Abstract: Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an electrically conductive structured layer; at least one electronic chip attached to the electrically conductive layer and in thermal contact to the fluid channel; and a molded encapsulation formed at least partially around the at least one electronic chip, wherein the electrically conductive structured layer is directly formed on the electrically isolating material.

Abstract: One aspect of the invention relates to a method for producing a chip assemblage. Two or more chip assemblies are produced in each case by cohesively and electrically conductively connecting an electrically conductive first compensation lamina to a first main electrode of a semiconductor chip. A control electrode interconnection structure is arranged in a free space between the chip assemblies. Electrically conductive connections are produced between the control electrode interconnection structure and control electrodes of the semiconductor chips of the individual chip assemblies. The chip assemblies are cohesively connected by means of a dielectric embedding compound.

Abstract: A semiconductor device includes a first lead frame, a second lead frame, a first semiconductor chip, and an encapsulation material. The first lead frame includes a first die pad having a first surface and a second surface opposite to the first surface. The second lead frame includes a second die pad having a first surface and a second surface opposite to the first surface. The first surface of the second die pad faces the first surface of the first die pad. The first semiconductor chip is attached to the first surface of the first die pad. The encapsulation material encapsulates the first semiconductor chip and portions of the first lead frame and the second lead frame. The encapsulation material has a first surface aligned with the second surface of the first die pad and a second surface aligned with the second surface of the second die pad.

Abstract: A filter element with at least one filter medium body and with a grip configured to hold and guide the filter element is provided. At least one locking element is arranged at the grip and configured to lock the filter element on a receiving filter housing. A filter device with such a filter element has a receiving filter housing to receive the filter element and a cover to secure the locking element in locked position on the filter housing.

Abstract: A sensor arrangement is provided. The sensor arrangement may include at least one sensor element having a first side and a second side opposite the first side and configured for sensing a magnetic field; and an electrically conductive line, wherein a first portion of the electrically conductive line may be arranged on the first side of the at least one sensor element and a second portion of the electrically conductive line may be arranged on the second side of the at least one sensor element in such a way that if a current is flowing through the electrically conductive line, the current has a first direction in the first portion and a second direction opposite the first direction in the second portion, such that a first magnetic field formed by the current in the first portion and a second magnetic field formed by the current in the second portion may at least partly add constructively at a sensing portion of the at least one sensor element.

Abstract: One aspect of the invention relates to a method for producing a chip assemblage. Two or more chip assemblies are produced in each case by cohesively and electrically conductively connecting an electrically conductive first compensation lamina to a first main electrode of a semiconductor chip. A control electrode interconnection structure is arranged in a free space between the chip assemblies. Electrically conductive connections are produced between the control electrode interconnection structure and control electrodes of the semiconductor chips of the individual chip assemblies. The chip assemblies are cohesively connected by means of a dielectric embedding compound.

Abstract: The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the encapsulation layer, the vias extending from a main face of the encapsulation layer to the electronic devices, and depositing a metallic layer onto the encapsulation layer including the vias by galvanic plating, the method further comprising providing a current distribution layer for effecting a distributed growth of the metallic material during the galvanic plating.

Abstract: A semiconductor chip package is disclosed. The package includes a carrier, a plurality of semiconductor chips disposed on the carrier, a first encapsulation layer disposed above the semiconductor chips. A metallization layer is disposed above the first encapsulation layer, the metallization layer including a plurality of first metallic areas forming electrical connections between selected ones of the semiconductor chips. A second encapsulation layer is disposed above the solder resist layer. A plurality of external connectors are provided, each one of the external connectors being connected with one of the first metallic areas and extending outwardly through a surface of the second encapsulation layer.

Abstract: In order to produce a power semiconductor module, a circuit carrier is populated with a semiconductor chip and with an electrically conductive contact element. After populating, the semiconductor chip and the contact element are embedded into a dielectric embedding compound, and the contact element is exposed. In addition, an electrically conductive base layer is produced which electrically contacts the exposed contact element and which bears on the embedding compound and the exposed contact element. A prefabricated metal film is applied to the base layer by means of an electrically conductive connection layer.

Abstract: The invention relates to a method for brightening dyed textiles and to the textiles thereby produced. The method is characterized by treating the materials with an aqueous liquor containing an organic peroxocarboxylic acid having a hydrophobic group, consisting of at least 5 C atoms, as the active component.

Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract: Semiconductor chips are described that combine a semiconductor device and a capacitor onto a single substrate such that the semiconductor device and the capacitor are electrically isolated from each other. In one example, a semiconductor chip includes a substrate having a first side and a second side, wherein the second side is opposite the first side. The semiconductor chip further includes a semiconductor device formed on the first side of the substrate and an electrically insulating layer formed on at least a portion of the second side of the substrate. The semiconductor chip further includes a capacitor device formed on at least a portion of the electrically insulating layer on the second side of the substrate, wherein the capacitor device is electrically insulated from the semiconductor device.

Abstract: Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an electrically conductive structured layer; at least one electronic chip attached to the electrically conductive layer and in thermal contact to the fluid channel; and a molded encapsulation formed at least partially around the at least one electronic chip, wherein the electrically conductive structured layer is directly formed on the electrically isolating material.

Abstract: A semiconductor module includes a circuit board and a power semiconductor chip embedded in the circuit board. The power semiconductor chip has a first load electrode. The semiconductor module further includes a power terminal connector electrically connected to the first load electrode. The embedded power semiconductor chip is positioned laterally within a footprint zone of the power terminal connector.

Abstract: A sensor arrangement is provided. The sensor arrangement may include at least one sensor element having a first side and a second side opposite the first side and configured for sensing a magnetic field; and an electrically conductive line, wherein a first portion of the electrically conductive line may be arranged on the first side of the at least one sensor element and a second portion of the electrically conductive line may be arranged on the second side of the at least one sensor element in such a way that if a current is flowing through the electrically conductive line, the current has a first direction in the first portion and a second direction opposite the first direction in the second portion, such that a first magnetic field formed by the current in the first portion and a second magnetic field formed by the current in the second portion may at least partly add constructively at a sensing portion of the at least one sensor element.

Abstract: An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another, at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements, and a second insulation layer, which is arranged on the carrier and the semiconductor chip.

Abstract: Semiconductor chips are described that combine a semiconductor device and a capacitor onto a single substrate such that the semiconductor device and the capacitor are electrically isolated from each other. In one example, a semiconductor chip includes a substrate having a first side and a second side, wherein the second side is opposite the first side. The semiconductor chip further includes a semiconductor device formed on the first side of the substrate and an electrically insulating layer formed on at least a portion of the second side of the substrate. The semiconductor chip further includes a capacitor device formed on at least a portion of the electrically insulating layer on the second side of the substrate, wherein the capacitor device is electrically insulated from the semiconductor device.

Abstract: A method of manufacturing an electronic circuit with an integrally formed capability of providing information indicative of a value of a current flowing in the electronic circuit, wherein the method comprises forming an electrically conductive wiring structure on a substrate, configuring a first section of the wiring structure for contributing to a predefined use function of the electronic circuit, and configuring a second section of the wiring structure for providing information indicative of the value of the current flowing in the electronic circuit upon applying a stimulus signal to the second section, wherein at least a part of the configuring of the first section and the configuring of the second section is performed simultaneously.