Patents by Inventor Martin Lee Riker
Martin Lee Riker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9960021Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.Type: GrantFiled: February 18, 2014Date of Patent: May 1, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Uday Pai, William Fruchterman, Keith A. Miller, Muhammad M. Rasheed, Thanh X. Nguyen, Kirankumar Savandaiah
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Publication number: 20180096871Abstract: Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.Type: ApplicationFiled: September 28, 2017Publication date: April 5, 2018Inventors: Fuhong Zhang, Sunil Kumar Garg, Paul Kiely, Martin Lee Riker, William Fruchterman, Zheng Wang, Xiaodong Wang
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Publication number: 20180025895Abstract: A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.Type: ApplicationFiled: October 11, 2016Publication date: January 25, 2018Inventors: Martin Lee RIKER, Keith A. MILLER, Shreekant GAYAKA, Carl R. JOHNSON
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Publication number: 20170253959Abstract: Methods and apparatus for controlling the ion fraction in physical vapor deposition processes are disclosed. In some embodiments, a process chamber for processing a substrate having a given diameter includes: an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a rotatable magnetron above the target to form an annular plasma in the peripheral portion; a substrate support disposed in the interior volume to support a substrate having the given diameter; a first set of magnets disposed about the body to form substantially vertical magnetic field lines in the peripheral portion; a second set of magnets disposed about the body and above the substrate support to form magnetic field lines directed toward a center of the support surface; a first power source to electrically bias the target; and a second power source to electrically bias the substrate support.Type: ApplicationFiled: March 3, 2017Publication date: September 7, 2017Inventors: Xiaodong WANG, Joung Joo LEE, Fuhong ZHANG, Martin Lee RIKER, Keith A. MILLER, William FRUCHTERMAN, Rongjun WANG, Adolph Miller ALLEN, Shouyin ZHANG, Xianmin TANG
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Publication number: 20170117121Abstract: In some implementations described herein, a collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.Type: ApplicationFiled: September 27, 2016Publication date: April 27, 2017Inventors: Martin Lee RIKER, Fuhong ZHANG, Anthony INFANTE, Zheng WANG
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Patent number: 9580795Abstract: In some embodiments, a sputter source for a process chamber may include: a first enclosure having a top, sides and an open bottom; a target coupled to the open bottom; an electrical feed coupled to the top of the first enclosure proximate a central axis of the first enclosure to provide power to the target via the first enclosure; a magnet assembly having a shaft, a support arm coupled to the shaft, and a magnet coupled to the support arm disposed within the first enclosure; a first rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about the central axis of the first enclosure; and a second rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about a central axis of the magnet assembly.Type: GrantFiled: March 5, 2013Date of Patent: February 28, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Keith A. Miller, Martin Lee Riker
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Patent number: 9543126Abstract: Embodiments of collimators for use in substrate processing chambers are provided herein. In some embodiments, a collimator includes: a body having a central region, a peripheral region, and a transitional region disposed between the central and peripheral regions; a first plurality of apertures in the central region having a first aspect ratio; a second plurality of apertures in the peripheral region having a second aspect ratio less than the first aspect ratio; and a third plurality of apertures in the transitional region, wherein the third plurality of apertures are cut so the transitional region forms a conical shape surrounding the central region.Type: GrantFiled: January 28, 2015Date of Patent: January 10, 2017Assignee: APPLIED MATERIALS, INC.Inventor: Martin Lee Riker
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Patent number: 9476122Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.Type: GrantFiled: March 11, 2014Date of Patent: October 25, 2016Assignee: Applied Materials, Inc.Inventors: Martin Lee Riker, Keith A. Miller, Anantha K. Subramani
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Publication number: 20160145735Abstract: Embodiments of collimators for use in substrate processing chambers are provided herein. In some embodiments, a collimator includes: a body having a central region, a peripheral region, and a transitional region disposed between the central and peripheral regions; a first plurality of apertures in the central region having a first aspect ratio; a second plurality of apertures in the peripheral region having a second aspect ratio less than the first aspect ratio; and a third plurality of apertures in the transitional region, wherein the third plurality of apertures are cut so the transitional region forms a conical shape surrounding the central region.Type: ApplicationFiled: January 28, 2015Publication date: May 26, 2016Inventor: MARTIN LEE RIKER
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Publication number: 20150354054Abstract: Embodiments of cooled process tool adapters for use in substrate processing chambers are provided herein. In some embodiments, a cooled process tool adapter includes: an annular body surrounding a central opening; a coolant channel disposed in the annular body; one or more features to facilitate supporting a process tool within the central opening; an inlet and an outlet disposed in the annular body and fluidly coupled to the coolant channel; and a power connection coupled to the annular body having a terminal to couple the annular body to a bias power source.Type: ApplicationFiled: May 15, 2015Publication date: December 10, 2015Inventors: WILLIAM R. FRUCHTERMAN, MARTIN LEE RIKER, KEITH A. MILLER, ANTHONY INFANTE
