Patents by Inventor Martin Liu

Martin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF WAFER BONDING
    Publication number: 20100248414
    Abstract: Provided is a method of fabricating a semiconductor device. The method includes providing a device substrate having a front side, a back side, and a first edge portion, forming a material layer over a portion of the front side of the device substrate, trimming the first edge portion, removing the material layer, bonding the front side of the device substrate to a carrier substrate, thinning the device substrate from the back side, and trimming a second edge portion of the thinned device substrate.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Martin Liu, Alex Hsu, Chung-Yi Yu, Chia-Shiung Tsai
  • Method and Apparatus for Thinning a Substrate
    Publication number: 20100062611
    Abstract: Provided is a method for fabricating a semiconductor device that includes providing a semiconductor substrate having a front side and a backside, where active or passive devices are formed in the front side, rotating the semiconductor substrate, and etching the backside of the semiconductor substrate by introducing a first etchant while the substrate is rotated, the first etchant including an R—COOH.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming Chyi Liu, Yao Fei Chuang, Martin Liu, Gwo-Yuh Shiau, Chia-Shiung Tsai