Patents by Inventor Martin Lee Riker

Martin Lee Riker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210071294
    Abstract: Methods and apparatus for controlling the ion fraction in physical vapor deposition processes are disclosed. In some embodiments, a physical vapor deposition chamber includes: a body having an interior volume and a lid assembly including a target to be sputtered; a magnetron disposed above the target, wherein the magnetron is configured to rotate a plurality of magnets about a central axis of the physical vapor deposition chamber; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support a substrate; a collimator disposed between the target and the substrate support, the collimator having a central region having a first thickness and a peripheral region having a second thickness less than the first thickness; a first power source coupled to the target to electrically bias the target; and a second power source coupled to the substrate support to electrically bias the substrate support.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 11, 2021
    Inventors: Xiaodong WANG, Joung Joo LEE, Fuhong ZHANG, Martin Lee RIKER, Keith A. MILLER, William FRUCHTERMAN, Rongjun WANG, Adolph Miller ALLEN, Shouyin ZHANG, Xianmin TANG
  • Publication number: 20200357617
    Abstract: A collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure, a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Application
    Filed: June 24, 2020
    Publication date: November 12, 2020
    Inventors: Martin Lee RIKER, Fuhong ZHANG, Anthony INFANTE, Zheng WANG
  • Patent number: 10727033
    Abstract: A collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure, a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: July 28, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Martin Lee Riker, Fuhong Zhang, Anthony Infante, Zheng Wang
  • Publication number: 20200035527
    Abstract: Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.
    Type: Application
    Filed: October 3, 2019
    Publication date: January 30, 2020
    Inventors: Fuhong Zhang, Sunil Kumar Garg, Paul Kiely, Martin Lee Riker, William Fruchterman, Zheng Wang, Xiaodong Wang
  • Patent number: 10438828
    Abstract: Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: October 8, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Fuhong Zhang, Sunil Kumar Garg, Paul Kiely, Martin Lee Riker, William Fruchterman, Zheng Wang, Xiaodong Wang
  • Publication number: 20190279851
    Abstract: A collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure, a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Martin Lee RIKER, Fuhong ZHANG, Anthony INFANTE, Zheng WANG
  • Patent number: 10347474
    Abstract: In some implementations described herein, a collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure, a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Martin Lee Riker, Fuhong Zhang, Anthony Infante, Zheng Wang
  • Patent number: 10312065
    Abstract: A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 4, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Shreekant Gayaka, Carl R. Johnson
  • Publication number: 20180218889
    Abstract: In some implementations described herein, a collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure, a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Application
    Filed: March 29, 2018
    Publication date: August 2, 2018
    Inventors: Martin Lee RIKER, Fuhong ZHANG, Anthony INFANTE, Zheng WANG
  • Patent number: 9960024
    Abstract: In some implementations described herein, a collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: May 1, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Martin Lee Riker, Fuhong Zhang, Anthony Infante, Zheng Wang
  • Patent number: 9960021
    Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Uday Pai, William Fruchterman, Keith A. Miller, Muhammad M. Rasheed, Thanh X. Nguyen, Kirankumar Savandaiah
  • Publication number: 20180096871
    Abstract: Methods and apparatus to minimize electromagnetic interference between adjacent process chambers of a cluster tool are described. The start time of the subject recipe is controlled based on the electromagnetic process window of the subject process chamber, the electromagnetic window of the first adjacent process chamber and of an optional second adjacent process chamber. The start time of the subject process chamber is controlled to prevent temporal overlap of the electromagnetic window of the subject chamber with the electromagnetic window of an adjacent chamber.
    Type: Application
    Filed: September 28, 2017
    Publication date: April 5, 2018
    Inventors: Fuhong Zhang, Sunil Kumar Garg, Paul Kiely, Martin Lee Riker, William Fruchterman, Zheng Wang, Xiaodong Wang
  • Publication number: 20180025895
    Abstract: A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.
    Type: Application
    Filed: October 11, 2016
    Publication date: January 25, 2018
    Inventors: Martin Lee RIKER, Keith A. MILLER, Shreekant GAYAKA, Carl R. JOHNSON
  • Patent number: D801942
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: November 7, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Yu Liu
  • Patent number: D837755
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: January 8, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Yu Liu
  • Patent number: D836572
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: December 25, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Xiaodong Wang
  • Patent number: D858468
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Lanlan Zhong, Fuhong Zhang, Zheng Wang
  • Patent number: D859333
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Lanlan Zhong, Fuhong Zhang, Zheng Wang
  • Patent number: D868124
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: November 26, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Zheng Wang
  • Patent number: D869409
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Fuhong Zhang, Xiaodong Wang