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Patent number: 9062379Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.Type: GrantFiled: June 15, 2012Date of Patent: June 23, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Keith A. Miller, Anantha Subramani
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Publication number: 20150170888Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.Type: ApplicationFiled: February 18, 2014Publication date: June 18, 2015Applicant: APPLIED MATERIALS, INC.Inventors: MARTIN LEE RIKER, UDAY PAI, WILLIAM FRUCHTERMAN, KEITH A. MILLER, MUHAMMAD M. RASHEED, THANH X. NGUYEN, KIRANKUMAR SAVANDAIAH
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Publication number: 20150162171Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.Type: ApplicationFiled: June 15, 2012Publication date: June 11, 2015Applicant: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Keith A. Miller, Anantha Subramani
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Publication number: 20140251800Abstract: In some embodiments, a sputter source for a process chamber may include: a first enclosure having a top, sides and an open bottom; a target coupled to the open bottom; an electrical feed coupled to the top of the first enclosure proximate a central axis of the first enclosure to provide power to the target via the first enclosure; a magnet assembly having a shaft, a support arm coupled to the shaft, and a magnet coupled to the support arm disposed within the first enclosure; a first rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about the central axis of the first enclosure; and a second rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about a central axis of the magnet assembly.Type: ApplicationFiled: March 5, 2013Publication date: September 11, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Keith A. MILLER, Martin LEE RIKER
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Publication number: 20140190822Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.Type: ApplicationFiled: March 11, 2014Publication date: July 10, 2014Applicant: Applied Materials, Inc.Inventors: Martin Lee RIKER, Keith A. MILLER, Anantha K. SUBRAMANI
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Patent number: 8696878Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.Type: GrantFiled: April 26, 2012Date of Patent: April 15, 2014Assignee: Applied Materials, Inc.Inventors: Martin Lee Riker, Keith A. Miller, Anantha Subramani
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Publication number: 20140061039Abstract: Target assemblies for use in a substrate processing system are provided herein. In some embodiments, a target assembly for use in a substrate processing system may include a source material to be deposited on a substrate, a first backing plate configured to support the source material on a front side of the first backing plate, such that a front surface of the source material opposes the substrate when present, a second backing plate coupled to a backside of the first backing plate, and a plurality of sets of channels disposed between the first and second back plates. These channels permit a coolant to be provided closer to the heat source (target face) thereby facilitating more efficient heat removal from the target. More efficient heat removal from the target results in a target with a lesser thermal gradient and therefore less mechanical bowing/deformation.Type: ApplicationFiled: September 5, 2012Publication date: March 6, 2014Applicant: APPLIED MATERIALS, INC.Inventors: MARTIN LEE RIKER, KEITH A. MILLER
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Publication number: 20140061041Abstract: Target assemblies for use in a substrate processing system are provided herein. In some embodiments, a target assembly for use in a substrate processing system may include a source material, a backing plate configured to support the source material on a front side of the backing plate, and a central support member to support the target assembly within the substrate processing system, wherein the central support member is coupled to a center portion of the backing plate and extends perpendicularly away from the backside of the backing plate.Type: ApplicationFiled: February 27, 2013Publication date: March 6, 2014Applicant: APPLIED MATERIALS, INC.Inventors: MARTIN LEE RIKER, KEITH A. MILLER, BALAMURUGAN RAMASAMY, KARTIK SHAH
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Publication number: 20140046475Abstract: Methods and apparatus for processing a substrate in a process chamber, include receiving process control parameters for one or more devices from a process controller to perform a first chamber process, determining a time to send each of the process control parameters to the one or more devices, for each of the one or more devices, adjusting the determined time to send each of the process control parameters using specific signal process delays associated with each of the one or more devices, and sending the process control parameters to each of the one or more devices at the adjusted times to perform the first chamber process, wherein the synchronization controller includes one or more output channels, each channel directly coupled to one of the one or more devices.Type: ApplicationFiled: August 9, 2012Publication date: February 13, 2014Applicant: APPLIED MATERIALS, INC.Inventors: WINSOR LAM, KEITH A. MILLER, CARL JOHNSON, MARTIN LEE RIKER, YE XU
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Patent number: D801942Type: GrantFiled: April 16, 2015Date of Patent: November 7, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Martin Lee Riker, Fuhong Zhang, Yu Liu