  • Publication number: 20200365548
    Abstract: A semiconductor package is provided. The semiconductor package may include at least one semiconductor chip including a contact pad configured to conduct a current, a conductor element, wherein the conductor element is arranged laterally overlapping the contact pad and with a distance to the contact pad, at least one electrically conductive spacer, a first adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the contact pad, and a second adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the conductor element, wherein the conductor element is electrically conductively connected to a clip or is at least part of a clip, and wherein the spacer is configured to electrically conductively connect the contact pad with the laterally overlapping portion of the conductor element.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Inventors: Edward Fuergut, Ralf Otremba, Irmgard Escher-Poeppel, Martin Gruber
  • Publication number: 20200365553
    Abstract: A method of manufacturing packages is disclosed. In one example, the method comprises providing an electrically conductive sheet being continuous at least in a mounting region, mounting first main surfaces of a plurality of electronic components on the continuous mounting region of the sheet and forming interconnect structures for electrically coupling second main surfaces of the electronic components with the sheet. The second main surfaces oppose the first main surfaces. After the forming, structuring the sheet.
    Type: Application
    Filed: April 7, 2020
    Publication date: November 19, 2020
    Applicant: Infineon Technologies AG
    Inventors: Thorsten Meyer, Thomas Behrens, Andreas Grassmann, Martin Gruber, Thorsten Scharf
  • Publication number: 20200328141
    Abstract: A chip package is provided. The chip package includes a semiconductor chip having on a front side a first connecting pad and a second connecting pad, a carrier having a pad contact area and a recess, encapsulation material encapsulating the conductor chip, a first external connection that is free from or extends out of the encapsulation material, an electrically conductive clip, and a contact structure. The semiconductor chip is arranged with its front side facing the carrier with the first connecting pad over the recess and with the second connecting pad contacting the pad contact area. The clip is arranged over a back side of the semiconductor chip covering the semiconductor chip where it extends over the recess. The electrically conductive contact structure electrically conductively connects the first connecting pad with the first external connection.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 15, 2020
    Inventors: Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic
  • Publication number: 20200294885
    Abstract: An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Inventors: Edward Fuergut, Peter Eibl, Horst Groeninger, Martin Gruber, Christian Kasztelan, Philipp Seng
  • Patent number: 10773201
    Abstract: An annular filter element has a filter medium body configured to be flowed through by a fluid to be purified in a radial direction. A sealing element is arranged at the end face of the filter medium body and extends circumferentially around the end face. The sealing element has at least one first sealing section comprising a massive and large cross-sectional area and one or more second sealing sections with a cross-sectional area that is at least partially reduced in comparison to the large cross-sectional area. The one or more second sealing sections include a second sealing section with a groove-type recess, wherein the groove-type recess extends at least approximately across a length of the second sealing section with the groove-type recess or across a portion of said length.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: September 15, 2020
    Assignee: MANN+HUMMEL GmbH
    Inventors: Andreas Franz, Torsten Fritzsching, Nadine Donauer, Marcel Holzwarth, Pedro Miguel Pereira Madeira, Christoph Wittmers, Manfred Winter, Joachim-Paul Krieger, Martin Gruber
  • Publication number: 20200273781
    Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.
    Type: Application
    Filed: February 21, 2019
    Publication date: August 27, 2020
    Inventors: Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer, Bun Kian Tay
  • Publication number: 20200273790
    Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.
    Type: Application
    Filed: January 21, 2020
    Publication date: August 27, 2020
    Inventors: Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer, Thorsten Scharf, Chee Voon Tan
  • Publication number: 20200269951
    Abstract: In an electric drive device for a bicycle, there is an electric motor with an output shaft and an angular gear by which the output shaft is connectable to a wheel of the bicycle in a drive-effective manner, and a fastening device is provided, carrying the electric motor and configured to fasten the electric motor to a rotation axle of the wheel.
    Type: Application
    Filed: October 9, 2018
    Publication date: August 27, 2020
    Inventors: Martin GRUBER, Reinhold GRUBER
  • Patent number: 10744444
    Abstract: A filter element has a filter medium body enclosing an inwardly positioned flow space and having a center axis. A support frame is arranged at an inner side of the filter medium body. At least one circumferentially extending sealing ring lip is arranged at the filter medium body and projects axially in an axial direction relative to the center axis past an end face of the filter medium body. The sealing ring lip is designed to seal relative to a housing component of a receiving filter housing. A support ring is arranged at the end face of the filter medium body at a radial distance to the sealing ring lip in a radial direction relative to the center axis. The support ring is supported in the radial direction at the support frame and is formed as one piece together with the support frame.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 18, 2020
    Assignee: MANN+HUMMEL GmbH
    Inventors: Torsten Fritzsching, Pedro Miguel Pereira Madeira, Nadine Donauer, Andreas Franz, Marcel Holzwarth, Manfred Winter, Martin Gruber, Joachim-Paul Krieger
  • Patent number: 10685909
    Abstract: A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The second power semiconductor device is encapsulated by a second mold compound. The first mold compound and the second mold compound are substantially separate from each other. The lead frame includes an intermediate part arranged between the first part and the second part. The intermediate part is not covered by the first mold compound or by the second mold compound.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 16, 2020
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Martin Gruber
  • Patent number: 10629575
    Abstract: A semiconductor chip assembly includes first and second semiconductor dies that each include opposite facing upper and lower sides and an outer edge side, and an electrical interposer having opposite facing first and second conductive surfaces and a conductive connection between the conductive surfaces. The second semiconductor die is mounted on top of the first semiconductor die and the interposer such that the lower side of the second semiconductor die faces the first semiconductor die and the interposer, a first lateral section of the second semiconductor die at least partially covers the upper side of the first semiconductor die, and a second lateral section of the second semiconductor die extends past the outer edge side of the first semiconductor die. The first conductive surface is electrically connected to a first terminal that is disposed on a lower side of the second semiconductor die.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 21, 2020
    Assignee: Infineon Techologies AG
    Inventors: Thorsten Scharf, Carsten Ahrens, Helmut Brech, Martin Gruber, Thorsten Meyer, Matthias Zigldrum
  • Publication number: 20200013723
    Abstract: A silicon carbide device includes a silicon carbide substrate, a contact layer including nickel, silicon and aluminum, a barrier layer structure including titanium and tungsten, and a metallization layer including copper. The contact layer is located on the silicon carbide substrate. The contact layer is located between the silicon carbide substrate and at least a part of the barrier layer structure. The barrier layer structure is located between the silicon carbide substrate and the metallization layer.
    Type: Application
    Filed: June 26, 2019
    Publication date: January 9, 2020
    Inventors: Edward Fuergut, Ravi Keshav Joshi, Ralf Siemieniec, Thomas Basler, Martin Gruber, Jochen Hilsenbeck, Dethard Peters, Roland Rupp, Wolfgang Scholz